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1. 发明公开

EP1326273A2 Semiconductor device and semiconductor device producing system 有权
标题翻译：半导体器件和半导体器件生产系统
公开(公告)号：EP1326273A2
公开(公告)日：2003-07-09
申请号：EP02028650.6
申请日：2002-12-20
申请人： Semiconductor Energy Laboratory Co., Ltd.
发明人： Isobe, Atsuo , Dairiki, Koji , Shibata, Hiroshi , Kokubo, Chiho , Arao, Tatsuya , Hayakawa, Masahiko , Miyairi, Hidekazu , Shimomura, Akihisa , Tanaka, Koichiro , Yamazaki, Shunpei , Akiba, Mai (formerly Mai Osada)
IPC分类号： H01L21/768 , B23K26/00
CPC分类号： H01L21/02683 , B23K26/032 , B23K26/0608 , B23K26/067 , B23K26/0738 , B23K26/0853 , B23K26/10 , B23K26/702 , B23K2201/40 , H01L21/2026 , H01L27/1281 , H01L29/78603
摘要： An insulating film having depressions and projections is formed on a substrate. A semiconductor film is formed on the insulating film. Thus, for crystallization by using laser light, a part where stress concentrates is selectively formed in the semiconductor film. More specifically, stripe or rectangular depressions and projections are provided in the semiconductor film. Then, continuous-wave laser light is irradiated along the stripe depressions and projections formed in the semiconductor film or in a direction of a major axis or minor axis of the rectangle.
摘要翻译：在基板上形成具有凹凸的绝缘膜。在绝缘膜上形成半导体膜。因此，为了通过使用激光进行结晶，应力集中的部分选择性地形成在半导体膜中。更具体地说，在半导体膜中提供条纹或矩形的凹陷和凸起。然后，沿着在半导体膜中形成的条状凹陷或凸起或在矩形的长轴或短轴的方向上照射连续波激光。

2. 发明公开

EP2270853A3 Wireless chip and manufacturing method of the same 有权
标题翻译：无线芯片和制造工艺
公开(公告)号：EP2270853A3
公开(公告)日：2012-04-25
申请号：EP10010230.0
申请日：2005-09-06
申请人： Semiconductor Energy Laboratory Co, Ltd.
发明人： Tsurume, Takuya , Dairiki, Koji , Kusumoto, Naoto
IPC分类号： H01L23/58 , H01L23/31 , H01L23/00 , H01L21/56 , G06K19/077 , H01L23/20 , H01L23/22 , H01L21/683
CPC分类号： H01L21/6835 , H01L23/20 , H01L23/22 , H01L23/58 , H01L24/83 , H01L2221/6834 , H01L2221/68363 , H01L2221/68368 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/01019 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2224/29075 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a new type wireless chip that can be used without being fixed on a product. Specifically, a wireless chip can have a new function by a sealing step. One feature of a wireless chip according to the present invention is to have a structure in which an integrated circuit is sealed by films. In particular, the films sealing the integrated circuit have a hollow structure; therefore the wireless chip can have a new function.

3. 发明授权

EP1818860B1 RFID device 有权
标题翻译： RFID设备
公开(公告)号：EP1818860B1
公开(公告)日：2011-03-30
申请号：EP07002102.7
申请日：2007-01-31
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： Yamazaki, Shunpei , Dairiki, Koji
IPC分类号： G06K19/077 , H01B1/12 , H01L51/00 , C09D11/00 , C09K3/16 , G03C1/85
CPC分类号： G06K19/07749 , H01L24/97 , H01L2224/16237 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
摘要： It is an object to provide a semiconductor device capable of transmitting and receiving data with a reader/writer and reducing breakdown or interference due to static electricity. A semiconductor device includes a semiconductor integrated circuit (112,114), a conductive layer serving as an antenna (151) that is connected to the semiconductor integrated circuit, and a substrate (111) interposing the semiconductor integrated circuit and the conductive layer, where at least one of a layer forming the semiconductor integrated circuit, a layer (142) covering the semiconductor integrated circuit, and the substrate (104) is formed from a conductive polymer. In accordance with the above structure, wireless communication with a reader/writer is possible, and breakdown or malfunction in the semiconductor integrated circuit due to static electricity is reduced.

