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1. 发明公开

EP4368316A1 METAL PASTE FOR BONDING, AND BONDED BODY AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：EP4368316A1
公开(公告)日：2024-05-15
申请号：EP22837644.8
申请日：2022-07-04
申请人： Resonac Corporation
发明人： NAKAKO, Hideo , EJIRI, Yoshinori , TANAKA, Toshiaki , ISHIKAWA, Dai , NATORI, Michiko
IPC分类号： B22F9/00 , B22F1/00 , B22F7/08 , H01L21/52
CPC分类号： B22F1/00 , B22F7/08 , B22F9/00 , H01L21/52
摘要： A metal paste for bonding contains metal particles, a dispersion medium, and a sintering accelerator, the metal particles contain copper particles, the sintering accelerator includes a coordinating compound having electron back donation properties, and the coordinating compound is at least one type selected from the group consisting of a nitrogen-containing aromatic heterocyclic compound, an acetylene derivative, an ethylene derivative, an organic arsenic compound, and a cyanide.

2. 发明公开

EP4299216A1 COPPER PASTE FOR FORMING SINTERED COPPER PILLARS AND METHOD FOR PRODUCING BONDED BODY 审中-公开
公开(公告)号：EP4299216A1
公开(公告)日：2024-01-03
申请号：EP22771398.9
申请日：2022-03-14
申请人： RESONAC CORPORATION
发明人： NATORI, Michiko , NAKAKO, Hideo , ISHIKAWA, Dai
IPC分类号： B22F7/08 , B22F9/00 , H01B1/00 , H01B1/22 , H01L21/60 , H01R11/01 , B22F1/00 , B22F1/052 , B22F1/06
摘要： Copper paste for forming a sintered copper pillar containing copper particles and an organic dispersion medium, in which the copper paste contains first sub-micro copper particles having a volume-average particle size of 0.05 to 0.35 µm, second sub-micro copper particles having a volume-average particle size of 0.5 to 1.5 µm, and spherical micro copper particles having a volume-average particle size of 2 to 5 µm as the copper particles, a content of the first sub-micro copper particles is 40 to 70 % by mass on the basis of the total mass of the copper particles, a content of the second sub-micro copper particles is 10 to 40 % by mass on the basis of the total mass of the copper particles, and a content of the spherical micro copper particles is 15 to 45 % by mass on the basis of the total mass of the copper particles.

3. 发明公开

EP4368317A1 METAL PASTE FOR JOINING, JOINT, AND MANUFACTURING METHOD THEREFOR 审中-公开
公开(公告)号：EP4368317A1
公开(公告)日：2024-05-15
申请号：EP22837650.5
申请日：2022-07-04
申请人： Resonac Corporation
发明人： NAKAKO, Hideo , EJIRI, Yoshinori , TANAKA, Toshiaki , ISHIKAWA, Dai , NATORI, Michiko
IPC分类号： B22F9/00 , B22F1/00 , B22F7/08 , C09J9/02 , H01B1/22 , H01L21/52
CPC分类号： B22F1/00 , B22F7/08 , B22F9/00 , C09J9/02 , H01B1/22 , H01L21/52
摘要： A metal paste for bonding includes metal particles, a dispersion medium, a reducing agent, and a reduction aid, in which the metal particles contain copper particles, the reduction aid includes a coordinating compound having electron back-donation properties, the coordinating compound is at least one selected from the group consisting of an organic phosphorus compound and an organic sulfur compound, and the metal paste for bonding contains, as a reducing agent, 1.6 parts by mass or more and 10 parts by mass or less of a polyol-based compound with respect to 100 parts by mass of the total mass of the copper particles.

4. 发明公开

EP4099381A3 MEMBER CONNECTION METHOD BY MEANS OF A COPPER SINTERED FILM WITH A PLURALITY OF RADIALLY ARRANGED REGIONS AND A PLURALITY OF CONCENTRICALLY ARRANGED REGIONS 审中-实审转让
公开(公告)号：EP4099381A3
公开(公告)日：2023-07-19
申请号：EP22185781.6
申请日：2018-10-23
申请人： Resonac Corporation
发明人： NEGISHI, Motohiro , NAKAKO, Hideo , KAWANA, Yuki , ISHIKAWA, Dai , SUGAMA, Chie , EJIRI, Yoshinori
IPC分类号： H01L23/488 , H01L21/60 , H01L21/603 , B23K35/02 , B23K35/30 , B22F7/08
摘要： A member connection method for connecting a first member and a second member by means of a copper sintered compact includes: a printing step of forming a coating film (8) of a copper paste for connection in a connection region (5) of respective members (2) and (3) into a predetermined print pattern (9); a lamination step of laminating the respective members (2) and (3) with the coating film (8) interposed therebetween; and a sintering step of sintering the coating film (8) to form a copper sintered compact (4) and connecting the respective members (2) and (3) by means of this copper sintered compact (4), in which in the printing step, a coating film-formed region (10) in which the coating film (8) is formed and a coating film non-formed region (20) in which the coating film (8) is not formed are formed in the print pattern (9), and the coating film-formed region (10) is divided into a plurality of radial regions (12a) to (12c) and a plurality of concentric regions (13a) and (13b) by means of a plurality of line-shaped regions (21a) to (21c) provided so as to connect various points A to D which are separated apart from one another in the marginal part (6) of the connection region (5). The connection region (5) may be a rectangular-shaped region, and the coating film-formed region (10) may include regions disposed correspondingly to the corners (R1) to (R4) of the connection region (5). The plurality of the regions (12a-12c, 13a-13b) in the coating film-formed region (10) may have larger areas as the regions (12a-12c, 13a-13b) are disposed at positions closer to the marginal part of the connection region (5). In an embodiment, the coating film-formed region (10) includes division regions (11) and corner regions (14), wherein the division regions (11) include radial regions (12), concentric regions (13) and corner vicinity regions (19). Examples of the respective members (2) and (3) include semiconductor elements such as an IGBT, a diode, a Schottky barrier diode, an MOS-FET, a thyristor, a logic circuit, a sensor, an analog integrated circuit, an LED, a semiconductor laser, and a transmitter; substrates for mounting semiconductor elements such as a lead frame, a metal plate-attached ceramic substrate (for example, a DBC), and an LED package; members for power feeding such as a copper ribbon, a metal block, and a terminal; a heat radiation plate; and a water cooling plate. The copper paste for connection includes metal particles and a dispersing medium, wherein the metal particles may include submicron copper particles (of various shapes, preferably of a spherical shape, an approximately spherical shape or a flake shape), micro-copper particles (of various shapes, preferably of a flake shape) and other metal particles, for example, particles of nickel, silver, gold, palladium or platinum. In this member connection method, since a plurality of regions in the coating film-formed region (10) includes regions that are arranged radially (12a-12c) and regions that are arranged concentrically (13a-13b), it is possible to efficiently release air out of the connection region (5) by means of the coating film non-formed region (10) while uniformly expanding the coating film (8) in the connection region (5). Therefore, a void-suppressing effect can be sufficiently secured.

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