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1. 发明公开

EP3392637A1 STRESS SENSOR FOR MONITORING THE HEALTH STATE OF FABRICATED STRUCTURES SUCH AS CONSTRUCTIONS, BUILDINGS, INFRASTRUCTURES AND THE LIKE 审中-实审
公开(公告)号：EP3392637A1
公开(公告)日：2018-10-24
申请号：EP18163479.1
申请日：2018-03-22
申请人： STMicroelectronics S.r.l.
发明人： GUIDETTI, Elio , ABBASI GAVARTI, Mohammad , CALTABIANO, Daniele , BERTAGNOLI, Gabriele
IPC分类号： G01M5/00 , G01L1/18 , G01L5/16 , G01L5/00
摘要： Stress sensor (1) formed by a membrane plate (4); a first bonding region (5) arranged on top of the membrane plate; a cover plate (6) arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional detection piezoresistive elements (11) extending on the membrane plate (4) that are embedded in the bonding layer; and planar detection piezoresistive elements (12) that extend across the membrane plate and are surrounded by and separated from the bonding layer.

2. 发明公开

EP4124883A1 APPARATUS AND METHOD OF LASER SCANNING 审中-公开
公开(公告)号：EP4124883A1
公开(公告)日：2023-02-01
申请号：EP22181791.9
申请日：2022-06-29
申请人： STMicroelectronics S.r.l.
发明人： CALTABIANO, Daniele
IPC分类号： G01S7/481 , G01S17/10 , G01S17/42 , G01S17/89 , G01S17/931 , G01S7/4863
摘要： An apparatus (10), comprising: a laser light source (12) configured to transmit at least one beam of light pulses (L) towards a target, projecting at least one corresponding beam spot (P) thereon, and an array of sensors (16) with a plurality of sensors (16ij) distributed according to a grid (G), a sensor (16ij) in the array of sensors (16) configured to sense a light pulse incident thereon in response to reflection of at least one light pulse (P) of the beam of light pulses (L) from a field of view, FOV, region (T) in the target, the sensor (16) of the array of sensors (16) further configured to provide a signal indicative of a time of incidence of at least one light pulse (R).
A FOV region (T) of the array of sensors (16) is portioned into grid cells (gij) according to the grid (G).
Each sensor (16i) in the array of sensors (16) is configured to sense at least one echo light pulse (R) reflected from a respective grid cell portion (gij) of the FOV region (T).
The apparatus (10) comprises a beam steering arrangement (13, 14) configured to cyclically vary a direction of transmission of the beam of light pulses (L), projecting at least one light pulse (P) per grid cell (gij) in the portioned FOV region (T) of the array of sensors (16).

3. 发明公开

EP3537129A3 STRAIN GAUGE WITH MECHANICALLY DECOUPLED TEMPERATURE SENSOR 有权
公开(公告)号：EP3537129A3
公开(公告)日：2019-11-27
申请号：EP19158156.0
申请日：2019-02-19
申请人： STMicroelectronics S.r.l.
发明人： CALTABIANO, Daniele
IPC分类号： G01L9/00 , G01L9/04 , G01L19/00
摘要： A semiconductor device (100; 100') includes a strain gauge (130) on a substrate (101; 702), the strain gauge configured to measure a stress of the substrate; and a temperature sensor (107) disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.

4. 发明授权

EP3252449B1 MINIATURIZED LOAD SENSOR DEVICE HAVING LOW SENSITIVITY TO THERMO-MECHANICAL PACKAGING STRESS, IN PARTICULAR FORCE AND PRESSURE SENSOR 有权
公开(公告)号：EP3252449B1
公开(公告)日：2020-02-05
申请号：EP16206884.5
申请日：2016-12-23
申请人： STMicroelectronics S.r.l.
发明人： CALTABIANO, Daniele , ABBASI GAVARTI, Mohammad , MURARI, Bruno , BRIOSCHI, Roberto , GIUSTI, Domenico
IPC分类号： G01L9/00 , G01L1/04

5. 发明公开

EP3534126A2 SENSING DEVICE, IN PARTICULAR LOAD SENSING DEVICE 有权
公开(公告)号：EP3534126A2
公开(公告)日：2019-09-04
申请号：EP19157021.7
申请日：2019-02-13
申请人： STMicroelectronics S.r.l.
发明人： ABBASI GAVARTI, Mohammad , CALTABIANO, Daniele , GHIDONI, Marco Omar
IPC分类号： G01L1/18 , H01L29/84
摘要： A load sensor package (140) includes a housing having a cap (142), a column (144), a peripheral structure (146), and a base (148). The base (148) includes a major surface configured to mount a stress sensor (120), while the cap (142) includes a cap major surface configured to receive a load to be measured. The column (144) is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor (120). The peripheral structure (146) is configured to transfer the remaining fraction of the load to be measured to the base.

