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1. 发明公开

EP3739508A1 FINGERPRINT IDENTIFICATION APPARATUS AND ELECTRONIC DEVICE 有权
公开(公告)号：EP3739508A1
公开(公告)日：2020-11-18
申请号：EP19886055.3
申请日：2019-03-21
申请人： SHENZHEN GOODIX TECHNOLOGY CO., LTD.
发明人： LIU, Kai , LONG, Wei , GUO, Yiping
IPC分类号： G06K9/00
摘要： Provided are a fingerprint identification apparatus and an electronic device. The fingerprint identification apparatus is applied to an electronic device having a display screen, and includes: at least one fingerprint sensor chip; and a support plate provided with a first opening window, where the at least one fingerprint sensor chip is fixedly disposed in the first opening window. In an embodiment of the present application, the at least one fingerprint sensor chip is disposed in the first opening window of the support plate, which could reduce costs and complexity of the electronic device, and improve maintainability. Especially, in a scenario of a plurality of fingerprint sensor chips, the costs and complexity of the electronic device could be effectively reduced, and maintainability is greatly improved. In addition, a thickness of the fingerprint identification apparatus could be effectively reduced.

2. 发明公开

EP3640845A1 OPTICAL IMAGE COLLECTION UNIT, OPTICAL IMAGE COLLECTION SYSTEM AND ELECTRONIC DEVICE 无效
公开(公告)号：EP3640845A1
公开(公告)日：2020-04-22
申请号：EP18918405.4
申请日：2018-09-06
申请人： SHENZHEN GOODIX TECHNOLOGY CO., LTD.
发明人： LONG, Wei
IPC分类号： G06K9/58 , G06K9/20
摘要： Embodiments of the present application disclose an optical image capturing unit, an optical image capturing system, and an electronic device. The optical image capturing unit includes: a micro lens; a light shielding layer disposed under the micro lens, where the light shielding layer is provided with a window; and a photosensor disposed under the light shielding layer, where the micro lens is configured to converge an optical signal from above the micro lens to the window, and the optical signal is transmitted to the photosensor via the window. Technical solutions of embodiments of the present application could enhance performance of an optical image capturing product.

3. 发明公开

EP3422247A1 FINGERPRINT DEVICE, AND TERMINAL APPARATUS 有权
公开(公告)号：EP3422247A1
公开(公告)日：2019-01-02
申请号：EP17892149.0
申请日：2017-01-20
申请人： Shenzhen Goodix Technology Co., Ltd.
发明人： HOU, Lyu , LONG, Wei
IPC分类号： G06K9/00
摘要： Embodiments of the present application provide a fingerprint apparatus, which may achieve that fingerprint information of a human finger could be recognized when the human finger touches any location on a screen. The fingerprint apparatus includes: a first cover, a second cover, a sensing layer, a light transmission layer, a light emitter, a light receiver, a chip system and an optical micro electro mechanical system, where the sensing layer is configured to acquire touch information of a human and send the touch information to the chip system; the chip system is configured to determine a first touch unit in the plurality of touch units corresponding to a location on the first cover touched by the human according to the touch information, and send, to the light emitter, a first instruction for controlling the light emitter to emit the first optical signal, and to the optical micro electro mechanical system, a second instruction for controlling the optical micro electro mechanical system to adjust a propagation path of the first optical signal so that the first optical signal with the adjusted propagation path finally reaches the first touch unit.

4. 发明公开

EP3370187A1 FINGERPRINT RECOGNITION DEVICE 审中-公开
公开(公告)号：EP3370187A1
公开(公告)日：2018-09-05
申请号：EP17758789.6
申请日：2017-01-19
申请人： Shenzhen Goodix Technology Co., Ltd.
发明人： GONG, Cai , HOU, Lyu , LONG, Wei
IPC分类号： G06K9/00
CPC分类号： G06K9/00013 , G06K9/0002 , G06K9/00053 , G06K9/0008 , G06K9/00087 , G06K9/001 , G06K9/209 , G06K9/22
摘要： The present invention relates to the technical field of biometric identification, and in particular, relates to a fingerprint identification apparatus. The fingerprint identification apparatus includes: a substrate, a sensing chip, a first covering layer, and a second covering layer; wherein the sensing chip is arranged on the substrate, the first covering layer is coated over the sensing chip, the second covering layer is coated on an upper surface of the first covering layer, and the second covering layer is an oleophobic and hydrophobic coating. In the fingerprint identification apparatus according to the embodiment of the present invention, a hydrophobic and oleophobic coating is arranged on the surface of the fingerprint identification apparatus, such that the density of the hydrophobic components on the surface of the fingerprint identification apparatus is increased. In this way, the hydrophobic and oleophobic capabilities of the surface of the fingerprint identification apparatus are enhanced, and thus the fingerprint identification accuracy and fingerprint identification speed in a wet-finger use environment are improved.

