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1. 发明公开

EP2867576A1 LED RETROFIT LAMP AND PROCESS FOR MANUFACTURING THE SAME 有权转让
标题翻译： LED改装灯泡在HERSTELLUNGSVERFAHREN
公开(公告)号：EP2867576A1
公开(公告)日：2015-05-06
申请号：EP13733277.1
申请日：2013-06-27
申请人： OSRAM GmbH
发明人： LI, Hao , CHEN, Xiaomian , CHEN, Peng , LIU, Tingming
IPC分类号： F21K99/00 , F21V19/00 , F21Y101/02
CPC分类号： F21V19/009 , F21K9/27 , F21K9/272 , F21K9/90 , F21V19/003 , F21V19/004 , F21Y2103/10 , F21Y2115/10 , Y02B20/386 , Y10T29/49826
摘要： Various embodiments may relate to an LED retrofit lamp, including a lamp tube, an LED light engine disposed in the lamp tube, and end caps arranged at two open ends of the lamp tube, the LED light engine including a circuit board and at least one light source disposed on the circuit board. The LED retrofit lamp further includes one pair of retaining structures fixed at two opposite ends of the circuit board, respectively, and at least one pair of elastic tension structures connected to the retaining structures. The elastic tension structure goes through the end cap from one side of the end cap and is locked at the other side of the end cap. In addition, various embodiments may also relate to a process for manufacturing the LED retrofit lamp.
摘要翻译：各种实施例可以涉及一种LED改装灯，其包括灯管，设置在灯管中的LED灯引擎，以及设置在灯管的两个开放端的端盖，所述LED光引擎包括电路板和至少一个光源设置在电路板上。 LED改装灯还包括分别固定在电路板的两个相对端的一对保持结构以及连接到保持结构的至少一对弹性张力结构。弹性张力结构从端盖的一侧穿过端盖并锁定在端盖的另一侧。此外，各种实施例还可以涉及用于制造LED改装灯的方法。

2. 发明公开

EP2737534A1 AN LED LIGHT-EMITTING MODULE AND A METHOD FOR MANUFACTURING THE SAME 有权转让
标题翻译： LED-LICHT-EMITTIERENDES MODUL UND VERFAHREN ZU SEINER HERSTELLUNG
公开(公告)号：EP2737534A1
公开(公告)日：2014-06-04
申请号：EP12753701.7
申请日：2012-08-24
申请人： OSRAM GmbH
发明人： CHEN, Peng , LIU, Tingming , MING, Yusheng , ZHONG, Chuanpeng
IPC分类号： H01L27/15
摘要： The present invention relates to an LED light-emitting module comprising: a base board (1) with at least one groove (2); at least one printed circuit board (3) with an array of LED chips (4), respectively arranged in the groove (2), wherein respective LED chips (4) are directly mounted on the printed circuit board (3) through a COB process, and the LED light-emitting module further comprising with a reflector (5) on a side wall of the groove (2) to reflect light from the LED chips (4). In addition, the present invention further relates to a method for manufacturing the LED light-emitting module. The LED light-emitting module according to the present invention can produce a polarizing effect, and therefore is particularly suited to the street illumination; moreover, the LED light-emitting module has the advantages of a simple structure, a low cost and a small thermal resistance.
摘要翻译：本发明涉及一种LED发光模块，包括：具有至少一个凹槽（2）的基板（1）; 至少一个具有分别布置在凹槽（2）中的LED芯片阵列（4）的印刷电路板（3），其中相应的LED芯片（4）通过COB工艺直接安装在印刷电路板（3）上，并且所述LED发光模块还包括在所述凹槽（2）的侧壁上具有反射器（5）以反射来自所述LED芯片（4）的光。此外，本发明还涉及一种用于制造LED发光模块的方法。根据本发明的LED发光模块可以产生偏振效果，因此特别适用于街道照明; 此外，LED发光模块具有结构简单，成本低，热阻小的优点。

3. 发明公开

EP2694868A1 LIGHT-EMITTING DEVICE 有权转让
标题翻译：发光装置
公开(公告)号：EP2694868A1
公开(公告)日：2014-02-12
申请号：EP12726412.5
申请日：2012-06-04
申请人： OSRAM GmbH
发明人： CHEN, Peng , LI, Hao , LIU, Tingming , ZHENG, Shengmei
IPC分类号： F21V3/04 , F21V17/16 , F21V19/00 , F21S4/00 , F21Y101/02 , F21Y103/00
CPC分类号： F21V17/16 , F21S4/28 , F21V3/062 , F21V17/164 , F21V19/004 , F21V19/0045 , F21V29/70 , F21V29/75 , F21V29/76 , F21Y2103/10 , F21Y2115/10
摘要： A light-emitting device having a cover (1), a heat sink (2) and a light-emitting assembly (3), wherein the heat sink (2) has at least one first locking part (a), the cover (1) has at least one second locking part (b) corresponding to the first locking part (a), the second locking part (b) engages with the first locking part (a) to form an enclosed cavity (5) for the light-emitting assembly (3), and the second locking part (b) has a pressing part (b1) pressing the light-emitting assembly (3) against the heat sink (2).
摘要翻译：发光装置技术领域本发明涉及一种发光装置，其包括一个盖体（1），一个散热器（2）和一个发光组件（3），其中散热器（2）具有至少一个第一锁定部件 a）中，盖（1）具有对应于第一锁定部件（a）的至少一个第二锁定部件（b），第二锁定部件（b）与第一锁定部件（a）接合以形成封闭腔体（3），并且第二锁定件（b）具有将发光组件（3）压靠在散热器（2）上的按压部件（b1）。在根据本发明的发光装置中，发光组件（3）能够在不使用紧固构件或粘合剂的情况下紧密地固定在其中，由此减少了部件数量并且便于安装和维护。

