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1. 发明授权

EP0372983B1 Epoxy resin composition for semiconductor sealing 失效
标题翻译：用于密封半导体的环氧树脂组合物
公开(公告)号：EP0372983B1
公开(公告)日：1998-02-25
申请号：EP89312807.4
申请日：1989-12-08
申请人： SUMITOMO BAKELITE COMPANY LIMITED
发明人： Yanagisawa, Kenichi , Mogi, Naoki , Ohsuga, Hironori , Shimawaki, Hiroshi
IPC分类号： C08G59/32 , C08L63/00 , H01B3/40
CPC分类号： C08G59/3218 , C08G59/08 , C08L63/00 , C08L61/04

2. 发明公开

EP0372983A3 Epoxy resin composition for semiconductor sealing 失效
标题翻译：环氧树脂组合物用于半导体密封
公开(公告)号：EP0372983A3
公开(公告)日：1991-11-27
申请号：EP89312807.4
申请日：1989-12-08
申请人： SUMITOMO BAKELITE COMPANY LIMITED
发明人： Yanagisawa, Kenichi , Mogi, Naoki , Ohsuga, Hironori , Shimawaki, Hiroshi
IPC分类号： C08G59/32 , C08L63/00 , H01B3/40
CPC分类号： C08G59/3218 , C08G59/08 , C08L63/00 , C08L61/04
摘要： An epoxy resin composition for semiconductor sealing which comprises, as essential components,
(A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I)
wherein n and m are each an integer of 0 or more, n + m = 1-10, and R 1 , R 2 and R 3 which may be the same or different, are each selected from hydrogen atom, an alkyl group and a halogen atom, with the proviso that all of Ri, R 2 and R 3 must not be hydrogen atom simultaneously, (B) a phenolic resin curing agent, (C) a silica filler, and (D) a curing accelerator.

3. 发明公开

EP0589143A3 Epoxy resin composition based on diglycidylether of biphenyldiol 失效
标题翻译：环氧树脂组合物基于二苯基二苯胺
公开(公告)号：EP0589143A3
公开(公告)日：1994-09-28
申请号：EP93107683.0
申请日：1993-05-11
申请人： SUMITOMO BAKELITE COMPANY LIMITED
发明人： Fujita, Hiroshi , Mogi, Naoki , Ueda, Shigehisa , Aihara, Takashi
IPC分类号： C08G59/62 , C08G59/24 , H01L23/29 , C08L63/02 , C08L61/08
CPC分类号： H01L23/293 , C08G59/245 , C08G59/621 , C08L63/00 , H01B3/40 , H01L2924/0002 , C08L61/04 , H01L2924/00
摘要： Disclosed is an epoxy resin composition for sealing semiconductors which comprises as essential components:
(A) an epoxy resin containing a biphenyl type epoxy resin represented by the following formula (1) in an amount of 30-100% by weight on the basis of the total amount of the epoxy resin,

wherein R 1 -R 8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, (B) a hardener containing a phenolic resin hardener represented by the following formula (2a) or a naphthol resin hardener represented by the following formula (2b) in an amount of 30-100% by weight on the basis of the total amount of the hardener, wherein R 1- R 8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, R 9 is a group selected from phenyl, naphthyl, anthracenyl and alkyl groups, and n is 1-6, wherein R is a group selected from phenyl, naphthyl, anthracenyl and alkyl groups, and n is 1-6, (C) an inorganic filler, and (D) a hardening accelerator.
摘要翻译：公开了一种用于密封半导体的环氧树脂组合物，其包含作为必要成分的组分：（A）含有由下式（1）表示的联苯型环氧树脂的环氧树脂，其量为30-100重量％环氧树脂的总量其中R1-R8是选自氢，卤素和烷基的相同或不同的原子或基团，（B）含有由下式（2a）表示的酚醛树脂固化剂的固化剂或以下述式（2b）表示的萘酚树脂固化剂的含量为30-100重量％，基于固化剂的总量，其中R 1 -R 8是相同或不同的选自氢，卤素和烷基，R9是选自苯基，萘基，蒽基和烷基的基团，n是1-6，其中R是选自苯基，萘基，蒽基和烷基的基团，n 为1-6，（C）无机填料，（D）a 硬化加速器。