4. 发明公开

EP2259213A3 RFID device 有权
标题翻译： RFID设备
公开(公告)号：EP2259213A3
公开(公告)日：2011-10-05
申请号：EP10010109.6
申请日：2007-01-31
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： Yamazaki, Shunpei , Dairiki, Koji
IPC分类号： G06K19/077 , H01B1/12 , H01L51/00 , C09D11/00 , C09K3/16 , G03C1/85
CPC分类号： G06K19/07749 , H01L24/97 , H01L2224/16237 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
摘要： It is an object to provide a semiconductor device capable of transmitting and receiving data with a reader/writer and reducing breakdown or interference due to static electricity. A semiconductor device includes a semiconductor integrated circuit, a conductive layer serving as an antenna that is connected to the semiconductor integrated circuit, and a substrate interposing the semiconductor integrated circuit and the conductive layer, where at least one of a layer forming the semiconductor integrated circuit, a layer covering the semiconductor integrated circuit, and the substrate is formed from a conductive polymer. In accordance with the above structure, wireless communication with a reader/writer is possible, and breakdown or malfunction in the semiconductor integrated circuit due to static electricity is reduced.
摘要翻译：本发明的目的是提供一种能够利用读写器发送和接收数据并减少由静电引起的故障或干扰的半导体器件。一种半导体器件包括半导体集成电路，用作连接到半导体集成电路的天线的导电层以及夹置半导体集成电路和导电层的衬底，其中形成半导体集成电路覆盖半导体集成电路的层，并且衬底由导电聚合物形成。根据上述结构，能够与读取器/写入器进行无线通信，并且由于静电导致的半导体集成电路中的故障或故障减少。

5. 发明公开

EP2270853A2 Wireless chip and manufacturing method of the same 有权
标题翻译： Drahtloser芯片和Herstellungsverfahren
公开(公告)号：EP2270853A2
公开(公告)日：2011-01-05
申请号：EP10010230.0
申请日：2005-09-06
申请人： Semiconductor Energy Laboratory Co, Ltd.
发明人： Tsurume, Takuya , Dairiki, Koji , Kusumoto, Naoto
IPC分类号： H01L23/58 , H01L23/31 , H01L23/00 , H01L21/56 , G06K19/077
CPC分类号： H01L21/6835 , H01L23/20 , H01L23/22 , H01L23/58 , H01L24/83 , H01L2221/6834 , H01L2221/68363 , H01L2221/68368 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/01019 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2224/29075 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a new type wireless chip that can be used without being fixed on a product. Specifically, a wireless chip can have a new function by a sealing step. One feature of a wireless chip according to the present invention is to have a structure in which an integrated circuit is sealed by films. In particular, the films sealing the integrated circuit have a hollow structure; therefore the wireless chip can have a new function.
摘要翻译：本发明提供一种新型无线芯片，可以在不固定在产品上的情况下使用。具体地说，无线芯片可以通过密封步骤具有新的功能。根据本发明的无线芯片的一个特征是具有其中集成电路被膜密封的结构。特别地，密封集成电路的膜具有中空结构; 因此无线芯片可以具有新功能。

6. 发明公开

EP2065943A2 Method of manufacturing photoelectric conversion device 审中-公开
标题翻译：光电转换装置的制造方法
公开(公告)号：EP2065943A2
公开(公告)日：2009-06-03
申请号：EP08020763.2
申请日：2008-11-28
申请人： Semiconductor Energy Laboratory Co, Ltd.
发明人： Isaka, Fumito , Kato, Sho , Dairiki, Koji
IPC分类号： H01L31/0236
CPC分类号： H01L31/1804 , H01L31/02168 , H01L31/022433 , H01L31/03762 , H01L31/0725 , H01L31/1864 , H01L31/202 , Y02E10/547 , Y02E10/548 , Y02P70/521
摘要： A fragile layer is formed in a region at a depth of less than 1000 nm from one surface of a single crystal semiconductor substrate, and a first impurity semiconductor layer and a first electrode are formed at the one surface side. After bonding the first electrode and a supporting substrate, the single crystal semiconductor substrate is separated using the fragile layer or the vicinity as a separation plane, thereby forming a first single crystal semiconductor layer over the supporting substrate. An amorphous semiconductor layer is formed on the first single crystal semiconductor layer, and a second single crystal semiconductor layer is formed by heat treatment for solid phase growth of the amorphous semiconductor layer. A second impurity semiconductor layer having a conductivity type opposite to that of the first impurity semiconductor layer and a second electrode are formed over the second single crystal semiconductor layer.
摘要翻译：脆弱层形成在距单晶半导体衬底的一个表面小于1000nm的深度处的区域中，并且在该一个表面侧形成第一杂质半导体层和第一电极。在接合第一电极和支撑衬底之后，使用脆弱层或其附近作为分离面来分离单晶半导体衬底，由此在支撑衬底上形成第一单晶半导体层。在第一单晶半导体层上形成非晶半导体层，通过对非晶半导体层进行固相生长的热处理形成第二单晶半导体层。在第二单晶半导体层上形成导电类型与第一杂质半导体层和第二电极相反的第二杂质半导体层。

