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1. 发明公开

EP3479475A1 MICROMECHANICAL RESONATOR AND METHOD FOR TRIMMING MICROMECHANICAL RESONATOR 审中-公开
公开(公告)号：EP3479475A1
公开(公告)日：2019-05-08
申请号：EP17746527.5
申请日：2017-06-29
申请人： Teknologian tutkimuskeskus VTT Oy
发明人： JAAKKOLA, Antti , PENSALA, Tuomas , OJA, Aarne , PEKKO, Panu , DEKKER, James R
IPC分类号： H03H9/02 , H03H9/24 , H03H3/007

2. 发明授权

EP3202035B1 TEMPERATURE COMPENSATED PLATE RESONATOR 有权
公开(公告)号：EP3202035B1
公开(公告)日：2019-04-10
申请号：EP15786990.0
申请日：2015-10-02
申请人： Teknologian Tutkimuskeskus VTT OY
发明人： JAAKKOLA, Antti , PEKKO, Panu , PRUNNILA, Mika , PENSALA, Tuomas
IPC分类号： H03H9/02 , H03H9/24

3. 发明公开

EP2569862A1 MICROELECTROMECHANICAL RESONATOR AND A METHOD FOR PRODUCING THE SAME 有权转让
标题翻译：微机电共振器及相应方法
公开(公告)号：EP2569862A1
公开(公告)日：2013-03-20
申请号：EP11722749.6
申请日：2011-05-05
申请人： Teknologian Tutkimuskeskus VTT
发明人： PENSALA, Tuomas , JAAKKOLA, Antti
IPC分类号： H03H3/007 , H03H9/24
CPC分类号： H03H3/0076 , H03H9/1057 , H03H9/2436 , H03H2009/02503 , H03H2009/2442
摘要： The invention relates to temperature compensated micro-electro-mechanical (MEMS) resonators (300) preferably made of silicon. Prior art MEMS resonators have a significant temperature coefficient of resonance frequency, whereby it is difficult to achieve a sufficiently good frequency stability. The inventive MEMS resonator has a resonance plate (310) which resonates in Lamé mode. The resonance plate is p+ doped material, such as silicon doped with boron, and the concentration of the p+ doping is such that the plate has a temperature coefficient of resonance frequency near to zero. The tensile stress and the second order temperature coefficient can further be reduced by doping the plate with germanium.

4. 发明授权

EP3202036B1 TEMPERATURE COMPENSATED BEAM RESONATOR 有权
公开(公告)号：EP3202036B1
公开(公告)日：2020-05-27
申请号：EP15780911.2
申请日：2015-10-02
申请人： Teknologian Tutkimuskeskus VTT OY
发明人： JAAKKOLA, Antti , PEKKO, Panu , PRUNNILA, Mika , PENSALA, Tuomas
IPC分类号： H03H9/24 , H03H9/02

5. 发明公开

EP3202036A1 TEMPERATURE COMPENSATED BEAM RESONATOR 有权
标题翻译：温度补偿光束谐振器
公开(公告)号：EP3202036A1
公开(公告)日：2017-08-09
申请号：EP15780911.2
申请日：2015-10-02
申请人： Teknologian Tutkimuskeskus VTT OY
发明人： JAAKKOLA, Antti , PEKKO, Panu , PRUNNILA, Mika , PENSALA, Tuomas
IPC分类号： H03H9/24 , H03H9/02
摘要： The invention provides a microelectromechanical resonator device comprising a support structure and a resonator manufactured on a (100) or (110) semiconductor wafer, wherein the resonator is suspended to the support structure and comprises at least one beam being doped to a doping concentration of 1.1*1020 cm−3 or more with an n-type doping agent and is being capable of resonating in a length-extensional, flexural resonance or torsional mode upon suitable actuation. In particular, the doping concentration and angle of the beam are chosen so as to simultaneously produce zero or close to zero second order TCF, and even more preferably zero or close to zero first and second order TCFs, for the resonator in said resonance mode, thus providing a temperature stable resonator.
摘要翻译：本发明提供了一种微机电谐振器装置，其包括支撑结构和在（100）或（110）半导体晶片上制造的谐振器，其中谐振器悬挂到支撑结构并且包括至少一个被掺杂到掺杂浓度为1.1 * 1020cm-3或更多，带有n型掺杂剂，并且在合适的致动时能够在长度延伸，弯曲共振或扭转模式下共振。特别地，选择光束的掺杂浓度和角度，以便在谐振模式中为谐振器同时产生零或接近零的二阶TCF，甚至更优选地零或接近零的一阶和二阶TCF，从而提供温度稳定的谐振器。

6. 发明授权

EP2603976B1 MICROMECHANICAL RESONATOR AND METHOD FOR MANUFACTURING THEREOF 有权
标题翻译：微机械谐振器及其制造方法
公开(公告)号：EP2603976B1
公开(公告)日：2014-07-23
申请号：EP11816145.4
申请日：2011-08-11
申请人： Teknologian tutkimuskeskus VTT
发明人： JAAKKOLA, Antti , PENSALA, Tuomas
IPC分类号： H03H9/02 , H03H9/24 , H03H3/013 , B81B3/00
CPC分类号： H03H9/19 , H03H3/013 , H03H9/02448 , H03H2009/02496 , H03H2009/02511 , H03H2009/02519 , H03H2009/2442 , Y10T29/41