5. 发明公开

EP3340108A1 SENSOR DEVICE AND MOBILE TERMINAL 有权
公开(公告)号：EP3340108A1
公开(公告)日：2018-06-27
申请号：EP16898148.8
申请日：2016-10-25
申请人： Shenzhen Goodix Technology Co., Ltd.
发明人： LONG, Wei
IPC分类号： G06K9/00 , H01L27/32
CPC分类号： G06K9/00053 , G06K9/0002 , G06K9/00046 , G06K9/00107 , H05K1/0281 , H05K1/0393 , H05K1/189 , H05K2201/10151
摘要： The present application provides a sensor apparatus and a mobile terminal. The sensor apparatus includes: a cover, a lower surface of the cover being provided with an ink layer; a sensor, the sensor being arranged below the cover; at least one light-emitting module, the light-emitting module being arranged as parallel to the sensor; an upper reflecting layer and a lower reflecting layer, the upper reflecting layer being arranged on a lower surface of the ink layer, and the lower reflecting layer being arranged on an upper surface of the sensor; and a light transmitting glue layer, the light transmitting glue layer being arranged between the upper reflecting layer and the lower reflecting layer. The light emitted by the sensor apparatus may form a preset bright shape or pattern via a background color and the opening of the ink layer so as to guide operations of the users in a dark environment, and improve use experience of the users. The sensor apparatus is in a simple structure and in a small volume, and may further implement such biological recognition functions as fingerprint detection, heart rate detection and the like.

6. 发明公开

EP3798896A1 LENS SYSTEM, FINGERPRINT RECOGNITION APPARATUS, AND TERMINAL DEVICE 有权
公开(公告)号：EP3798896A1
公开(公告)日：2021-03-31
申请号：EP18930875.2
申请日：2018-08-21
申请人： Shenzhen Goodix Technology Co., Ltd.
发明人： LI, Linxin , LONG, Wei
IPC分类号： G06K9/00 , G02B11/02 , G02B9/04
摘要： Embodiments of the present application provide a lens system, a finger identification apparatus and a terminal device, including a first lens, a second lens and a third lens arranged sequentially from an object side to an image side, where the first lens is a S-shaped meniscus negative optical power lens, the second lens is a biconvex positive optical power lens and a focal length of the first lens and a focal length of the second lens follow a first relationship so that a field of view (FOV) is greater than a first threshold.

7. 发明公开

EP3422397A1 SECONDARY PACKAGING METHOD FOR THROUGH-SILICON VIA CHIP AND SECONDARY PACKAGE THEREOF 审中-公开
公开(公告)号：EP3422397A1
公开(公告)日：2019-01-02
申请号：EP17896308.8
申请日：2017-07-27
申请人： Shenzhen Goodix Technology Co., Ltd.
发明人： WU, Baoquan , LONG, Wei , LIU, Yuping
IPC分类号： H01L21/683 , H01L23/31
摘要： Embodiments of this disclosure relate to semiconductor packaging technologies, and disclose a secondary packaging method of a TSV chip. In the embodiments, the TSV chip has a forward surface and a counter surface that are opposite to each other, a BGA solder ball is disposed on the counter surface, and the secondary packaging method includes: placing at least one TSV chip on a base on which a stress relief film layer is laid; cladding the TSV chip via a softened molding compound; removing the base after the molding compound is cured, to obtain a secondary package of the TSV chip; and processing a surface of the secondary package to expose the BGA solder ball. This disclosure further discloses a secondary package of a TSV chip. According to the embodiments, in the secondary packaging process, there is no need to use a substrate as a carrier, and thus, on the basis of guaranteeing the TSV chip to have relatively high mechanical structural strength, a thickness of the secondary package is reduced, a thinning and miniaturization design of an electronic product is facilitated.

