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1. 发明授权

EP2918638B1 SILICONE RESIN COMPOSITION, CURED SILICONE RESIN, AND SEALED OPTICAL SEMICONDUCTOR ELEMENT 失效
标题翻译：有机硅树脂组合物，固化有机硅树脂和密封光学半导体元件
公开(公告)号：EP2918638B1
公开(公告)日：2017-09-06
申请号：EP13854153.7
申请日：2013-10-16
申请人： Sumitomo Seika Chemicals Co., Ltd.
发明人： FUKUDA Noriaki , SANADA Shohei , YAMAMOTO Katsumasa
IPC分类号： C08L83/07 , C08G77/388 , C08L83/05 , C08L83/08 , H01L23/29 , H01L23/31 , H01L33/56 , C08L83/04
CPC分类号： C08G77/26 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/388 , C08G2190/00 , C08K5/56 , C08L83/00 , C08L83/04 , C09J183/14 , H01L23/296 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a silicone resin composition having excellent adhesion. The present invention also aims to provide a cured silicone resin and a sealed optical semiconductor element each produced using the silicone resin composition. The present invention relates to a silicon resin composition comprising: a silicon resin mixture; and (B) a silicon compound, the silicon resin mixture containing (A-i) polyorganosiloxane that has at least two substituents each having a carbon-carbon double bond bonded to a silicon atom, (A-ii) polyorganohydrogen siloxane having at least two hydrogen groups each bonded to a silicon atom, and (A-iii) a hydrosilylation catalyst, the (B) silicone compound having a structural unit represented by Formula (1-3) and a structural unit represented by Formula (1-4) between a structural unit represented by Formula (1-1) and a structural unit represented by Formula (1-2): in Formula (1-1) and Formula (1-2), R 1a s each independently representing a C1-C18 hydrocarbon group selected from an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl group, in Formula (1-3) and Formula (1-4), R 1b s each independently representing a C1-C18 hydrocarbon group selected from an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl group, in Formula (1-3), R 2a representing a C1-C8 alkylene group in which a part of carbon atoms, except for the carbon atom bonded to a silicon atom, is optionally substituted with an oxygen atom, R 2b representing a C1-C3 alkylene group, R 3 representing a C1-C3 alkylene group, R 4 representing a hydrogen atom, a C1-C3 alkyl group, a C1-C3 alkyl group having an OH group, or a halogeno group, in Formula (1-3), m representing an integer of 1 to 50, x representing an integer of 0 to 2, and in Formula (1-4), n representing an integer of 10 to 1500.
摘要翻译：本发明提供具有优异粘合性的有机硅树脂组合物。本发明还旨在提供各自使用该有机硅树脂组合物制造的固化有机硅树脂和密封光学半导体元件。本发明涉及硅树脂组合物，其包含：硅树脂混合物; 和（B）硅化合物，所述硅树脂混合物包含具有至少两个各自具有键合到硅原子上的碳 - 碳双键的取代基的（Ai）聚有机硅氧烷，（A-ii）具有至少两个氢基团的聚有机氢硅氧烷（A-3）氢化硅烷化催化剂，所述（B）硅酮化合物具有式（1-3）所示的结构单元和式（1-4）所示的结构单元，（1-1）表示的结构单元和式（1-2）表示的结构单元：在式（1-1）和式（1-2）中，R 1a各自独立地表示选择的C1-C18烃基（1-3）和式（1-4）中，R 1b分别独立地表示选自烷基，芳基和芳烷基的碳原子数1〜18的烃基，，环烷基，芳基和芳烷基，在式（1-3）中，R 2a表示C 1 -C 8亚烷基 e基团，其中一部分碳原子除了与硅原子键合的碳原子任选被氧原子取代，R 2b表示C1-C3亚烷基，R 3表示C1-C3亚烷基，R 在式（1-3）中，R 4表示氢原子，C 1 -C 3烷基，具有OH基的C1-C3烷基或卤代基，m表示1至50的整数，x表示整数为0〜2，式（1-4）中，n表示10〜1500的整数。

