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1. 发明授权

EP3168326B1 RESIN PLATING METHOD 有权转让
公开(公告)号：EP3168326B1
公开(公告)日：2020-07-29
申请号：EP15819437.3
申请日：2015-04-24
申请人： Okuno Chemical Industries Co., Ltd.
发明人： NAGAMINE, Shingo , KITA, Koji , OTSUKA, Kuniaki
IPC分类号： C23C18/24 , C23C18/30 , C23C18/16 , C25D5/14 , C23C18/20 , C25F1/00 , C23C18/32 , C25D3/38

2. 发明公开

EP3327175A1 COMPOSITION FOR ETCHING TREATMENT OF RESIN MATERIAL 有权
公开(公告)号：EP3327175A1
公开(公告)日：2018-05-30
申请号：EP17208652.2
申请日：2014-10-16
申请人： Okuno Chemical Industries Co., Ltd.
发明人： NAGAMINE, Shingo , KITA, Koji , OTSUKA, Kuniaki
IPC分类号： C23C18/24 , C09K13/04 , C23C18/16 , C08J7/14 , C23F1/14 , C23F3/02 , C25B1/28 , C23C18/20 , C23C18/30 , H01L21/02 , H01L21/306
摘要： The present invention relates to a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more with an upper limit of 15 mol/L, and the aqueous solution satisfying the following condition (1):
(1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more,
wherein the aqueous solution optionally further satisfies at least one of the following conditions (2) and (3):
(2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and
(3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L.

3. 发明公开

EP3584352A1 COMPOSITION FOR PRETREATMENT FOR ELECTROLESS PLATING, PRETREATMENT METHOD FOR ELECTROLESS PLATING, AND ELECTROLESS PLATING METHOD 有权
公开(公告)号：EP3584352A1
公开(公告)日：2019-12-25
申请号：EP18806217.8
申请日：2018-05-23
申请人： Okuno Chemical Industries Co., Ltd.
发明人： NAGAMINE, Shingo , KITA, Koji
IPC分类号： C23C18/30 , C23C18/24
摘要： The present invention provides a pretreatment composition for electroless plating, a pretreatment method, and an electroless plating method that exhibit high plating deposition performance without using harmful chromic acid and expensive palladium, while reducing the number of steps. The present invention provides a pretreatment composition for electroless plating that contains 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions.

4. 发明公开

EP2937446A1 COMPOSITION FOR ETCHING TREATMENT OF RESIN MATERIAL 有权转让
标题翻译： ZUSAMMENSETZUNG ZURÄTZBEHANDLUNGEINES HARZMATERIALS
公开(公告)号：EP2937446A1
公开(公告)日：2015-10-28
申请号：EP14855525.3
申请日：2014-10-16
申请人： Okuno Chemical Industries Co. Ltd
发明人： NAGAMINE, Shingo , KITA, Koji , OTSUKA, Kuniaki
IPC分类号： C23C18/24 , C09K13/04 , C09K13/06 , C23C18/30 , C25B1/30
CPC分类号： C09K13/00 , C08J7/14 , C09K13/04 , C23C18/1641 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , C23F1/14 , C23F3/02 , C25B1/28 , C25D5/14 , H01L21/02052 , H01L21/30604
摘要： The present invention provides a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more, and the aqueous solution satisfying at least one of the following conditions (1) to (3):
(1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more,
(2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and
(3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L.
The composition for etching treatment of the present invention is a composition containing no hexavalent chromium and having excellent etching performance and good bath stability.
摘要翻译：本发明提供一种用于树脂材料的蚀刻处理的组合物，该组合物包含高锰酸盐离子浓度为0.2mmol / L以上且总酸浓度为10mol / L以上的水溶液，并且满足以下条件（1）至（3）中的至少一个：（1）含有1.5mol / L以上的有机磺酸，（2）将二价锰离子摩尔浓度设定为15以上高锰酸盐离子摩尔浓度，（3）将无水镁盐的添加量设定为0.1〜1mol / L。本发明的蚀刻处理用组合物是不含六价铬并具有优异的蚀刻性能和良好的浴稳定性的组合物。