8. 发明授权

EP2270853B1 Wireless chip and manufacturing method of the same 有权
标题翻译：无线芯片和制造工艺
公开(公告)号：EP2270853B1
公开(公告)日：2013-08-21
申请号：EP10010230.0
申请日：2005-09-06
申请人： Semiconductor Energy Laboratory Co, Ltd.
发明人： Tsurume, Takuya , Dairiki, Koji , Kusumoto, Naoto
IPC分类号： H01L23/58 , H01L23/31 , H01L23/00 , H01L21/56 , G06K19/077 , H01L23/20 , H01L23/22 , H01L21/683
CPC分类号： H01L21/6835 , H01L23/20 , H01L23/22 , H01L23/58 , H01L24/83 , H01L2221/6834 , H01L2221/68363 , H01L2221/68368 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/01019 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2224/29075 , H01L2924/00014 , H01L2924/00

9. 发明公开

EP2270854A2 Wiresless chip and manufacturing method of the same 审中-公开
标题翻译：无线芯片及其制造方法
公开(公告)号：EP2270854A2
公开(公告)日：2011-01-05
申请号：EP10010231.8
申请日：2005-09-06
申请人： Semiconductor Energy Laboratory Co, Ltd.
发明人： Tsurume, Takuya , Dairiki, Koji , Kusumoto, Naoto
IPC分类号： H01L23/58 , H01L23/31 , H01L23/00 , H01L21/56 , G06K19/077
CPC分类号： H01L21/6835 , H01L23/20 , H01L23/22 , H01L23/58 , H01L24/83 , H01L2221/6834 , H01L2221/68363 , H01L2221/68368 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/01019 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2224/29075 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a new type wireless chip that can be used without being fixed on a product. Specifically, a wireless chip can have a new function by a sealing step. One feature of a wireless chip according to the present invention is to have a structure in which an integrated circuit is sealed by films. In particular, the films sealing the integrated circuit have a hollow structure; therefore the wireless chip can have a new function.
摘要翻译：本发明提供了一种无需固定在产品上即可使用的新型无线芯片。具体来说，无线芯片可通过密封步骤具有新功能。根据本发明的无线芯片的一个特征是具有其中集成电路被膜密封的结构。特别是，密封集成电路的膜具有中空结构; 因此无线芯片可以有一个新的功能。

10. 发明公开

EP1818860A2 RFID device 有权
标题翻译： RFID-Vorrichtung
公开(公告)号：EP1818860A2
公开(公告)日：2007-08-15
申请号：EP07002102.7
申请日：2007-01-31
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： Yamazaki, Shunpei , Dairiki, Koji
IPC分类号： G06K19/077 , H01B1/12 , H01L51/00 , C09D11/00 , C09K3/16 , G03C1/85
CPC分类号： G06K19/07749 , H01L24/97 , H01L2224/16237 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
摘要： It is an object to provide a semiconductor device capable of transmitting and receiving data with a reader/writer and reducing breakdown or interference due to static electricity. A semiconductor device includes a semiconductor integrated circuit (112,114), a conductive layer serving as an antenna (151) that is connected to the semiconductor integrated circuit, and a substrate (111) interposing the semiconductor integrated circuit and the conductive layer, where at least one of a layer forming the semiconductor integrated circuit, a layer (142) covering the semiconductor integrated circuit, and the substrate (104) is formed from a conductive polymer. In accordance with the above structure, wireless communication with a reader/writer is possible, and breakdown or malfunction in the semiconductor integrated circuit due to static electricity is reduced.
摘要翻译：本发明的目的是提供一种能够利用读/写器发送和接收数据的半导体器件，并减少因静电引起的击穿或干扰。半导体器件包括半导体集成电路（112,114），用作连接到半导体集成电路的天线（151）的导电层和插入半导体集成电路和导电层的衬底（111），其中至少形成半导体集成电路的层之一，覆盖半导体集成电路的层（142）和基板（104）由导电聚合物形成。根据上述结构，与读取器/写入器的无线通信是可能的，并且减少了由于静电引起的半导体集成电路中的故障或故障。

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