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1. 发明授权

EP1258307B1 System and method of marking materials for automated processing 有权
标题翻译：装置和用于标记为自动处理材料的方法
公开(公告)号：EP1258307B1
公开(公告)日：2008-10-29
申请号：EP02253439.0
申请日：2002-05-16
申请人： Precision Automation, Inc.
发明人： Dick, Spencer B. , Malone, Douglas J. , Lankamp, Jan , Lee, David , Morgan, David A.
IPC分类号： B23D59/00 , B23D47/04 , B27B1/00
CPC分类号： B23D47/042 , B23D59/001 , B23D59/008

2. 发明公开

EP1258307A3 System and method of marking materials for automated processing 有权
标题翻译：装置和用于标记为自动处理材料的方法
公开(公告)号：EP1258307A3
公开(公告)日：2006-02-15
申请号：EP02253439.0
申请日：2002-05-16
申请人： Precision Automation, Inc.
发明人： Dick, Spencer B. , Malone, Douglas J. , Lankamp, Jan , Lee, David , Morgan, David A.
IPC分类号： B23D59/00 , B23D47/04 , B27B1/00
CPC分类号： B23D47/042 , B23D59/001 , B23D59/008
摘要： A marking assembly for marking feature locations (20) of a material (16) and an automated processing system that uses input from the marking assembly to process the material. Feature locations such as defect positions (20) and the size of the material are measured with an optical measuring device (18). The optical measuring device sends and receives light along a light path (26) that is substantially parallel to a processing dimension (22) of the material (16). A user manually interrupts (70) the light path (26) at a feature location (20), sending light from the feature location to the optical measuring device (18). The optical measuring device (18) measures the feature location from the light received from the feature location and sends the feature location to a processor (24). The processor (24) automatically positions the material relative to a modifying device (eg saw 32), based on the feature location.

3. 发明公开

EP1258307A2 System and method of marking materials for automated processing 有权
标题翻译：装置和用于标记为自动处理材料的方法
公开(公告)号：EP1258307A2
公开(公告)日：2002-11-20
申请号：EP02253439.0
申请日：2002-05-16
申请人： Precision Automation, Inc.
发明人： Dick, Spencer B. , Malone, Douglas J. , Lankamp, Jan , Lee, David , Morgan, David A.
IPC分类号： B23D59/00 , B23D47/04 , B27B1/00
CPC分类号： B23D47/042 , B23D59/001 , B23D59/008
摘要： A marking assembly for marking feature locations (20) of a material (16) and an automated processing system that uses input from the marking assembly to process the material. Feature locations such as defect positions (20) and the size of the material are measured with an optical measuring device (18). The optical measuring device sends and receives light along a light path (26) that is substantially parallel to a processing dimension (22) of the material (16). A user manually interrupts (70) the light path (26) at a feature location (20), sending light from the feature location to the optical measuring device (18). The optical measuring device (18) measures the feature location from the light received from the feature location and sends the feature location to a processor (24). The processor (24) automatically positions the material relative to a modifying device (eg saw 32), based on the feature location.
摘要翻译：用于标记的物质（16）的特征位置（20）和上自动处理系统做了标记组件使用输入从标记组件来处理所述材料。特征位置：如缺陷位置（20）和所述材料的尺寸被测量与光学测量装置（18）。光学测量装置发送和沿光路（26）接收光并大致平行于所述材料（16）的加工尺寸（22）。用户手动中断（70）的位置处的特征（20）的光路（26）中，从特征位置发送光给光测量装置（18）。光学测量装置（18）测量从特征位置接收到的光的特征的位置和发送特征位置到处理器（24）。所述处理器（24），自动定位相对于改性装置（例如锯32），基于所述特征的位置的材料。

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