6. 发明授权

EP3392637B1 STRESS SENSOR FOR MONITORING THE HEALTH STATE OF FABRICATED STRUCTURES SUCH AS CONSTRUCTIONS, BUILDINGS, INFRASTRUCTURES AND THE LIKE 审中-实审
公开(公告)号：EP3392637B1
公开(公告)日：2019-11-27
申请号：EP18163479.1
申请日：2018-03-22
申请人： STMicroelectronics S.r.l.
发明人： GUIDETTI, Elio , ABBASI GAVARTI, Mohammad , CALTABIANO, Daniele , BERTAGNOLI, Gabriele
IPC分类号： G01M5/00 , G01L1/18 , G01L5/16 , G01L5/00

7. 发明公开

EP3534126A3 SENSING DEVICE, IN PARTICULAR LOAD SENSING DEVICE 有权
公开(公告)号：EP3534126A3
公开(公告)日：2019-11-13
申请号：EP19157021.7
申请日：2019-02-13
申请人： STMicroelectronics S.r.l.
发明人： ABBASI GAVARTI, Mohammad , CALTABIANO, Daniele , GHIDONI, Marco Omar
IPC分类号： G01L1/18 , H01L29/84
摘要： A load sensor package (140) includes a housing having a cap (142), a column (144), a peripheral structure (146), and a base (148). The base (148) includes a major surface configured to mount a stress sensor (120), while the cap (142) includes a cap major surface configured to receive a load to be measured. The column (144) is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor (120). The peripheral structure (146) is configured to transfer the remaining fraction of the load to be measured to the base.

8. 发明公开

EP3421959A1 MULTI-AXIAL FORCE SENSOR, METHOD OF MANUFACTURING THE MULTI-AXIAL FORCE SENSOR, AND METHOD FOR OPERATING THE MULTI-AXIAL FORCE SENSOR 有权
公开(公告)号：EP3421959A1
公开(公告)日：2019-01-02
申请号：EP18178963.7
申请日：2018-06-21
申请人： STMicroelectronics S.r.l.
发明人： ABBASI GAVARTI, Mohammad , CALTABIANO, Daniele , BRAGHIN, Francesco
IPC分类号： G01L5/16 , G01L1/26 , G01L1/18 , G01L1/22
摘要： A microelectromechanical transducer (1), comprising: a semiconductor body (2), having a first surface (2a) and a second surface (2b) opposite to one another; a plurality of trenches (4) extending in the semiconductor body (2) from the first surface (2a) towards the second surface (2b), including a first pair of trenches (4a) having a respective main direction of extension along a first axis (x), and a second pair of trenches (4b) having a respective main direction of extension along a second axis (y) orthogonal to the first axis; a first piezoresistive sensor (6a) and a second piezoresistive sensor (6b) extending at the first surface (2a) of the semiconductor body (2), respectively arranged between said first and second pair of trenches (4a, 4b), wherein the first piezoresistive sensor (6a), the second piezoresistive sensor (6b) and the plurality of trenches (4) form an active region (7a, 7b); and a first structural body (8), mechanically coupled to the first surface (2a) of the semiconductor body (2) in such a way to form a first sealed cavity (10) which encloses the active region.

9. 发明公开

EP3364166A1 MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR 有权
公开(公告)号：EP3364166A1
公开(公告)日：2018-08-22
申请号：EP18156816.3
申请日：2018-02-14
申请人： STMicroelectronics S.r.l.
发明人： ABBASI GAVARTI, Mohammad , CALTABIANO, Daniele , PICCO, Andrea , POMARICO, Anna Angela , ROSELLI, Giuditta , BRAGHIN, Francesco
IPC分类号： G01L9/00 , B81B7/00 , G01L9/06 , G01L19/14 , G01L1/18 , G01L1/26
CPC分类号： G01L1/18 , G01L1/26 , G01L9/0002 , G01L9/06 , G01L19/146 , H01C10/10 , H01C17/00
摘要： A microelectromechanical force/pressure sensor (1) has: a sensor die (2), of semiconductor material, having a front surface (2a) and a bottom surface (2b), extending in a horizontal plane (xy), and made of a compact bulk region having a thickness along a vertical direction (z), transverse to the horizontal plane (xy); piezoresistive elements (6), integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die (8), coupled above the sensor die, covering the piezoresistive elements, having a respective front surface (8a) and bottom surface (8b), opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer (4) is arranged between the front surface (2a) of the sensor die (2) and the bottom surface (8b) of the cap die (8), patterned to define a groove (5) traversing its entire thickness along the vertical direction; the piezoresistive elements (6) are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied from the front surface of the cap die and/or bottom surface of the sensor die into a planar stress distribution at the groove, acting in the horizontal plane.

10. 发明授权

EP3364166B1 MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR 有权
公开(公告)号：EP3364166B1
公开(公告)日：2020-02-05
申请号：EP18156816.3
申请日：2018-02-14
申请人： STMicroelectronics S.r.l.
发明人： ABBASI GAVARTI, Mohammad , CALTABIANO, Daniele , PICCO, Andrea , POMARICO, Anna Angela , ROSELLI, Giuditta , BRAGHIN, Francesco
IPC分类号： G01L9/00 , B81B7/00 , G01L9/06 , G01L19/14 , G01L1/18 , G01L1/26

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