5. 发明公开

EP4130337A1 ELECTROLESS PLATING METHOD 无效
公开(公告)号：EP4130337A1
公开(公告)日：2023-02-08
申请号：EP22188523.9
申请日：2022-08-03
申请人： Taiyo Manufacturing Co., Ltd. , OKUNO CHEMICAL INDUSTRIES CO., LTD.
发明人： OKADA, Kenta , ARIMITSU, Yasushi , TSUNETSUGU, Ryota , NAGAMINE, Shingo , KITA, Koji
IPC分类号： C23C18/20 , C23C18/16 , C23C18/24 , C23C18/36
摘要： The present invention provides an electroless plating method capable of forming a plating film that is highly adhesive to a molded resin article while exhibiting high plating deposition performance without using harmful chromic acid. The electroless plating method for a resin material, includes (1) step 1: bringing a surface to be treated of the resin material into contact with a surface conditioner, (2) step 2: after step 1, bringing the surface to be treated of the resin material into contact with a pre-treatment composition, (3) step 3: after step 2, bringing the surface to be treated of the resin material into contact with a post-treatment solution containing an inorganic acid, (4) step 4: after step 3, bringing the surface to be treated of the resin material into contact with a catalyst-adding solution, and (5) step 5: after step 4, bringing the surface to be treated of the resin material into contact with an electroless plating solution, wherein the surface conditioner contains an ether-bond-containing solvent, and the pre-treatment composition contains 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions.

6. 发明授权

EP3327176B1 COMPOSITION FOR ETCHING TREATMENT OF RESIN MATERIAL 有权
公开(公告)号：EP3327176B1
公开(公告)日：2019-06-26
申请号：EP17208657.1
申请日：2014-10-16
申请人： Okuno Chemical Industries Co., Ltd.
发明人： NAGAMINE, Shingo , KITA, Koji , OTSUKA, Kuniaki
IPC分类号： C23C18/24 , C09K13/04 , C23C18/16 , C08J7/14 , C25B1/28 , C23F1/14 , C23F3/02 , C23C18/20 , C23C18/30 , H01L21/02 , H01L21/306

7. 发明公开

EP3327176A1 COMPOSITION FOR ETCHING TREATMENT OF RESIN MATERIAL 有权
公开(公告)号：EP3327176A1
公开(公告)日：2018-05-30
申请号：EP17208657.1
申请日：2014-10-16
申请人： Okuno Chemical Industries Co., Ltd.
发明人： NAGAMINE, Shingo , KITA, Koji , OTSUKA, Kuniaki
IPC分类号： C23C18/24 , C09K13/04 , C23C18/16 , C08J7/14 , C25B1/28 , C23F1/14 , C23F3/02 , C23C18/20 , C23C18/30 , H01L21/02 , H01L21/306
CPC分类号： C09K13/00 , C08J7/14 , C09K13/04 , C23C18/1641 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , C23F1/14 , C23F3/02 , C25B1/28 , C25D5/14 , H01L21/02052 , H01L21/30604
摘要： The present invention relates to a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more with an upper limit of 15 mol/L, and the aqueous solution satisfying the following condition (2):
(2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and
wherein the aqueous solution optionally further satisfies at least one of the following conditions (1) and (3):
(1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more, and
(3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L.

8. 发明授权

EP2937446B1 COMPOSITION FOR ETCHING TREATMENT OF RESIN MATERIAL 有权转让
公开(公告)号：EP2937446B1
公开(公告)日：2018-06-13
申请号：EP14855525.3
申请日：2014-10-16
申请人： OKUNO CHEMICAL INDUSTRIES CO., LTD.
发明人： NAGAMINE, Shingo , KITA, Koji , OTSUKA, Kuniaki
IPC分类号： C23C18/24 , C09K13/04 , C23C18/16 , C08J7/14 , C25B1/28 , C23C18/20 , C23F1/14 , C23F3/02 , C23C18/30 , H01L21/02 , H01L21/306
CPC分类号： C09K13/00 , C08J7/14 , C09K13/04 , C23C18/1641 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , C23F1/14 , C23F3/02 , C25B1/28 , C25D5/14 , H01L21/02052 , H01L21/30604
摘要： The present invention relates to a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more with an upper limit of 15 mol/L, and the aqueous solution satisfying the following condition (2): (2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and wherein the aqueous solution optionally further satisfies at least one of the following conditions (1) and (3): (1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more, and (3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L.

9. 发明公开

EP3168326A1 RESIN PLATING METHOD 有权转让
标题翻译：树脂镀膜方法
公开(公告)号：EP3168326A1
公开(公告)日：2017-05-17
申请号：EP15819437.3
申请日：2015-04-24
申请人： Okuno Chemical Industries Co. Ltd
发明人： NAGAMINE, Shingo , KITA, Koji , OTSUKA, Kuniaki
IPC分类号： C23C18/24 , C23C18/30
摘要： The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.
摘要翻译：本发明提供一种使用含有锰作为有效成分的蚀刻槽的树脂电镀方法，该方法即使在连续使用期间也能够保持稳定的蚀刻性能。树脂电镀方法包括：蚀刻步骤，其使用含树脂材料的物品作为待处理对象并且使用含有锰的酸性蚀刻浴蚀刻物品; 催化剂施加步骤，其使用钯作为催化剂金属; 和无电电镀步骤; 并且该方法还包括将酸性蚀刻浴中的钯浓度保持在100mg / L以下的步骤。

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