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1. 发明公开

EP3235588A1 SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENT 审中-公开
标题翻译：用于电镀和电子元件的焊锡合金
公开(公告)号：EP3235588A1
公开(公告)日：2017-10-25
申请号：EP15869874.6
申请日：2015-12-09
申请人： Senju Metal Industry Co., Ltd , DDK Ltd.
发明人： TSURUTA Kaichi , MUNEKATA Osamu , IWAMOTO Hiroyuki , IKEDA Atsushi , MORIUCHI Hiroyuki , KAYAMA Shinichi , TADOKORO Yoshihiro
IPC分类号： B23K35/26 , C22C13/00 , H05K3/32 , H05K3/34 , H05K1/11
摘要： The present invention addresses the problem of providing a solder alloy for plating and an electronic component, which are capable of suppressing the formation of external stress-type whiskers. This solder alloy for plating contains Sn and Ni, with the Ni content being 0.06-5.0 mass% inclusive and the remainder comprising Sn, and is used in electrical contacts that are electrically connected through mechanical joining.
摘要翻译：本发明解决了提供能够抑制外部应力型晶须的形成的电镀用焊料合金和电子部件的问题。该镀敷用焊料合金含有Sn和Ni，其中，Ni含量为0.06〜5.0质量％，余量由Sn构成，用于通过机械接合而电连接的电接点。

2. 发明授权

EP3235588B1 SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENT 有权
公开(公告)号：EP3235588B1
公开(公告)日：2019-11-06
申请号：EP15869874.6
申请日：2015-12-09
申请人： Senju Metal Industry Co., Ltd , DDK Ltd.
发明人： TSURUTA Kaichi , MUNEKATA Osamu , IWAMOTO Hiroyuki , IKEDA Atsushi , MORIUCHI Hiroyuki , KAYAMA Shinichi , TADOKORO Yoshihiro
IPC分类号： B23K35/26 , C22C13/00 , C23C30/00 , C23C2/04 , C23C2/08 , H05K1/11 , B23K101/36

3. 发明公开

EP3513900A1 SOLDER ALLOY FOR BONDING CU PIPES AND/OR FE PIPES, PREFORM SOLDER, RESIN FLUX CORED SOLDER, AND SOLDER JOINT 审中-公开
公开(公告)号：EP3513900A1
公开(公告)日：2019-07-24
申请号：EP18857692.0
申请日：2018-06-07
申请人： Senju Metal Industry Co., Ltd
发明人： KAMEDA Naoto , MUNEKATA Osamu , TSURUTA Kaichi , SATO Isamu
IPC分类号： B23K35/26 , B23K35/14 , C22C13/00 , C22C13/02
摘要： Provided is a solder alloy, with which long term joining reliability of a metallic pipe can be ensured by preventing growth of an intermetallic compound layer at the joint interface during low-temperature joining of the metallic pipe. The solder of the present invention includes an alloy composition consisting of, in mass%: Sb: 5.0% to 15.0%; Cu: 0.5% to 8.0%; Ni: 0.025% to 0.7%; Co: 0.025% to 0.3%; and balance Sn.

4. 发明公开

EP2398305A1 SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET 有权
标题翻译： LÖTHÖCKERHERSTELLUNG在电路板的转印膜，
公开(公告)号：EP2398305A1
公开(公告)日：2011-12-21
申请号：EP10741308.0
申请日：2010-02-15
申请人： Senju Metal Industry Co., Ltd
发明人： KURAMOTO Takeo , TSURUTA Kaichi , SAITOU Takeo
IPC分类号： H05K3/34 , B23K1/20 , B23K3/06 , H01L21/60
CPC分类号： B23K1/0016 , B23K3/0638 , B23K35/262 , C22F1/00 , H01L21/4853 , H01L21/6835 , H01L2224/11003 , H01L2224/11332 , H01L2224/115 , H01L2224/131 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/19041 , H05K3/3478 , H05K3/3484 , H05K2203/0338 , H05K2203/0405 , H05K2203/041 , H05K2203/0415 , H05K2203/0425 , Y10T428/12736 , Y10T428/265 , Y10T428/31678 , H01L2224/29099
摘要： A method of forming solder bumps on electrodes of a circuit board without producing bridging using a solder transfer sheet which does not require alignment includes superposing a circuit board and a solder transfer sheet having a solder layer adhered to at least one side of a supporting substrate, performing heating under pressure to a temperature lower than the solidus temperature of the solder to selectively perform solid phase diffusion bonding of the solder layer to electrodes, and peeling the transfer sheet from the circuit board. The solder layer is in the form of a continuous solder coating or in the form of a monoparticle layer of solder particles which are adhered to the supporting substrate by an adhesive layer.

