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1. 发明公开

EP0693779A2 Resin sealing type semiconductor device and method of making the same 失效
标题翻译： Harzvergossenes Halbleiterbauteil和dessen Herstellungsverfahren
公开(公告)号：EP0693779A2
公开(公告)日：1996-01-24
申请号：EP95109655.1
申请日：1995-06-21
申请人： SEIKO EPSON CORPORATION
发明人： Otsuki, Tetsuya
IPC分类号： H01L23/433
CPC分类号： H01L23/4334 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/49171 , H01L2924/00014 , H01L2924/01013 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： The invention provides a resin sealing type semiconductor device and fabrication method thereof. The resin sealing type semiconductor device has good heat radiation characteristics and high reliability. A highly flexible wiring arrangement design is provided by using leads commonly. The resin sealing type semiconductor device includes an element mounting portion having an element mounting surface. A semiconductor element is bonded to the element mounting surface. A plurality of leads is provided and is separated from the semiconductor element, a frame lead is disposed between these leads and the semiconductor element and not in contact with either the semiconductor element or the leads. Wires are provided for electrical connections and a resin seals the element mounting portion, the semiconductor element, parts of the leads and the frame lead.
摘要翻译：本发明提供一种树脂密封型半导体器件及其制造方法。树脂密封型半导体器件具有良好的散热特性和高可靠性。通常使用引线提供高度灵活的布线布置设计。树脂密封型半导体器件包括具有元件安装表面的元件安装部分。半导体元件结合到元件安装表面。提供多个引线并与半导体元件分离，框架引线设置在这些引线和半导体元件之间，并且不与半导体元件或引线接触。电线被提供用于电连接，并且树脂密封元件安装部分，半导体元件，引线的一部分和框架引线。

2. 发明公开

EP2363689A2 Motion sensor, and method of manufacturing motion sensor 有权
标题翻译： Bewegungssensor und Verfahren zur Herstellung des Bewegungssensors
公开(公告)号：EP2363689A2
公开(公告)日：2011-09-07
申请号：EP11156418.3
申请日：2011-03-01
申请人： Seiko Epson Corporation
发明人： Otsuki, Tetsuya
IPC分类号： G01C19/56
CPC分类号： G01C19/5628
摘要： A sensor device 1 includes: a silicon substrate 10; a first electrode 11 provided at an active surface 10a side of the silicon substrate 10; an external connection terminal 12 provided at the active surface 10a side so as to be electrically connected to the first electrode 11; a stress relief layer 15 provided between the silicon substrate 10 and the external connection terminal 12; and a vibrating gyro element 20 as a sensor element including a extraction electrode 29. The vibrating gyro element 20 is held to the silicon substrate 10 by connection between the extraction electrode 29 and the external connection terminal 12.
摘要翻译：传感器装置1包括：硅基板10; 设置在硅衬底10的有源面10a侧的第一电极11; 设置在有源表面10a侧以便与第一电极11电连接的外部连接端子12; 设置在硅衬底10和外部连接端子12之间的应力消除层15; 以及作为包括提取电极29的传感器元件的振动陀螺元件20.振动陀螺元件20通过引出电极29和外部连接端子12之间的连接被保持在硅衬底10上。

3. 发明授权

EP2363689B1 Motion sensor, and method of manufacturing motion sensor 有权
标题翻译：运动传感器及其制造方法的运动传感器
公开(公告)号：EP2363689B1
公开(公告)日：2016-02-17
申请号：EP11156418.3
申请日：2011-03-01
申请人： Seiko Epson Corporation
发明人： Otsuki, Tetsuya
IPC分类号： G01C19/5628
CPC分类号： G01C19/5628

4. 发明公开

EP0693779A3 Resin sealing type semiconductor device and method of making the same 失效
标题翻译：树脂密封的半导体器件及其制造方法
公开(公告)号：EP0693779A3
公开(公告)日：1997-01-08
申请号：EP95109655.1
申请日：1995-06-21
申请人： SEIKO EPSON CORPORATION
发明人： Otsuki, Tetsuya
IPC分类号： H01L23/433
CPC分类号： H01L23/4334 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/49171 , H01L2924/00014 , H01L2924/01013 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： The invention provides a resin sealing type semiconductor device and fabrication method thereof. The resin sealing type semiconductor device has good heat radiation characteristics and high reliability. A highly flexible wiring arrangement design is provided by using leads commonly. The resin sealing type semiconductor device includes an element mounting portion having an element mounting surface. A semiconductor element is bonded to the element mounting surface. A plurality of leads is provided and is separated from the semiconductor element, a frame lead is disposed between these leads and the semiconductor element and not in contact with either the semiconductor element or the leads. Wires are provided for electrical connections and a resin seals the element mounting portion, the semiconductor element, parts of the leads and the frame lead.

