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    • 3. 发明公开
    • SUBSTRATE PROCESSING METHOD FOR SUPPORTING A CATALYST PARTICLE FOR PLATING PROCESS
    • ÜEN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN
    • EP2902529A1
    • 2015-08-05
    • EP13842687.9
    • 2013-09-27
    • Tanaka Kikinzoku Kogyo K.K.A School Corporation Kansai University
    • NAKAMURA, NoriakiTANIUCHI, JunichiKUBO, HitoshiOHSHIMA, YuusukeISHIKAWA, TomokoSHINGUBARA, ShosoINOUE, Fumihiro
    • C23C18/18
    • The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 Å or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.
    • 本发明提供了一种处理基板的方法,该基板用于在各种基板上的电路图形或TSV上支撑用于形成镀层的金属微粒,与常规方法相比,可进行进一步的微粉化处理,并形成稳定的电镀 层被启用。 本发明是一种处理基板的方法,该方法包括使基板与含有金属颗粒的胶体溶液接触,以便支撑用作在基板上形成镀层的催化剂的金属颗粒,其中 胶体溶液含有由Pd形成的并且具有0.6nm至4.0nm的粒径和(111)面的面对面尺寸为2.254或更大的金属颗粒。 当在该处理之前在基板的表面上形成诸如SAM的有机层时,可以增加Pd颗粒的结合力。
    • 8. 发明公开
    • PROCESS FOR PRODUCTION OF COLLOIDAL GOLD AND COLLOIDAL GOLD
    • VERFAHREN ZUR HERSTELLUNG VON KOLLOIDALEM GOLD
    • EP2027956A1
    • 2009-02-25
    • EP07744338.0
    • 2007-05-29
    • Tanaka Kikinzoku Kogyo K.K.
    • TANIUCHI, JunichiNAKAGAWA, HirofumiOKAMOTO, Koji
    • B22F9/24B01J13/00
    • B01J13/0043B22F1/0022B22F9/24B82Y30/00Y10S977/896
    • It is an object of the present invention to provide a method for producing gold colloid having a targeted particle size, a sharp particle size distribution and a uniform and perfect spherical shape. The present invention relates to a method for producing gold colloid including a nucleation step of forming nuclear colloidal particles by adding a first reducing agent to a first gold salt solution; and a growth step of growing nuclear colloid by adding a second gold salt and a second reducing agent to the solution of the nuclear colloidal particles, characterized in that the growth step is performed at least once; a citrate is used as the first reducing agent and an ascorbate is used as the second reducing agent; and the addition of the ascorbate in the growth step is performed simultaneously with addition of the second gold salt. According to the method for producing gold colloid of the present invention, gold colloid having a sharp particle size distribution and a uniform and perfect spherical shape can be obtained.
    • 本发明的目的是提供一种具有目标粒度,尖锐的粒度分布和均匀且完美的球形形状的金胶体的制造方法。 本发明涉及一种生产金胶体的方法,包括通过向第一金盐溶液中加入第一还原剂形成核胶体颗粒的成核步骤; 以及通过向核胶体粒子的溶液中添加第二金盐和第二还原剂来生长核胶体的生长步骤,其特征在于,所述生长步骤至少进行一次; 使用柠檬酸盐作为第一还原剂,使用抗坏血酸作为第二还原剂; 并且在添加第二金盐的同时进行生长步骤中的抗坏血酸盐的添加。 根据本发明的金胶体的制造方法,可以获得具有尖锐的粒度分布和均匀且完美的球形的金胶体。