6. 发明公开

EP3281739A1 FLUX COATING DEVICE AND SOLDER 有权
标题翻译：助焊剂涂层装置和焊剂
公开(公告)号：EP3281739A1
公开(公告)日：2018-02-14
申请号：EP15887510.4
申请日：2015-03-30
申请人： Senju Metal Industry Co., Ltd
发明人： MURAOKA Manabu , SAITOH Takeo , SEKINE Shigeyuki , OBAYASHI Takashi , TSURUTA Kaichi , HAGIWARA Takashi , YAMASAKI Hiroyuki , KIKUCHI Kota , KAMEDA Naoto
IPC分类号： B23K35/40 , B23K35/14
CPC分类号： B23K35/0238 , B05C3/125 , B05C9/12 , B05C9/14 , B23K3/082 , B23K3/085 , B23K35/0233 , B23K35/40 , B23K35/404
摘要： A flux applying device for applying flux to a surface of solder, wherein the flux applying device comprises: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means, when a side into which the solder enters is set to be the upstream side and a side out of which the solder is discharged is set to be a downstream side; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means, the solder to which the flux is applied by the dipping means being pulled up vertically in relation to a liquid surface of the flux; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.
摘要翻译： 1。一种用于将焊剂施加到焊料表面的焊剂施加装置，其中焊剂施加装置包括：浸渍装置，其通过将焊剂浸入焊剂中而将焊剂施加到焊料的表面; 负载施加单元，其对所述焊料施加规定的负载，所述负载施加单元设置在所述浸渍单元的上游侧，在将所述焊料进入的一侧设定为所述上游侧时，将所述负载施加单元焊料放电被设定为下游侧; 等速传送装置，其在负载施加装置的负载下以预定速度传送焊料，通过浸渍装置施加焊剂的焊料相对于焊剂的液面垂直地被拉起; 干燥装置，用于干燥施加焊剂的焊料; 冷却装置，其冷却干燥的焊料; 传送速度测量装置，其测量焊料的传送速度; 以及控制焊料输送速度的控制装置。

7. 发明授权

EP2587505B1 ELECTRODE FOR ELECTRIC STORAGE DEVICE, METHOD FOR MANUFACTURING THE ELECTRODE, AND METHOD FOR CONNECTING THE ELECTRODE 有权
标题翻译：用于电存储装置的电极，制造电极的方法以及用于连接电极的方法
公开(公告)号：EP2587505B1
公开(公告)日：2017-07-26
申请号：EP11798012.8
申请日：2011-06-14
申请人： Senju Metal Industry Co., Ltd
发明人： NAKAMURA Katsuji , TSURUTA Kaichi , OZAKI Yuji , WATARAI Shigeaki , TAKAGI Hidenori , OHORI Yutaka
IPC分类号： C25D3/12 , C25D3/22 , C25D3/30 , C25D5/12 , C25D5/44 , C23C18/16 , C23C18/18 , C23C18/36 , C23C18/52 , C23C18/54 , H01G11/24 , H01G11/66 , H01B1/02 , H01M2/20 , H01M2/30 , H01G11/06 , H01G11/30 , H01G11/50 , H01M2/26 , H01M4/02
CPC分类号： H01G11/50 , C23C18/1651 , C23C18/1653 , C23C18/1827 , C23C18/31 , C23C18/32 , C23C18/36 , C23C18/48 , C23C18/52 , C23C18/54 , C25D3/12 , C25D3/22 , C25D3/30 , C25D3/565 , C25D3/60 , C25D5/12 , C25D5/44 , H01B1/023 , H01B13/32 , H01G11/06 , H01G11/24 , H01G11/30 , H01G11/66 , H01M2/202 , H01M2/26 , H01M2/30 , H01M2004/028 , Y02E60/13

8. 发明公开

EP2587505A1 ELECTRODE FOR ELECTRIC STORAGE DEVICE, METHOD FOR MANUFACTURING THE ELECTRODE, AND METHOD FOR CONNECTING THE ELECTRODE 有权
标题翻译：电极上对电记忆，方法生产电极和方法将电极导管连接
公开(公告)号：EP2587505A1
公开(公告)日：2013-05-01
申请号：EP11798012.8
申请日：2011-06-14
申请人： Senju Metal Industry Co., Ltd
发明人： NAKAMURA Katsuji , TSURUTA Kaichi , OZAKI Yuji , WATARAI Shigeaki , TAKAGI Hidenori , OHORI Yutaka
IPC分类号： H01G9/058 , C23C18/31 , C25D7/00 , H01M2/20 , H01M2/26 , H01M2/30
CPC分类号： H01G11/50 , C23C18/1651 , C23C18/1653 , C23C18/1827 , C23C18/31 , C23C18/32 , C23C18/36 , C23C18/48 , C23C18/52 , C23C18/54 , C25D3/12 , C25D3/22 , C25D3/30 , C25D3/565 , C25D3/60 , C25D5/12 , C25D5/44 , H01B1/023 , H01B13/32 , H01G11/06 , H01G11/24 , H01G11/30 , H01G11/66 , H01M2/202 , H01M2/26 , H01M2/30 , H01M2004/028 , Y02E60/13
摘要： To increase a ground contact area in comparison with the conventional jointing by the spot-welding or the conventional fastening by a bolt so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop of the voltage.
Zn layer 21 or Zn alloy layer, Ni layer 22, and Sn layer 23 or Sn alloy layer are formed on a connecting terminal part 10a of a positive electrode composed of Al by plating. Accordingly, this can solder Cu negative electrode, which is composed of metal that is different species from Al, through Sn layer 23 or Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. Further, since the ground contact area is increased in comparison with the conventional jointing by the spot-welding or the conventional fastening by a bolt so that the resistance value at the contacting point is reduced, the voltage drop of the energy storage device by contact resistance can be reduced.

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