5. 发明公开

EP2363689A3 Motion sensor, and method of manufacturing motion sensor 有权
标题翻译：运动传感器及其制造方法的运动传感器
公开(公告)号：EP2363689A3
公开(公告)日：2013-07-03
申请号：EP11156418.3
申请日：2011-03-01
申请人： Seiko Epson Corporation
发明人： Otsuki, Tetsuya
IPC分类号： G01C19/56
CPC分类号： G01C19/5628
摘要： A sensor device 1 includes: a silicon substrate 10; a first electrode 11 provided at an active surface 10a side of the silicon substrate 10; an external connection terminal 12 provided at the active surface 10a side so as to be electrically connected to the first electrode 11; a stress relief layer 15 provided between the silicon substrate 10 and the external connection terminal 12; and a vibrating gyro element 20 as a sensor element including a extraction electrode 29. The vibrating gyro element 20 is held to the silicon substrate 10 by connection between the extraction electrode 29 and the external connection terminal 12.

6. 发明公开

EP1950802A1 Semiconductor device manufacturing method, semiconductor device, and wiring board 审中-公开
标题翻译： Verfahren zur Herstellung einer Halbleitervorrichtung，Halbleitervorrichtung und Verdrahtungsplatte
公开(公告)号：EP1950802A1
公开(公告)日：2008-07-30
申请号：EP08001164.6
申请日：2008-01-23
申请人： Seiko Epson Corporation
发明人： Otsuki, Tetsuya
IPC分类号： H01L21/60
CPC分类号： H01L24/32 , H01L21/4828 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/49503 , H01L23/49541 , H01L23/49582 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48639 , H01L2224/48664 , H01L2224/4911 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/83801 , H01L2224/85001 , H01L2224/85439 , H01L2224/85464 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device manufacturing method includes (a) bonding a first surface of a metal plate to a substrate, (b) forming a plurality of metal posts that are arranged in vertical and lateral directions in a plan view and include a first metal post and a second metal post, by partially etching the metal plate bonded to the substrate from a second surface of the metal plate, (c) fixing an integrated circuit element to the second surface of the first metal post, (d) coupling the second metal post and a pad terminal of the integrated circuit element via a conductive material, (e) resin-sealing the integrated circuit element, the metal posts, and the conductive material by providing a resin onto the substrate, and (f) removing the substrate from the resin and the first surfaces of the metal posts sealed using the resin.
摘要翻译：半导体器件制造方法包括（a）将金属板的第一表面接合到基板，（b）在平面图中形成沿垂直和横向设置的多个金属柱，并且包括第一金属柱和第二金属柱，通过从金属板的第二表面部分地蚀刻与基板结合的金属板，（c）将集成电路元件固定到第一金属柱的第二表面，（d）将第二金属柱和通过导电材料的集成电路元件的焊盘端子，（e）通过在衬底上提供树脂来树脂密封集成电路元件，金属柱和导电材料，以及（f）从树脂上去除衬底并且使用树脂密封金属柱的第一表面。

7. 发明授权

EP0693779B1 Resin sealing type semiconductor device and method of making the same 失效
标题翻译：树脂密封的半导体器件及其制造方法
公开(公告)号：EP0693779B1
公开(公告)日：2002-05-02
申请号：EP95109655.1
申请日：1995-06-21
申请人： SEIKO EPSON CORPORATION
发明人： Otsuki, Tetsuya
IPC分类号： H01L23/495 , H01L23/433
CPC分类号： H01L23/4334 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/49171 , H01L2924/00014 , H01L2924/01013 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/00 , H01L2224/05599 , H01L2924/00012

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