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    • 2. 发明公开
    • SELF RISING BOARD MOLDING
    • EP4324970A2
    • 2024-02-21
    • EP23217442.5
    • 2020-03-16
    • Piana Nonwovens
    • Hollis, AndyDefranks, Michael StephenMccann, EricJafari, MehranAndriessen, HeliasLim, Sang-HoonPiana, AndreasBorgatti, Alfio
    • D04H1/54
    • A three-dimensional component is produced in a simplified molding operation. Expandable substrates, which are referred to as blanks, are created by compressing thermobonded nonwovens after heating the binder material above its melting temperature, and then cooling the compressed nonwovens so that the binder material hardens and holds the fibers of the nonwoven together in a compressed configuration with stored kinetic energy. Boards can be formed by laminating two or more blanks together and/or by laminating the blanks with other materials, including non-expendable materials. A mold for the component to be manufactured can be partially filled with a number of boards (or blanks) in a stacked, vertically, adjacent or even random orientation. In addition, the boards or blanks may be cut to create desired shapes of parts that can be placed in the mold. Upon application of heat to the boards or blanks or parts in the mold, the binder material is melted so as to allow the nonwoven material to expand in one or more directions, and thereby fill all or part of the mold. Upon cooling, the binder material again hardens, and the molded component is retrieved from the mold. Depending on the nature of the boards used, i.e., they may be the same or different from each other both in materials and configuration, physical attributes of the molded component can be achieved in a tailored fashion. For example, a seat or mattress may include an expanded and softer top layer of nonwoven, under which is a relatively harder layer of vertically lapped nonwoven or other material, etc. Steam heating for expanding the self-rising board is improved by controlling the rate of admission of the steam to the mold which is used to expand the expandable substrates, as well as applying a vacuum pressure to the mold after expansion of the expandable substrates.