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1. 发明公开

EP3835793A1 CERAMIC PROBE HEAD FOR AN AIR DATA PROBE 审中-公开
公开(公告)号：EP3835793A1
公开(公告)日：2021-06-16
申请号：EP20205705.5
申请日：2020-11-04
申请人： ROSEMOUNT AEROSPACE INC.
发明人： SANDEN, Christopher , ISEBRAND, Scott D. , SEIDEL, Greg
IPC分类号： G01P5/165 , B64D15/12 , G01F1/46
摘要： A probe head (100) for an air data probe includes a ceramic body (116) and a heater (118) embedded within the ceramic body (116).

2. 发明公开

EP3614116A1 PRESSURE SENSORS AND METHODS OF MAKING PRESSURE SENSORS 有权
公开(公告)号：EP3614116A1
公开(公告)日：2020-02-26
申请号：EP19193204.5
申请日：2019-08-22
申请人： ROSEMOUNT AEROSPACE INC.
发明人： SANDEN, Christopher , McTIGHE, James Joseph , HUYNH, Cuong Tho
IPC分类号： G01L13/02 , G01L19/00 , G01L19/06
摘要： A pressure sensor (100) includes a MEMS pressure transducer (102) with a pressure sensing diaphragm (113) and sensor elements (108, 110), an isolator diaphragm (136, 152) spaced apart from the pressure sensing diaphragm (113), and a ceramic header body (104). The ceramic header body (104) has an electrical conductor (168, 170) and transducer aperture (134) with the MEMS pressure transducer (102) supported therein. The isolator diaphragm (136, 152) is coupled to the MEMS pressure transducer (102) by a fluid (106, 107) and is sealably fixed to the ceramic header body (104). The ceramic header body (104) bounds the fluid (106, 107) and the electrical conductor (168, 170) electrically connects the MEMS pressure transducer (102) with the external environment.

3. 发明公开

EP3196620A1 COMPACT OR MINIATURE HIGH TEMPERATURE DIFFERENTIAL PRESSURE SENSOR CAPSULE 审中-公开
标题翻译：紧凑型或微型高温差压传感器胶囊
公开(公告)号：EP3196620A1
公开(公告)日：2017-07-26
申请号：EP17151684.2
申请日：2017-01-16
申请人： Rosemount Aerospace Inc.
发明人： SANDEN, Christopher , ERIKSEN, Odd Harald Steen
IPC分类号： G01L13/02 , G01L19/00 , G01L19/04
CPC分类号： G01L13/06 , G01L13/026 , G01L19/0046 , G01L19/0084 , G01L19/04
摘要： A differential pressure sensor includes a body having a first end, a second end, and a wall. The first end and second end include isolator diaphragms (36, 42) connected to external first and second process fluid inlets. A MEMS pressure sensor (10) including a pressure sensing diaphragm inside the cylinder has first and second sides coupled to the first and second isolator diaphragms by first and second fill fluid volumes. Sensor elements (20) on the diaphragm are configured to provide, via associated sensor circuitry, an indication of deflection due to pressure differences between the first and second fill volumes. Electrical and fill fluid connections to the differential pressure sensor are made through radial connections in the wall of the body.
摘要翻译：差压传感器包括具有第一端，第二端和壁的主体。第一端和第二端包括连接到外部第一和第二过程流体入口的隔离膜片（36,42）。包括缸体内的压力感测隔膜的MEMS压力传感器（10）具有通过第一和第二填充流体体积耦合到第一和第二隔离膜片的第一和第二侧。隔膜上的传感器元件（20）被配置为经由关联的传感器电路提供由于第一和第二填充体积之间的压力差引起的偏转的指示。到差压传感器的电和填充液体连接通过身体壁上的径向连接进行。

4. 发明公开

EP3764072A1 COMPACT OR MINIATURE HIGH TEMPERATURE DIFFERENTIAL PRESSURE SENSOR CAPSULE 有权
公开(公告)号：EP3764072A1
公开(公告)日：2021-01-13
申请号：EP20194294.3
申请日：2017-01-16
申请人： ROSEMOUNT AEROSPACE INC.
发明人： SANDEN, Christopher , ERIKSEN, Odd Harald Steen
IPC分类号： G01L13/02 , G01L19/00 , G01L19/04
摘要： A differential pressure sensor (30) comprising a header (32) with a first end, a second end, and a side wall and an interior cavity with a central hole extending from the second end to the interior cavity; a first isolator plate (34) with a central hole attached to the first end of the header (32); a first isolator diaphragm (36) attached to the first isolator plate; a second isolator plate (40) with a central hole attached to the second end of the header; a second isolator diaphragm (42) attached to the second isolator plate (40); a polymer chamber (48) positioned in the interior cavity of the header (32); a polymer spacer (46) with a central hole over the polymer chamber (48); a sensor stack in the interior cavity in the header (32) comprising: a MEMS pressure sensor (10) positioned within the polytherimid chamber (48) the MEMS pressure sensor (10) comprising a silicon diaphragm (D) with a top surface and a bottom surface attached to a silicon backup wafer (14) with a central hole; a first pedestal (50) with a central hole; and a second pedestal (52) with a central hole attached to a bottom of the interior cavity in the header; wherein the central holes of the second isolator plate (40), the header (32), the second pedestal (52), the first pedestal (50), and the silicon backup wafer (14) are aligned such that the bottom surface of the silicon diaphragm (D) has a direct line of sight and is fluidly connected to the second isolator diaphragm (42) and wherein the central holes of the polymer spacer (46) and the first isolator plate (34) are aligned such that the top surface of the diaphragm (D) has a direct line of sight and is fluidly connected to the first isolator diaphragm (36); and sensor elements on the diaphragm (D) configured to provide, via sensor circuitry, connected to the sensor to provide an indication of deflection of the diaphragm (D) due to pressure differences between the first and second pressures (P1, P2) applied to the first and second isolator diaphragms (36, 42) respectively, wherein electrical connections and fill fluid connections to the differential pressure sensor (30) are made through radial connections in the wall of the header (32).

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