4. 发明公开

EP0589143A2 Epoxy resin composition based on diglycidylether of biphenyldiol 失效
标题翻译：环氧乙烷基二苯醚
公开(公告)号：EP0589143A2
公开(公告)日：1994-03-30
申请号：EP93107683.0
申请日：1993-05-11
申请人： SUMITOMO BAKELITE COMPANY LIMITED
发明人： Fujita, Hiroshi , Mogi, Naoki , Ueda, Shigehisa , Aihara, Takashi
IPC分类号： C08G59/62 , C08G59/24 , H01L23/29 , C08L63/02 , C08L61/08
CPC分类号： H01L23/293 , C08G59/245 , C08G59/621 , C08L63/00 , H01B3/40 , H01L2924/0002 , C08L61/04 , H01L2924/00
摘要： Disclosed is an epoxy resin composition for sealing semiconductors which comprises as essential components:

(A) an epoxy resin containing a biphenyl type epoxy resin represented by the following formula (1) in an amount of 30-100% by weight on the basis of the total amount of the epoxy resin,

wherein R 1 -R 8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups,
(B) a hardener containing a phenolic resin hardener represented by the following formula (2a) or a naphthol resin hardener represented by the following formula (2b) in an amount of 30-100% by weight on the basis of the total amount of the hardener,

wherein R 1- R 8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, R 9 is a group selected from phenyl, naphthyl, anthracenyl and alkyl groups, and n is 1-6,

wherein R is a group selected from phenyl, naphthyl, anthracenyl and alkyl groups, and n is 1-6,

(C) an inorganic filler, and
(D) a hardening accelerator.
摘要翻译：公开了一种用于密封半导体的环氧树脂组合物，其包含作为必要成分的组分：（A）含有由下式（1）表示的联苯型环氧树脂的环氧树脂，其量为30-100重量％环氧树脂的总量其中R1-R8是选自氢，卤素和烷基的相同或不同的原子或基团，（B）含有由下式（2a）表示的酚醛树脂固化剂的固化剂或以下述式（2b）表示的萘酚树脂固化剂的含量为30-100重量％，基于固化剂的总量，其中R 1 -R 8是相同或不同的选自氢，卤素和烷基，R9是选自苯基，萘基，蒽基和烷基的基团，n是1-6，其中R是选自苯基，萘基，蒽基和烷基的基团，n 为1-6，（C）无机填料，（D）a 硬化加速器。

5. 发明授权

EP0589143B1 Epoxy resin composition based on diglycidylether of biphenyldiol 失效
标题翻译：基于联苯二醇的二缩水甘油醚环氧树脂
公开(公告)号：EP0589143B1
公开(公告)日：1997-01-15
申请号：EP93107683.0
申请日：1993-05-11
申请人： SUMITOMO BAKELITE COMPANY LIMITED
发明人： Fujita, Hiroshi , Mogi, Naoki , Ueda, Shigehisa , Aihara, Takashi
IPC分类号： C08G59/62 , C08G59/24 , H01L23/29 , C08L63/02 , C08L61/08
CPC分类号： H01L23/293 , C08G59/245 , C08G59/621 , C08L63/00 , H01B3/40 , H01L2924/0002 , C08L61/04 , H01L2924/00

6. 发明公开

EP0372983A2 Epoxy resin composition for semiconductor sealing 失效
标题翻译： Epoxydharzzusammensetzungfürdie Versiegelung von Halbleitern。
公开(公告)号：EP0372983A2
公开(公告)日：1990-06-13
申请号：EP89312807.4
申请日：1989-12-08
申请人： SUMITOMO BAKELITE COMPANY LIMITED
发明人： Yanagisawa, Kenichi , Mogi, Naoki , Ohsuga, Hironori , Shimawaki, Hiroshi
IPC分类号： C08G59/32 , C08L63/00 , H01B3/40
CPC分类号： C08G59/3218 , C08G59/08 , C08L63/00 , C08L61/04
摘要： An epoxy resin composition for semiconductor sealing which comprises, as essential components,

(A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I)
wherein n and m are each an integer of 0 or more, n + m = 1-10, and R 1 , R 2 and R 3 which may be the same or different, are each selected from hydrogen atom, an alkyl group and a halogen atom, with the proviso that all of Ri, R 2 and R 3 must not be hydrogen atom simultaneously,
(B) a phenolic resin curing agent,
(C) a silica filler, and
(D) a curing accelerator.
摘要翻译：一种用于半导体密封的环氧树脂组合物，其包含作为必要成分的（A）基于总环氧树脂量的包含50-100重量％的由式（I）表示的多官能环氧树脂的环氧树脂，其中n和m各自为0以上的整数，n + m = 1-10，可以相同或不同的R 1，R 2和R 3各自选自氢原子，烷基和卤素原子，条件是R1，R2和R3不能同时为氢原子，（B）酚醛树脂固化剂，（C）二氧化硅填料和（D）固化促进剂。 H

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