2. 发明公开

EP3037482A1 ADDITION-CURED SILICONE RESIN COMPOSITION, CURING PRODUCT OF ADDITION-CURED SILICONE RESIN, AND OPTICAL SEMICONDUCTOR ELEMENT SEALING BODY 审中-公开
标题翻译：加成固化的硅树脂组合物，用于光学半导体元件的固化产物ADDITIONSGEHÄRTETEM硅树脂密封件和BODY
公开(公告)号：EP3037482A1
公开(公告)日：2016-06-29
申请号：EP14837392.1
申请日：2014-06-27
申请人： Sumitomo Seika Chemicals Co., Ltd.
发明人： FUKUDA Noriaki , SANADA Shohei , YAMAMOTO Katsumasa
IPC分类号： C08L83/07 , C08G77/388 , C08L83/05 , C08L83/08 , C09K3/10 , H01L23/29 , H01L23/31 , H01L33/56
CPC分类号： C09K3/1018 , C08G77/12 , C08G77/20 , C08G77/26 , C08G77/388 , C08L83/04 , C08L83/08 , C09D183/08 , C09J183/08 , C09K2003/1059 , H01L33/56 , C08L83/00
摘要： The present invention aims to provide an addition-curable silicone resin composition with excellent interfacial adhesion properties, storage stability, and transparency. The present invention also aims to provide an addition-curable silicone resin cured product formed from the addition-curable silicone resin composition and a sealed optical semiconductor element formed by using the addition-curable silicone resin composition. The present invention is an addition-curable silicone resin composition including: an addition-curable silicone resin mixture; and an adhesion-imparting agent, the addition-curable silicone resin mixture having a refractive index of 1.35 to 1.45, the adhesion-imparting agent including a compound that includes a structural unit represented by the formula (1-3) and/or a structural unit represented by the formula (1-4) between a structural unit represented by the formula (1-1) and a structural unit represented by the formula (1-2), the compound having a refractive index of 1.35 to 1.45:

wherein R 1a 's in the formulas (1-1) and (1-2) each independently represent a C1-C18 alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group; R 1b 's in the formulas (1-3) and (1-4) each independently represent a C1-C18 alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group; m in the formula (1-3) is an integer of 1 to 50; n in the formula (1-4) is an integer of 1 to 1500; and A's in the formulas (1-1) to (1-3) each independently represent a C1-C18 alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or a group represented by the formula (2), provided that at least one of A's in the formulas (1-1) to (1-3) is a group represented by the formula (2):

wherein R 2a represents a C1-C8 alkylene group in which a carbon atom other than a carbon atom bonded to a silicon atom is optionally partially substituted with an oxygen atom; R 2b 's each independently represent a C1-C3 alkylene group; R 3 's each independently represent a C1-C3 alkylene group; R 4 's each independently represent a hydrogen atom, a C1-C3 alkyl group, an OH group-containing C1-C3 alkyl group, or a halogeno group; and x is an integer of 0 to 2.
摘要翻译：本发明旨在提供到可加成固化的有机硅树脂组合物具有优异的界面粘合性，储存稳定性，和透明性。因此，本发明旨在提供从可加成固化的有机硅树脂组合物和通过使用加成固化型硅树脂组合物形成的密封的光学半导体元件形成的加成固化的有机硅树脂固化产物。本发明是包含可加成固化的硅酮树脂组合物：可加成固化的聚硅氧烷树脂混合物; 和粘接性赋予剂，具有1:35至1点45的折射率可加成固化的聚硅氧烷树脂混合物中，粘合性赋予剂包括化合物包括结构单元也由式（1-3）和/或结构代表单元由式（1-1）表示的结构单元和由式（1-2）中，具有1:35到一点45的折射率的化合物所表示的结构单元之间的式（1-4）表示： - [R worin 图1A的在式（1-1）和（1-2）分别独立地在表示C1-C18烷基，环烷基，芳基，或在芳烷基; [R 1b中的在式（1-3）和（1-4）分别独立地在表示C1-C18烷基，环烷基，芳基，或在芳烷基; 米的式（1-3）中为1〜50的整数; 式中的n（1-4）是1〜1500的整数; 和A在式（1-1）〜（1-3）各自独立地表示C1-C18烷基，环烷基，在芳烷基的芳基，或由式（2）表示的基团，条件的确在式（1-1）至（1-3）A的中的至少一个是由式（2）表示的基团： - [R worin 2A darstellt的C1-C8亚烷基基团，其中除碳以外的碳原子原子键合到硅原子被任选地部分与氧原子substituiertem; [R 2b中的每一个独立地表示C1-C3亚烷基; R 3“各自独立地表示C1-C3亚烷基; R 4各自独立地表示氢原子，C1-C3烷基，含OH基的C1-C3烷基，或卤代烷基; 和x是0至第二的整数

