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    • 4. 发明公开
    • RESIN COMPOSITE, DENTAL MATERIAL, AND METHOD FOR MANUFACTURING RESIN COMPOSITE
    • HARZVERBUNDSTOFF,ZAHNMATERIAL UND VERFAHREN ZUR HERSTELLUNG EINES HARZVERBUNDSTOFFES
    • EP2799496A1
    • 2014-11-05
    • EP12856727.8
    • 2012-12-11
    • Tokuyama Dental Corporation
    • YAMAGAWA, Jun-ichiro
    • C08L101/00A61K6/08A61L27/00C08K9/06
    • A61K6/087A61L27/446A61L2430/02C08J3/20C08J2300/12C08K9/06C08L71/00A61K6/0023C08L33/04C08L101/12
    • Provided is a resin composite that is excellent in abrasion resistance and has high fracture energy as compared to a related-art resin composite. Specifically, provided are: a resin composite, which is produced using: 100 parts by mass of a resin having a melting point or fluidization temperature of from 200 to 500°C; and 40 to 400 parts by mass of inorganic particles surface-treated with a surface treatment agent having a reactive double bond group or an aromatic group at an end thereof, the resin composite having an average embedding rate, which is represented by the following equation (1), of 55% or more; a manufacturing method for the resin composite; and a dental material using the resin composite: ·Equation (1) Average embedding rate (%)=100×{EP/(EP+V)} (in the equation (1) : EP represents the number {particles/(10 µm×10 µm)} of the inorganic particles per square region measuring 10 µm on each side exposed in a polished surface of a test piece of the resin composite in a case where the polished surface is observed with an SEM; and V represents the number {voids/(10 µm×10 µm)} of voids per square region measuring 10 µm on each side formed through elimination of the inorganic particles in the square region measuring 10 µm on each side where the EP number is counted.
    • 提供与现有技术的树脂复合体相比,耐磨性优异,断裂能高的树脂复合体。 具体地说,提供了:使用100质量份熔点或流化温度为200〜500℃的树脂制造的树脂复合体; 和40〜400质量份用其末端具有反应性双键基团或芳香族基团的表面处理剂表面处理的无机粒子,所述树脂复合体的平均嵌入速度由下式( 1),55%以上; 树脂复合材料的制造方法; 使用该树脂复合体的牙科用材料:·式(1)平均嵌入率(%)= 100×{EP /(EP + V)}(式(1)中EP表示数量{粒子/(10μm ×10μm)},在用SEM观察抛光面的情况下,在树脂复合体的试验片的研磨面上露出的每侧面积为10μm的每平面区域的无机粒子的数量{ 空隙/(10μm×10μm)}每平方面的空隙,通过消除在计数EP数的每侧测量为10μm的方形区域中的无机颗粒而形成的每一侧上的10μm。