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    • 1. 发明公开
    • Device for splitting substrat with obstacle detection means
    • Substrataufteilungsvorrichtung mit Detektion von Hindernissen
    • EP2527121A1
    • 2012-11-28
    • EP12169138.0
    • 2012-05-23
    • Soitec
    • Besnard, Teddy
    • B28D5/00H01L21/67
    • B28D5/0005B28D5/0064B60L2200/26H01L21/67092H01L21/67313Y10T225/30
    • The invention relates to a device (1) for splitting a substrate (2), said substrate comprising two adjoining wafers defining between them a cleavage plane, said device comprising
      - a base (11),
      - means (12) for splitting substrate wafers,
      - means for performing controlled displacement of some substrate wafers (2) comprising at least one pusher (5) mobile relative to the base (11) of the device (1) comprising handling means for substrates, said handling means being adapted to accommodate substrates in a reception space of substrates (2) on the pusher (5),

      said pusher (5) being capable of displacing substrates (2) arranged in a support (8), the device comprising detection means (9) adapted to determine the absence or the presence of obstacles inside at least one region of the reception space of the pusher (5) when the pusher (5) is in a detection position, said region being located near the handling means for substrates.
    • 本发明涉及一种用于分离衬底(2)的器件(1),所述衬底包括两个邻接的晶片,在它们之间限定了解理平面,所述器件包括 - 基底(11), - 用于分离衬底晶片的装置(12) - 用于执行包括相对于所述装置(1)的基部(11)移动的至少一个推动器(5)的一些衬底晶片(2)的受控位移的装置,包括用于衬底的处理装置,所述处理装置适于容纳衬底 在推动器(5)上的基板(2)的接收空间,所述推动器(5)能够移位布置在支撑件(8)中的基板(2),该装置包括检测装置(9),其适于确定不存在或不存在 当推动器(5)处于检测位置时,在推动器(5)的接收空间的至少一个区域内存在障碍物,所述区域位于基板的处理装置附近。