3. 发明公开

EP2918638A1 SILICONE RESIN COMPOSITION, CURED SILICONE RESIN, AND SEALED OPTICAL SEMICONDUCTOR ELEMENT 失效
标题翻译： SILIKONHARZZUSAMMENSETZUNG，GEHÄRTETESSILIKONHARZ UND ABGEDICHTETES OPTISCHES HALBLEITERELEMENT
公开(公告)号：EP2918638A1
公开(公告)日：2015-09-16
申请号：EP13854153.7
申请日：2013-10-16
申请人： Sumitomo Seika Chemicals Co., Ltd.
发明人： FUKUDA Noriaki , SANADA Shohei , YAMAMOTO Katsumasa
IPC分类号： C08L83/07 , C08G77/388 , C08L83/05 , C08L83/08 , H01L23/29 , H01L23/31 , H01L33/56
CPC分类号： C08G77/26 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/388 , C08G2190/00 , C08K5/56 , C08L83/00 , C08L83/04 , C09J183/14 , H01L23/296 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a silicone resin composition having excellent adhesion. The present invention also aims to provide a cured silicone resin and a sealed optical semiconductor element each produced using the silicone resin composition. The present invention relates to a silicon resin composition comprising: a silicon resin mixture; and (B) a silicon compound, the silicon resin mixture containing (A-i) polyorganosiloxane that has at least two substituents each having a carbon-carbon double bond bonded to a silicon atom, (A-ii) polyorganohydrogen siloxane having at least two hydrogen groups each bonded to a silicon atom, and (A-iii) a hydrosilylation catalyst, the (B) silicone compound having a structural unit represented by Formula (1-3) and a structural unit represented by Formula (1-4) between a structural unit represented by Formula (1-1) and a structural unit represented by Formula (1-2):

in Formula (1-1) and Formula (1-2), R 1a s each independently representing a C1-C18 hydrocarbon group selected from an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl group, in Formula (1-3) and Formula (1-4), R 1b s each independently representing a C1-C18 hydrocarbon group selected from an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl group, in Formula (1-3), R 2a representing a C1-C8 alkylene group in which a part of carbon atoms, except for the carbon atom bonded to a silicon atom, is optionally substituted with an oxygen atom, R 2b representing a C1-C3 alkylene group, R 3 representing a C1-C3 alkylene group, R 4 representing a hydrogen atom, a C1-C3 alkyl group, a C1-C3 alkyl group having an OH group, or a halogeno group, in Formula (1-3), m representing an integer of 1 to 50, x representing an integer of 0 to 2, and in Formula (1-4), n representing an integer of 10 to 1500.
摘要翻译：本发明提供具有优异粘合性的有机硅树脂组合物。本发明的目的还在于提供使用有机硅树脂组合物制造的固化的硅树脂和密封的光学半导体元件。硅树脂组合物本发明涉及一种硅树脂组合物，其包括：硅树脂混合物; 和（B）硅化合物，含有至少两个具有与硅原子键合的碳 - 碳双键的取代基的（A 1）聚有机硅氧烷的硅树脂混合物，（A-ii）具有至少两个氢原子的聚有机氢硅氧烷各自与硅原子键合，和（A-iii）氢化硅烷化催化剂，（B）具有由式（1-3）表示的结构单元的硅氧烷化合物和由式（1-4）表示的结构单元，其结构由式（1-1）表示的单元和由式（1-2）表示的结构单元：在式（1-1）和式（1-2）中，R 1a各自独立地表示选自C 1 -C 18烃基从式（1-3）和式（1-4）中的烷基，环烷基，芳基和芳烷基，R 1b各自独立地表示选自烷基的C 1 -C 18烃基，式（1-3）中的环烷基，芳基和芳烷基，R 2a表示C1-C8亚烷基除了与硅原子键合的碳原子以外的一部分碳原子任选被氧原子取代的C 1 -C 1基团，表示C1-C3亚烷基的R 2b，表示C1-C3亚烷基的R 3，R 4表示氢原子，C1-C3烷基，具有OH基的C1-C3烷基或卤代基，式（1-3）中，m表示1〜50的整数，x表示整数 0〜2，在式（1-4）中，n表示10〜1500的整数。

