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1. 发明授权

EP2182019B1 HEAT CURABLE RESIN COMPOSITON 有权转让
标题翻译：热固性树脂复合材料
公开(公告)号：EP2182019B1
公开(公告)日：2018-02-21
申请号：EP08778087.0
申请日：2008-07-11
申请人： Showa Denko K.K.
发明人： UMEZAWA, Tomokazu , WADA, Tetsuo , INOUE, Hirofumi
IPC分类号： C08G59/42 , H01L21/60 , H01L23/29 , H01L23/31 , H05K3/28
CPC分类号： H05K3/285 , C08G59/4246 , H01L23/293 , H01L2924/0002 , H05K2203/124 , Y10T428/31551 , Y10T428/31605 , Y10T428/31609 , H01L2924/00
摘要： The thermosetting resin composition according to the present invention comprises a resin (A) containing two or more carboxyl groups and having a polyurethane structure, a strongly basic nitrogen-containing heterocyclic compound having pKa of 10.0 to 14.0 as a curing accelerator (B) and a curing agent (C). A cured product of the thermosetting resin composition is used as an insulating protective film for printed wiring boards, flexible printed wiring boards, chip-on-films, etc. The thermosetting resin composition of the invention has improved low-temperature curability and instantaneous curability, can realize tack-free property, can simultaneously realize low warpage property and electrical insulation property, does not contaminate a curing oven and the like by outgassing during heating, has a sufficient pot life, can form excellent cured products and insulating protective films, and can form solder resists and insulating protective films at low cost with good productivity. Further, by utilizing this composition, electronic parts to which excellent properties have been imparted can be supplied.

2. 发明公开

EP1991618A1 THERMOSETTING RESIN COMPOSITION AND USES THEREOF 审中-公开
标题翻译：热固性树脂组合物，及使用
公开(公告)号：EP1991618A1
公开(公告)日：2008-11-19
申请号：EP07715330.2
申请日：2007-03-08
申请人： Showa Denko K.K.
发明人： UCHIDA, Hiroshi , UMEZAWA, Tomokazu
IPC分类号： C08L75/04 , C08G18/08 , C08G18/44 , C08G18/69 , C08G18/75 , C08G59/42
CPC分类号： C08G18/758 , C08G18/0823 , C08G18/44 , C08G18/6576 , C08G18/6659 , C08G59/4269 , C08K3/016 , C08K5/5313 , C08L63/00 , C08L75/04 , H05K3/285 , H05K2201/012 , H05K2201/0212 , C08L2666/14 , C08L2666/22
摘要： The thermosetting resin composition and the solder resist ink according to the present invention are characterized by comprising: a thermosetting resin (A) comprising (A1) a compound containing an acid anhydride group and/or a carboxyl group and (A2) a compound having a functional group which reacts with (A1) described above and an organic filler (B) containing a phosphorus atom, wherein the organic filler (B) containing a phosphorus atom has an average particle diameter of 50 Êm or less. According to the present invention, capable of being provided at a low cost and a good productivity are an excellent thermosetting resin composition and solder resist ink capable of forming a cured material which achieves an adhesion to a substrate, a low warping property, a flexibility, a plating resistance, a solder heat resistance and a long term reliability as well as a flame retardancy, and a cured material and a protective film which are excellent in the above characteristics. Further, electronic parts having a protective film which is excellent in a flame retardancy and which has a high reliability can be provided.

3. 发明公开

EP2182019A1 HEAT CURABLE RESIN COMPOSITON 有权转让
标题翻译： WÄRMEHÄRTENDEHARZZUSAMMENSETZUNG
公开(公告)号：EP2182019A1
公开(公告)日：2010-05-05
申请号：EP08778087.0
申请日：2008-07-11
申请人： Showa Denko K.K.
发明人： UMEZAWA, Tomokazu , WADA, Tetsuo , INOUE, Hirofumi
IPC分类号： C08G59/42 , H01L21/60 , H01L23/29 , H01L23/31 , H05K3/28
CPC分类号： H05K3/285 , C08G59/4246 , H01L23/293 , H01L2924/0002 , H05K2203/124 , Y10T428/31551 , Y10T428/31605 , Y10T428/31609 , H01L2924/00
摘要： The thermosetting resin composition according to the present invention comprises a resin (A) containing two or more carboxyl groups and having a polyurethane structure, a strongly basic nitrogen-containing heterocyclic compound having pKa of 10.0 to 14.0 as a curing accelerator (B) and a curing agent (C). A cured product of the thermosetting resin composition is used as an insulating protective film for printed wiring boards, flexible printed wiring boards, chip-on-films, etc. The thermosetting resin composition of the invention has improved low-temperature curability and instantaneous curability, can realize tack-free property, can simultaneously realize low warpage property and electrical insulation property, does not contaminate a curing oven and the like by outgassing during heating, has a sufficient pot life, can form excellent cured products and insulating protective films, and can form solder resists and insulating protective films at low cost with good productivity. Further, by utilizing this composition, electronic parts to which excellent properties have been imparted can be supplied.
摘要翻译：根据本发明的热固性树脂组合物包含含有两个或更多个羧基并具有聚氨酯结构的树脂（A），作为固化促进剂（B）的pKa为10.0〜14.0的强碱性含氮杂环化合物和固化剂（C）。热固性树脂组合物的固化物用作印刷线路板，柔性印刷电路板，片上胶片等的绝缘保护膜。本发明的热固性树脂组合物具有改善的低温固化性和瞬时固化性，可实现无粘性，可同时实现低翘曲性和电绝缘性，加热时除气不会污染固化炉等，具有足够的使用期限，可形成优良的固化产物和绝缘保护膜，并可以低成本形成阻焊和绝缘保护膜，生产率高。此外，通过利用该组合物，可以提供赋予了优异性能的电子部件。

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