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1. 发明公开

EP4245497A1 COMPRESSION MOLD, RESIN MOLDING DEVICE, RESIN MOLDING SYSTEM, AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT 审中-实审
公开(公告)号：EP4245497A1
公开(公告)日：2023-09-20
申请号：EP21891480.2
申请日：2021-09-10
申请人： Towa Corporation
发明人： YOSHIDA, Yusuke , ONISHI, Yohei
IPC分类号： B29C33/12 , B29C43/18 , B29C43/34 , B29C43/36
摘要： A compression mold (10) includes a first mold (110) and a second mold (120). The first mold (110) includes a side surface member (111) and a bottom surface member (112). The side surface member (111) includes a step height (113) on a bottom surface member (112) side of the side surface member (111). The step height (113) includes a first surface (111a) of the side surface member (111), a second surface (111b) that extends from the first surface (111a) toward the bottom surface member (112), and a third surface (111c) that extends downward from the second surface (111b). The bottom surface member (112) includes an upper surface (112a) where a resin material (202) can be arranged and a slide surface (112b) that extends downward from the upper surface (112a) and is slidable with respect to the third surface (111c) of the side surface member (111). The third surface (111c) of the side surface member (111) is not exposed while the resin material (202) is supplied.

2. 发明授权

EP3072660B1 RESIN SEALING APPARATUS AND RESIN SEALING METHOD 有权
公开(公告)号：EP3072660B1
公开(公告)日：2020-11-04
申请号：EP16161708.9
申请日：2016-03-22
申请人： Towa Corporation
发明人： ONISHI, Yohei , TAKA, Takeaki
IPC分类号： B29C43/02 , B29C33/42 , B29C43/56 , B29C45/26 , H01L21/56 , B29C43/18 , B29L31/34 , B29C43/36 , B29C43/50 , B29C33/44

3. 发明公开

EP3072660A1 RESIN SEALING APPARATUS AND RESIN SEALING METHOD 有权
标题翻译： KUNSTHARZVERSIEGELUNGSVORRICHTUNG UND VERSIEGELUNGSVERFAHREN
公开(公告)号：EP3072660A1
公开(公告)日：2016-09-28
申请号：EP16161708.9
申请日：2016-03-22
申请人： Towa Corporation
发明人： ONISHI, Yohei , TAKA, Takeaki
IPC分类号： B29C43/02 , B29C33/42 , B29C43/18 , B29L31/34 , B29C43/36 , B29C43/50 , B29C43/56 , B29C33/44
摘要： Resin sealing apparatus and method of sealing a substrate. A lower mold (18) facing an upper mold (13) has a bottom surface member (22) for a cavity and a side surface member (23) for the cavity. An upper end surface of the bottom surface member (22) forms an inner bottom surface of the cavity (24) and has a planar shape corresponding to an unusual planar shape of a sealing resin (R2). The side surface member (23) and the bottom surface member (22) can slide relatively. A substrate (19) is disposed on a mold surface of the upper mold (13) such that a component (19a) to be sealed attached to the substrate (19) faces downward, and the cavity (24) is filled with a fluid resin (R1). The upper mold (13) and the lower mold (18) are clamped, and the component (19a) to be sealed is immersed in the fluid resin (R1) filled into the cavity (24). Then, the bottom surface member (22) is raised, and the fluid resin (R1) within the cavity (24) is pressed at a prescribed resin pressure and cured to form the sealing resin (R2). The bottom surface member (22) and the side surface member (23) are moved relatively, and thereby, a molded product (M) having the sealing resin (R2) is released from a mold surface of the lower mold (18).
摘要翻译：树脂密封装置和密封基板的方法。面向上模具（13）的下模具（18）具有用于空腔的底表面构件（22）和用于空腔的侧表面构件（23）。底面构件（22）的上端面形成空腔（24）的内底面，并具有对应于密封树脂（R2）的异常平面形状的平面形状。侧面构件（23）和底面构件（22）能够相对滑动。将基板（19）设置在上模具（13）的模具表面上，使得被附着到基板（19）上的密封件（19a）面向下，并且空腔（24）填充有流体树脂（R1）。将上模13和下模18夹紧，待密封的部件（19a）浸入装入空腔（24）的流体树脂（R1）中。然后，使底面构件（22）升起，将空腔（24）内的流体树脂（R1）以规定的树脂压力按压并固化，形成密封树脂（R2）。底面部件（22）和侧面部件（23）相对移动，由此，具有密封树脂（R2）的成形体（M）从下模具（18）的模具表面脱离。

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