4. 发明公开

EP3037481A1 CONDENSATION-CURABLE SILICONE RESIN COMPOSITION, CURED PRODUCT OF CONDENSATION-CURABLE SILICONE RESIN, AND OPTICAL SEMICONDUCTOR ELEMENT SEALING BODY 有权
标题翻译：通过缩合固化的有机硅树脂组合物，硬化产物OFF通过缩合固化的硅酮树脂和密封元件的光学半导体元件
公开(公告)号：EP3037481A1
公开(公告)日：2016-06-29
申请号：EP14838451.4
申请日：2014-05-26
申请人： Sumitomo Seika Chemicals Co., Ltd.
发明人： FUKUDA Noriaki , YAMAMOTO Katsumasa
IPC分类号： C08L83/06 , C08G77/388 , C08L83/08 , H01L23/29 , H01L23/31
CPC分类号： C08G77/26 , C08G77/16 , C08G77/388 , C08L83/04 , C09J183/08 , H01L33/56 , C08L83/00
摘要： The present invention aims to provide a condensation-curable silicone resin composition with excellent adhesion properties. The present invention also aims to provide a condensation-curable silicone resin cured product formed from the condensation-curable silicone resin composition and a sealed optical semiconductor element formed by using the condensation-curable silicone resin composition. The present invention is a condensation-curable silicone resin composition including: a condensation-curable silicone resin mixture; and an adhesion-imparting agent, the adhesion-imparting agent including a compound that includes a structural unit represented by the formula (1-3) and/or a structural unit represented by the formula (1-4) between a structural unit represented by the formula (1-1) and a structural unit represented by the formula (1-2):

wherein R 1a 's in the formulas (1-1) and (1-2) each independently represent a C1-C18 alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group; R 1b 's in the formulas (1-3) and (1-4) each independently represent a C1-C18 alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group; m in the formula (1-3) is an integer of 1 to 50; n in the formula (1-4) is an integer of 1 to 1500; and A's in the formulas (1-1) to (1-3) each independently represent a C1-C18 alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or a group represented by the formula (2), provided that at least one of A's in the formulas (1-1) to (1-3) is a group represented by the formula (2):

wherein R 2a represents a C1-C8 alkylene group in which a carbon atom other than a carbon atom bonded to a silicon atom is optionally partially substituted with an oxygen atom; R 2b 's each independently represent a C1-C3 alkylene group; R 3 's each independently represent a C1-C3 alkylene group; R 4 's each independently represent a hydrogen atom, a C1-C3 alkyl group, an OH group-containing C1-C3 alkyl group, or a halogeno group; and x is an integer of 0 to 2.
摘要翻译：本发明旨在提供可缩合固化的有机硅树脂组合物具有优良的粘附性能。因此，本发明目的在于提供从可缩合固化的有机硅树脂组合物和通过使用所述可缩合固化的有机硅树脂组合物形成的密封的光学半导体元件而形成的缩合固化的有机硅树脂固化产物。本发明是包括可缩合固化的有机硅树脂组合物：可缩合固化的有机硅树脂的混合物; 和粘合赋予剂，粘合性赋予剂包括化合物做了包括由表示的结构单元之间的由式（1-3）和/或由式（1-4）所示的结构单元表示的结构单元式（1-1）和由下式表示的结构单元（1-2）：worin，R 1A的在式（1-1）和（1-2）各自独立地表示C1-C18烷基，的环烷基，在，或在芳烷基的芳基; [R 1b中的在式（1-3）和（1-4）分别独立地在表示C1-C18烷基，环烷基，芳基，或在芳烷基; 米的式（1-3）中为1〜50的整数; 式中的n（1-4）是1〜1500的整数; 和A在式（1-1）〜（1-3）各自独立地表示C1-C18烷基，环烷基，在芳烷基的芳基，或由式（2）表示的基团，条件的确在式（1-1）至（1-3）A的中的至少一个是由式（2）表示的基团： - [R worin 2A darstellt的C1-C8亚烷基基团，其中除碳以外的碳原子原子键合到硅原子被任选地部分与氧原子substituiertem; [R 2b中的每一个独立地表示C1-C3亚烷基; R 3“各自独立地表示C1-C3亚烷基; R 4各自独立地表示氢原子，C1-C3烷基，含OH基的C1-C3烷基，或卤代烷基; 和x是0至第二的整数

5. 发明公开

EP3940005A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF 有权
公开(公告)号：EP3940005A1
公开(公告)日：2022-01-19
申请号：EP20772690.2
申请日：2020-01-21
申请人： Sumitomo Seika Chemicals Co., Ltd.
发明人： MASUHARA Yusaku , ASABA Takuro , YAMAMOTO Katsumasa
IPC分类号： C08F28/04
摘要： An aspect of the present invention provides a curable resin composition containing (A) a vinyl sulfide compound represented by general formula (1) and (B) an isocyanate compound having an isocyanate group.

In formula (1), R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , R 15 , and R 16 may be the same or different from one another, and represent a hydrogen atom, a halogen atom, or an alkyl group having 1 to 6 carbon atoms, and n represents an integer of 0 to 10.

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