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1. 发明公开

EP3950983A1 RESIN COMPOSITION FOR SOLDERING USE, SOLDER COMPOSITION, FLUX CORED SOLDER, FLUX, AND SOLDER PASTE 审中-公开
公开(公告)号：EP3950983A1
公开(公告)日：2022-02-09
申请号：EP20784202.2
申请日：2020-03-27
申请人： Senju Metal Industry Co., Ltd.
发明人： KAWASAKI Hiroyoshi , SHIRATORI Masato , KURASAWA Yoko , ONITSUKA Motohiro , KITAZAWA Kazuya , TAKAKI Akiko
IPC分类号： C22C13/00 , C22C13/02 , B23K35/14 , B23K35/26 , B23K35/363
摘要： Provided are: a resin composition for soldering use, which has excellent compatibility with a rosin-based resin and excellent temperature cycle reliability and is therefore suitable for a flux for soldering use; and a soldering composition and a flux cored solder, in each of which the resin composition for soldering use is used. The resin composition for soldering use comprises: an acrylic resin having a number average molecular weight of 500 or more and less than 2000 as determined by mass spectrometry using a time-of-flight mass spectrometer; and a rosin-based resin, a polyethylene-based resin or a polypropylene-based resin. Alternatively, the resin composition for soldering use comprises: an acrylic resin having a weight average molecular weight of 500 or more and less than 2000 as determined by mass spectrometry using a time-of-flight mass spectrometer; and a rosin-based resin, a polyethylene-based resin or a polypropylene-based resin.

2. 发明授权

EP3124167B1 FLUX AND SOLDER PASTE 有权
公开(公告)号：EP3124167B1
公开(公告)日：2019-05-08
申请号：EP15770209.3
申请日：2015-02-27
申请人： Senju Metal Industry Co., Ltd
发明人： UEHATA Masashi , YAMAGAWA Yasuyuki , KITAZAWA Kazuya , TAKAGI Yoshinori
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00 , B23K35/36 , B23K35/362 , B23K35/02

3. 发明公开

EP3124167A1 FLUX AND SOLDER PASTE 有权
标题翻译： FLUSSMITTEL UNDLÖTPASTE
公开(公告)号：EP3124167A1
公开(公告)日：2017-02-01
申请号：EP15770209.3
申请日：2015-02-27
申请人： Senju Metal Industry Co., Ltd
发明人： UEHATA Masashi , YAMAGAWA Yasuyuki , KITAZAWA Kazuya , TAKAGI Yoshinori
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00
CPC分类号： B23K35/362 , B23K35/025 , B23K35/262 , B23K35/264 , B23K35/36 , B23K35/3613 , C22C13/00
摘要： Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator, and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals. It is preferable that content of the thermosetting resin is 30 % through 70 % and content of the long-chain dibasic acid mixture is 20 % through 60 %.
摘要翻译：提供了可以去除金属氧化物以改善焊料润湿性并且可以用焊剂残留物固定待焊接的物体的焊剂。助熔剂含有热固性树脂和长链二元酸混合物，其包括侧链中具有烷基的一种或多种第一长链二元酸，第一长链二元酸作为硬化剂的硬化剂热固性树脂和活化剂，以及在侧链中具有烷基和烷氧基羰基的第二长链二元酸，并且在相对端的羧基之间的主链中具有8个或更多个碳原子。热固性树脂的含量优选为30％至70％，长链二元酸混合物的含量为20％至60％。

4. 发明公开

EP4015138A1 FLUX AND SOLDER PASTE 有权
公开(公告)号：EP4015138A1
公开(公告)日：2022-06-22
申请号：EP20870464.3
申请日：2020-08-28
申请人： Senju Metal Industry Co., Ltd.
发明人： UKAI Ryuji , OHTA Kengo , OKADA Sakie , KITAZAWA Kazuya
IPC分类号： B23K35/363 , B23K35/26 , C22C11/06 , C22C13/00
摘要： The present invention relates to a flux including rosin, an active agent, a solvent, a thixotropic agent containing polyethyleneglycol, and a solder powder, wherein the polyethyleneglycol content is 10 to 20% by mass with respect to the total mass of the flux, and the thixotropic agent content excluding the polyethyleneglycol is no greater than 5% by mass with respect to the total mass of the flux.

5. 发明授权

EP3034230B1 FLUX, SOLDER PASTE AND SOLDERED JOINT 有权
标题翻译： FLUX，焊膏和焊接接头
公开(公告)号：EP3034230B1
公开(公告)日：2018-04-18
申请号：EP13891456.9
申请日：2013-08-12
申请人： Senju Metal Industry Co., Ltd
发明人： MORI Hideki , KITAZAWA Kazuya
IPC分类号： B23K35/363 , B23K35/362 , B23K35/36 , B23K35/02
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618
摘要： A purpose of the present invention is to provide a flux having an improved cleaning property by suppressing a carbonization of a flux residue. A flux contains an organic acid, a thixotropic agent, rosin and a solvent wherein a fatty acid monoalkylol amide having 14-20 carbon atoms is contained as the thixotropic agent. The fatty acid monoethanol amide is added in an amount of 3-10% by weight as the thixotropic agent. In addition, a dicarboxylic acid having 10 or less carbon atoms is added in an amount of 4-10% by weight as the organic acid. Moreover, the solvent is added in an amount of 30-60% by weight.

6. 发明公开

EP3741498A1 FLUX AND SOLDER PASTE 有权
公开(公告)号：EP3741498A1
公开(公告)日：2020-11-25
申请号：EP19741583.9
申请日：2019-01-16
申请人： Senju Metal Industry Co., Ltd
发明人： HASHIMOTO Yutaka , TAKAGI Kazuyori , NAGAI Tomoko , MIYAGI Nanako , KITAZAWA Kazuya , TAKAKI Akiko , MINEGISHI Kazuhiro , OTSUKI Teppei , HORIKOSHI Rina , TSUDA Ryuichi , KAWASAKI Hiroyoshi , SHIRATORI Masato
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00
摘要： Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.

7. 发明公开

EP3034230A1 FLUX, SOLDER PASTE AND SOLDERED JOINT 有权
标题翻译： FLUSSMITTEL，LÖTPASTEUNDLÖTVERBINDUNG
公开(公告)号：EP3034230A1
公开(公告)日：2016-06-22
申请号：EP13891456.9
申请日：2013-08-12
申请人： Senju Metal Industry Co., Ltd
发明人： MORI Hideki , KITAZAWA Kazuya
IPC分类号： B23K35/363
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618
摘要： A purpose of the present invention is to provide a flux having an improved cleaning property by suppressing a carbonization of a flux residue.
A flux contains an organic acid, a thixotropic agent, rosin and a solvent wherein a fatty acid monoalkylol amide having 14-20 carbon atoms is contained as the thixotropic agent. The fatty acid monoethanol amide is added in an amount of 3-10% by weight as the thixotropic agent. In addition, a dicarboxylic acid having 10 or less carbon atoms is added in an amount of 4-10% by weight as the organic acid. Moreover, the solvent is added in an amount of 30-60% by weight.
摘要翻译：本发明的目的是通过抑制助焊剂残渣的碳化来提供具有改善的清洗性能的焊剂。助熔剂含有有机酸，触变剂，松香和溶剂，其中含有14-20个碳原子的脂肪酸单烷醇酰胺作为触变剂。作为触变剂，加入量为3-10重量％的脂肪酸单乙醇酰胺。另外，作为有机酸，添加碳原子数为10以下的二羧酸的量为4-10重量％。此外，溶剂的添加量为30-60重量％。

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