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1. 发明公开

EP1731276A1 METHOD AND DEVICE FOR CUTTING ADHESIVE FILM 审中-公开
标题翻译： VERFAHREN UND VORRICHTUNG ZUM SCHNEIDEN VON KLEBEFOLIE
公开(公告)号：EP1731276A1
公开(公告)日：2006-12-13
申请号：EP05727639.6
申请日：2005-04-01
申请人： Sony Chemical & Information Device Corporation
发明人： KAWAI, Tomohisa, c/o Sony Chemical & Information
IPC分类号： B26D7/10 , B26D1/24
CPC分类号： B26D7/10 , B26D1/245 , Y10T83/04 , Y10T83/6489 , Y10T156/1052 , Y10T156/1059 , Y10T156/1084 , Y10T156/12 , Y10T156/1365 , Y10T156/16
摘要： A device for ideal cutting of an adhesive film mother sheet which prevents displacement or peeling of a cover film, etc. on an adhesive layer when the adhesive film mother sheet deforms as a result of shearing forces that act during cutting. The cutting device 1 cuts the adhesive film mother sheet 2 into strips while performing conveyance thereof and includes a cutter mechanism 10 and heating mechanism (means) 3. The cutter mechanism 10 may includes an upper blade unit 11A wherein a plurality of upper blades 11 are arranged axially and a lower blade unit 12A wherein a plurality of lower blades 12 are arranged axially. The heating mechanism 3 is disposed upstream of the cutter mechanism 10 and may includes a blower 31, a heater 32, a temperature sensor 33, and a temperature control unit 34. The blower 31 may be connected to the heater 32 via a duct 35 and be disposed so as to blow heated air onto the adhesive film mother sheet 2.
摘要翻译：一种用于理想地切割粘合膜母片的装置，当粘合剂膜母片由于在切割期间作用的剪切力而变形时，防止粘合剂层上的覆盖膜等的移位或剥离。切割装置1在执行传送的同时将粘合膜母片2切割成条，并且包括切割机构10和加热机构（装置）3。切割机构10可以包括上刀片单元11A，其中多个上刀片11是轴向布置的下刀片单元12A，其中多个下刀片12轴向布置。加热机构3设置在切割机构10的上游，并且可以包括鼓风机31，加热器32，温度传感器33和温度控制单元34.鼓风机31可以经由管道35连接到加热器32，被设置成将热空气吹送到粘合膜母片2上。

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