7. 发明公开

EP2603976A1 MICROMECHANICAL RESONATOR AND METHOD FOR MANUFACTURING THEREOF 有权
标题翻译：微机械谐振器及其制造方法
公开(公告)号：EP2603976A1
公开(公告)日：2013-06-19
申请号：EP11816145.4
申请日：2011-08-11
申请人： Teknologian tutkimuskeskus VTT
发明人： JAAKKOLA, Antti , PENSALA, Tuomas
IPC分类号： H03H9/02 , H03H9/24 , H03H3/013 , B81B3/00
CPC分类号： H03H9/19 , H03H3/013 , H03H9/02448 , H03H2009/02496 , H03H2009/02511 , H03H2009/02519 , H03H2009/2442 , Y10T29/41
摘要： The invention relates to a temperature compensated micromechanical resonator and method of manufacturing thereof. The resonator comprises a resonator element comprising a semiconductor crystal structure, which is doped so as to reduce its temperature coefficient of frequency, transducer means for exciting to the resonator element a vibrational mode. According to the invention the crystal orientation and shape of the resonator element are chosen to allow for a shear mode having a saddle point to be excited to the resonator element, and said transducer means are adapted to excite said shear mode to the resonator element. Accurate micromechanical resonators with now temperature drift can be achieved by means of the invention.

8. 发明公开

EP2603975A1 MICROMECHANICAL RESONATOR ARRAY AND METHOD FOR MANUFACTURING THEREOF 有权转让
标题翻译：微机电谐振器阵列及其制造方法
公开(公告)号：EP2603975A1
公开(公告)日：2013-06-19
申请号：EP11816146.2
申请日：2011-08-11
申请人： Teknologian tutkimuskeskus VTT
发明人： JAAKKOLA, Antti , PENSALA, Tuomas , KIIHAMÄKI, Jyrki
IPC分类号： H03H3/007 , H03H9/24 , H03H9/02
CPC分类号： H03H3/0072 , H03H3/0076 , H03H9/02448 , H03H9/2463 , H03H9/505 , H03H2009/02385 , H03H2009/02503 , H03H2009/2442
摘要： The invention relates to a microelectromechanical resonator and a method of manufacturing thereof. The resonator comprises at least two resonator elements (10A, 10B) made from semiconductor material, the resonator elements being arranged laterally with respect to each other as an array, at least one transducer element (12) coupled to said resonator elements (10A, 10B) and capable of exciting a resonance mode to the resonator elements (10A,10B). According to the invention, said at least one transducer element (12) is a piezoelectric transducer element arranged laterally with respect to the at least two resonator elements (10A, 10B) between the at least two resonator elements (10A, 10B) and adapted to excite to the resonator elements (10A, 10B) as said resonance mode a resonance mode whose resonance frequency is dependent essentially only on the C44 elastic parameter of the elastic modulus of the material of the resonator elements. By means of the invention, electrostatic actuation and problems associated therewith can be avoided and accurate resonators can be manufactured.
摘要翻译：微机电谐振器及其制造方法技术领域本发明涉及微机电谐振器及其制造方法。所述谐振器包括由半导体材料制成的至少两个谐振器元件（10A，10B），所述谐振器元件作为阵列相对于彼此横向布置，至少一个换能器元件（12）耦合到所述谐振器元件（10A，10B ）并且能够将谐振模式激励至谐振器元件（10A，10B）。根据本发明，所述至少一个换能器元件（12）是在所述至少两个谐振器元件（10A，10B）之间相对于所述至少两个谐振器元件（10A，10B）侧向布置的压电换能器元件，并且适于作为所述谐振模式而激励谐振器元件（10A，10B）的谐振模式的谐振频率基本上仅取决于谐振器元件的材料的弹性模量的C44弹性参数。通过本发明，可以避免静电致动和与其相关的问题，并且可以制造精确的谐振器。

9. 发明授权

EP2676366B1 NOVEL MICROMECHANICAL DEVICES 有权转让
公开(公告)号：EP2676366B1
公开(公告)日：2020-12-02
申请号：EP12747759.4
申请日：2012-02-17
申请人： Teknologian tutkimuskeskus VTT Oy
发明人： PENSALA, Tuomas , JAAKKOLA, Antti , GANCHENKOVA, Maria , PRUNNILA, Mika , KIIHAMÄKI, Jyrki
IPC分类号： H03H9/02 , H03H3/007 , B81B3/00 , H03H9/24

10. 发明授权

EP3202034B1 TEMPERATURE COMPENSATED COMPOUND RESONATOR 有权
公开(公告)号：EP3202034B1
公开(公告)日：2020-05-06
申请号：EP15780912.0
申请日：2015-10-02
申请人： Teknologian Tutkimuskeskus VTT OY
发明人： JAAKKOLA, Antti , PEKKO, Panu , PRUNNILA, Mika , PENSALA, Tuomas
IPC分类号： H03H9/02

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