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1. 发明公开

EP2211383A3 Metal bonded nanotube array 有权
标题翻译：金属键合的纳米管阵列
公开(公告)号：EP2211383A3
公开(公告)日：2015-04-29
申请号：EP10250120.2
申请日：2010-01-25
申请人： THE BOEING COMPANY
发明人： Barvosa-Carter, William B. , Gross, Adam F.
IPC分类号： H01L23/373 , H01L23/433 , H01L23/00
CPC分类号： H01L23/433 , H01L23/373 , H01L23/3736 , H01L24/29 , H01L24/31 , H01L2224/29109 , H01L2224/29111 , H01L2224/83101 , H01L2224/83825 , H01L2224/8383 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/1033 , H01L2924/14 , H01L2924/1423 , H01L2924/157 , Y10T428/12007 , H01L2924/01048 , H01L2924/01083 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： A method for bonding nano-elements to a surface is described. The method includes applying a layer of a first metal to a first end of a plurality of substantially aligned nano-elements, positioning a layer of a second metal adjacent to the layer of the first metal, placing a compressive force across the nano-elements, the metal layers, and the substrate, and elevating the temperature of the nano-elements, the metal layers, and a substrate adjacent the layer of the second metal such that the metal layers form at least one of a eutectic bond, a metal solid solution, and an alloy bond between the nano-elements and the substrate.

3. 发明公开

EP3276638A1 MICROWIRE ARRAY DEVICES AND METHODS FOR FABRICATING POLYMERIC SHEETS CONTAINING MICROWIRES 有权
标题翻译：微波阵列装置和用于制造含有微孔的聚合物片材的方法
公开(公告)号：EP3276638A1
公开(公告)日：2018-01-31
申请号：EP17170629.4
申请日：2017-05-11
申请人： The Boeing Company
发明人： Vajo, John J. , Cui, Shanying , Gross, Adam F.
IPC分类号： H01F1/00 , H05K9/00
CPC分类号： H05K9/0081 , H01F1/0072 , H05K9/009
摘要： A method for fabricating polymeric sheets containing microwires includes encapsulating at least a portion of individual lengths of a plurality of microwires in a non-conductive polymeric sheet while the microwires are attached to the substrate. The microwires are then detached from the substrate without removing the microwires from the polymeric sheet. The detaching step forms a separated polymeric sheet containing the detached microwires. Individual detached microwires of the plurality are approximately perpendicular to the separated polymeric sheet. A microwire array device includes a non-conductive polymeric sheet and a plurality of microwires. Individual microwires of the plurality have an independent length at least partially encapsulated by the polymeric sheet, are approximately perpendicular to the polymeric sheet, and contain magnetic ferrite.
摘要翻译：用于制造含有微丝的聚合物片材的方法包括在将微丝线附着到基材上的同时将至少一部分单独长度的多个微丝线封装在非导电聚合物片材中。然后将微丝从基底上分离而不从聚合物片上除去微丝。分离步骤形成含有分离的微丝的分离的聚合物片材。多个单独分离的微丝大致垂直于分离的聚合物片。微丝阵列装置包括非导电聚合物片材和多个微丝。多个单独的微丝具有独立的长度，至少部分地被聚合物片材包封，大致垂直于聚合物片材，并且包含磁性铁氧体。

4. 发明公开

EP2211383A2 Metal bonded nanotube array 有权
标题翻译：金属键合的纳米管阵列
公开(公告)号：EP2211383A2
公开(公告)日：2010-07-28
申请号：EP10250120.2
申请日：2010-01-25
申请人： THE BOEING COMPANY
发明人： Barvosa-Carter, William B. , Gross, Adam F.
IPC分类号： H01L23/373 , H01L23/433
CPC分类号： H01L23/433 , H01L23/373 , H01L23/3736 , H01L24/29 , H01L24/31 , H01L2224/29109 , H01L2224/29111 , H01L2224/83101 , H01L2224/83825 , H01L2224/8383 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/1033 , H01L2924/14 , H01L2924/1423 , H01L2924/157 , Y10T428/12007 , H01L2924/01048 , H01L2924/01083 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： A method for bonding nano-elements to a surface is described. The method includes applying a layer of a first metal to a first end of a plurality of substantially aligned nano-elements, positioning a layer of a second metal adjacent to the layer of the first metal, placing a compressive force across the nano-elements, the metal layers, and the substrate, and elevating the temperature of the nano-elements, the metal layers, and a substrate adjacent the layer of the second metal such that the metal layers form at least one of a eutectic bond, a metal solid solution, and an alloy bond between the nano-elements and the substrate.

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