8. 发明公开

EP3418941A1 FINGERPRINT RECOGNITION MODULE AND FINGERPRINT RECOGNITION CHIP PACKAGING STRUCTURE 有权
公开(公告)号：EP3418941A1
公开(公告)日：2018-12-26
申请号：EP16920840.2
申请日：2016-11-07
申请人： Shenzhen Goodix Technology Co., Ltd.
发明人： WU, Baoquan , LONG, Wei , LIU, Yuping
IPC分类号： G06K9/00 , H01L23/28
CPC分类号： G06K9/00 , H01L23/28
摘要： The present application provides a fingerprint identification module and a package structure of a fingerprint identification chip. The fingerprint identification module includes: a fingerprint identification chip and a package structure for packaging the fingerprint identification chip. The package structure leaves a fingerprint sensing region of the fingerprint identification chip exposed, an upper surface of a film layer of the fingerprint sensing region is provided with a protection layer with a predetermined thickness. The protection layer is exposed in the fingerprint sensing region outside the package structure and causes the fingerprint identification chip to have a predefined fingerprint identification distance. The fingerprint identification module and the package structure with a protection layer arranged on the upper surface of the fingerprint identification chip provide sufficient protections for fabrication processes such as downstream module assembly, while ensuring that the fingerprint identification chip has a predefined fingerprint identification distance.

9. 发明公开

EP3327755A1 CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD 审中-公开
公开(公告)号：EP3327755A1
公开(公告)日：2018-05-30
申请号：EP16891896.9
申请日：2016-10-10
申请人： Shenzhen Goodix Technology Co., Ltd.
发明人： LONG, Wei , WU, Baoquan , LIU, Xiangying
IPC分类号： H01L21/56 , H01L23/31 , H01L23/28 , H01L23/02
CPC分类号： H01L21/565 , H01L21/561 , H01L21/568 , H01L23/3135 , H01L23/49827 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： A chip packaging structure includes: at least one package, each of the at least one package comprising at least one chip; and an expansion body wrapping the package and being cuttable according to a package size requirement. A chip packaging method includes: fixing at least one package to a lower mold surface via a carrier, and sealing an upper mold for the package; and fully filling a cavity between the carrier and the upper mold with an expansion body by plastic injection molding, the expansion body wrapping the at least one package; and releasing the mold to obtain a size-expanded package, and cutting the package according to a package size need. Another chip packaging method includes: pre-fabricating a hollow frame having hollow regions, and placing the hollow frame on a surface of the lower mold; placing at least one package in the hollow regions of the hollow frame respectively, and filling a gap between the package and the hollow frame where the package is positioned with an expansion body, such that the expansion body wraps the package; and curing to obtain a size-expanded package, and cutting the package according to a package size need. The present application achieves size-variable chip packaging.

10. 发明公开

EP3534292A1 OPTICAL MODULE AND PROCESSING METHOD THEREFOR, AND TERMINAL DEVICE 审中-公开
公开(公告)号：EP3534292A1
公开(公告)日：2019-09-04
申请号：EP17931166.7
申请日：2017-12-26
申请人： Shenzhen Goodix Technology Co., Ltd.
发明人： DONG, Haoxiang , WEI, Ya , LONG, Wei , WU, Baoquan
IPC分类号： G06K9/00 , H04M1/00
摘要： Embodiments of the present application, pertaining to the technical field of optical devices, provide an optical module and a fabrication method thereof, and a terminal device using the same. The optical module includes a lens and a sensor package. The lens is positioned at an uppermost position of the optical module and attached to a lower position of a terminal screen, and is configured to transmit light passing through the screen; the sensor package includes an optical sensor, where a photosensitive region is arranged on an upper surface of the optical sensor, and the photosensitive region is configured to receive light passing through the lens; and the sensor package further includes an air gap, and the photosensitive region of the optical sensor is configured to receive the light passing through the screen via the air gap. With the optical module, a balance is reached between thickness and performance, accuracy of detection and identification is ensured, and the thickness is reduced.

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