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    • 3. 发明公开
    • Key sheet
    • 关键表
    • EP1775741A1
    • 2007-04-18
    • EP06021010.1
    • 2006-10-06
    • POLYMATECH CO., LTD.
    • Koyano, ShigeruNakanishi, YutakaOzawa, Motoki
    • H01H9/52
    • H01H13/702H01H9/52H01H2239/072
    • Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A base sheet (13) of a key sheet (12) is provided with a heat diffusion sheet (6, 23). The heat diffusion sheet (6, 23) is provided with a graphite sheet (7) and a resin film (8a, 8b) and, in some cases, a thin metal plate (22). The base sheet (13) itself thus constitutes the heat diffusion sheet (6), so even if no member for heat diffusion is provided between a board (15) and the key sheet (12), it is possible to diffuse local heat generated by a semiconductor device (15b) in the face direction of the base sheet (13). Thus, with the key sheet (12), it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses and to meet the requirement for a reduction in the thickness and further in weight of electronic apparatuses.
    • 公开了一种有效散布由安装在板上的装置产生的局部热量的按键板。 按键板(12)的基片(13)具有热扩散片(6,23)。 热扩散片(6,23)具有石墨片(7)和树脂膜(8a,8b)以及在一些情况下的薄金属板(22)。 因此,基片13自身构成热扩散片6,所以即使在基板15与按键板12之间不设置热扩散用部件,也能够扩散由基板13产生的局部热量 半导体器件(15b)在基片(13)的面方向上。 因此,利用按键板(12),可以满足热扩散的需要,以消除电子设备中的局部蓄热,并且满足电子设备的厚度减小和重量进一步减小的要求。