会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明公开
    • Deposition processes
    • 沉积过程
    • EP0367466A3
    • 1991-07-24
    • EP89310869.6
    • 1989-10-23
    • THE GENERAL ELECTRIC COMPANY, p.l.c.
    • Haws, Stephen Anthony
    • G02F1/1335G03F7/00
    • G02F1/133516G02F1/133512
    • In a process for depositing a planarising material in spaces (5,6) between a pattern of regions (1,2,3), such as dye stripes or dots, on a substrate (4), the planarising material is deposited as a layer (7) over the pattern. The substrate is irradiated, from the reverse side, by a source (8) of radiation, such as UV, to which the pattern material is opaque and to which the planarising material is responsive such that it is rendered insoluble to a particular solvent. The radiation acts on only those parts (9-12) of the planarising material which are in the spaces. The remainder (13-15) of the planarising layer is then removed by use of the solvent. Alternatively, or additionally, an ITO or other UV transparent layer may be formed over the pattern and a layer of resist formed thereover. The radiation then passes through the spaces and acts on only the resist areas over the spaces to render them soluble. Those areas and the ITO layer beneath them are then removed by etching, leaving ITO areas accurately aligned with the pattern. The process may be used in the manufacture of LC displays or semiconductor devices.
    • 5. 发明公开
    • Deposition processes
    • Abscheidungsverfahren。
    • EP0367466A2
    • 1990-05-09
    • EP89310869.6
    • 1989-10-23
    • THE GENERAL ELECTRIC COMPANY, p.l.c.
    • Haws, Stephen Anthony
    • G02F1/1335G03F7/00
    • G02F1/133516G02F1/133512
    • In a process for depositing a planarising material in spaces (5,6) between a pattern of regions (1,2,3), such as dye stripes or dots, on a substrate (4), the planarising material is deposited as a layer (7) over the pattern. The substrate is irradiated, from the reverse side, by a source (8) of radiation, such as UV, to which the pattern material is opaque and to which the planarising material is responsive such that it is rendered insoluble to a particular solvent. The radiation acts on only those parts (9-12) of the planarising material which are in the spaces. The remainder (13-15) of the planarising layer is then removed by use of the solvent. Alternatively, or additionally, an ITO or other UV transparent layer may be formed over the pattern and a layer of resist formed thereover. The radiation then passes through the spaces and acts on only the resist areas over the spaces to render them soluble. Those areas and the ITO layer beneath them are then removed by etching, leaving ITO areas accurately aligned with the pattern. The process may be used in the manufacture of LC displays or semiconductor devices.
    • 在用于在基板(4)上的区域(1,2,3)(例如染色条纹或点)图案之间的空间(5,6)中沉积平纹材料的过程中,平面化材料被沉积为层 (7)在图案上。 衬底从反面通过诸如UV的辐射源(8)照射,图案材料不透明的区域,并且平面化材料对其起反应性,从而使其不溶于特定的溶剂。 辐射仅作用于空间中平面化材料的那些部分(9-12)。 然后通过使用溶剂除去平坦化层的剩余部分(13-15)。 或者或另外,可以在图案上方形成ITO或其它UV透明层,并在其上形成抗蚀剂层。 然后,辐射通过空间,仅作用在空间上的抗蚀剂区域上,使其变得可溶。 然后通过蚀刻去除那些区域和其下面的ITO层,留下ITO区域与图案精确对准。 该方法可用于LC显示器或半导体器件的制造。