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1. 发明公开

EP1746692A2 Semiconductor laser device including a resin section 有权
标题翻译：包括树脂部分的半导体激光装置
公开(公告)号：EP1746692A2
公开(公告)日：2007-01-24
申请号：EP06023471.3
申请日：2000-04-05
申请人： SHARP KABUSHIKI KAISHA
发明人： Shimonaka, Atsushi , Kawanashi,, Hidenori , Emoto, Kazuhiro
IPC分类号： H01S5/022
CPC分类号： H01S5/02228 , H01L33/483 , H01L33/54 , H01L2224/48091 , H01S5/02244 , H01S5/02288 , H01S5/02296 , H01L2924/00014
摘要： A surface of a molded resin 4 is entirely or partially roughened, and the light is diffused by the roughened portion. Alternatively, a cap and a glass cap having a light-diffusive function are integrated together with a resin. Alternatively still, a resin section formed of a resin material in which another resin material having a different refractive index from that of the first resin material is mixed, or a resin formed of a birefringent resin material, is provided so as not to contact a laser chip, and the light is diffused by the resin section. Alternatively still, an area formed of a resin material in which another resin material having a different refractive index from that of the first resin material is mixed, or an area formed of a birefringent resin material, is provided so as not to contact the laser chip, and the light is diffused by the area.
摘要翻译：模制树脂4的表面被完全或部分粗糙化，并且光被粗糙部分扩散。或者，具有光扩散功能的帽和玻璃盖与树脂一体化。或者，还设置由树脂材料形成的树脂部分，该树脂部分与不同于第一树脂材料的折射率不同的其他树脂材料混合，或者由双折射树脂材料形成的树脂设置为不接触激光器芯片，并且光被树脂部分扩散。可选地，还设置有由树脂材料形成的区域，其中混合有折射率与第一树脂材料的折射率不同的另一种树脂材料或者由双折射树脂材料形成的区域，以便不接触激光器芯片，光线被该区域扩散。

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