4. 发明授权

EP2786181B1 LENS AND ILLUMINATING DEVICE 有权转让
公开(公告)号：EP2786181B1
公开(公告)日：2018-11-21
申请号：EP12798670.1
申请日：2012-11-29
申请人： OSRAM GmbH
发明人： MING, Yusheng , CHEN, Peng , LI, Aiai , CHEN, Xiaomian
IPC分类号： G02B3/00 , H01L33/58
CPC分类号： H01L33/58 , G02B3/0056 , G02B19/0009 , G02B19/0061 , H01L2933/0091
摘要： The present invention relates to lens (1), for an illuminating device, comprising a base (2) and a microlens array arranged on the base (2), wherein the microlens array comprises a plurality of microlenses (3), respective microlens (3) has a light incident surface (4) facing a light source (S) of the illuminating device and a light emergent surface (5) facing away from the light source (S), wherein the light incident surface (4) is a first curved surface (4) that defines a cavity (R) opening to the light source (S), and the light emergent surface (5) is a second curved surface (5) configured in a such a manner that light (L) incident through the first curved surface (4) emerges in a uniform diffuse transmission manner. Light emerging from the lens can be diffused on an object to be illuminated and realize an expected light distribution effect. In addition, the present invention further relates to an illuminating device with the lens.

5. 发明公开

EP2745659A1 ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE ELECTRONIC MODULE 审中-公开
标题翻译： ELEKTRONISCHES MODUL，BELEUCHTUNGSVORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG DES ELEKTRONISCHEN MODULS
公开(公告)号：EP2745659A1
公开(公告)日：2014-06-25
申请号：EP12758781.4
申请日：2012-08-10
申请人： OSRAM GMBH
发明人： CHEN, Peng , CHEN, Xiaomian , FENG, Yaojun , LI, Hao
IPC分类号： H05K3/28 , H05K1/02
CPC分类号： H05K1/0206 , H05K3/0061 , H05K3/284 , H05K2201/10106 , H05K2203/10 , H05K2203/1147 , H05K2203/1316 , H05K2203/1327 , Y10T29/49146
摘要： An electronic module to be mounted on a mounting surface may include: a circuit board provided with a heat source, wherein a thermal via is formed through the circuit board and is in thermal contact with the heat source; and a potting material packaging the circuit board at least at the other side opposite to one side of heat source, wherein the potting material has a recess formed in at least part of an area corresponding to the thermal via at the other side of the circuit board and a thermal conductive material, which is thermal-conductively connected to the mounting surface, is filled in the recess.
摘要翻译：安装在安装表面上的电子模块可以包括：设置有热源的电路板，其中通过电路板形成热通孔并与热源热接触; 以及灌封材料至少在与热源的一侧相对的另一侧封装电路板，其中灌封材料具有形成在与电路板另一侧的热通孔对应的区域的至少一部分中的凹部并且导热连接到安装表面的导热材料填充在凹部中。

6. 发明授权

EP2737534B1 LED LIGHT-EMITTING MODULE AND A METHOD FOR MANUFACTURING THE SAME 有权转让
公开(公告)号：EP2737534B1
公开(公告)日：2020-01-08
申请号：EP12753701.7
申请日：2012-08-24
申请人： OSRAM GmbH
发明人： CHEN, Peng , LIU, Tingming , MING, Yusheng , ZHONG, Chuanpeng
IPC分类号： F21K9/00 , F21K9/90 , H01L25/075 , H01L33/00 , H01L27/15 , H01L33/60

7. 发明授权

EP2780627B1 LED ILLUMINATING DEVICE 有权
标题翻译： LED照明装置
公开(公告)号：EP2780627B1
公开(公告)日：2017-11-08
申请号：EP12799092.7
申请日：2012-11-15
申请人： OSRAM GmbH
发明人： MING, Yusheng , CHEN, Peng , YUAN, Haiping , GUI, Hui
IPC分类号： B61L5/18 , F21V13/04 , F21K9/60 , F21K9/62 , F21Y115/10
CPC分类号： F21V13/04 , B61L5/1845 , B61L5/1854 , B61L2207/02 , F21K9/60 , F21K9/62 , F21Y2115/10

8. 发明授权

EP2867576B1 LED RETROFIT LAMP AND PROCESS FOR MANUFACTURING THE SAME 有权转让
标题翻译： LED改装灯和方法
公开(公告)号：EP2867576B1
公开(公告)日：2016-06-01
申请号：EP13733277.1
申请日：2013-06-27
申请人： OSRAM GmbH
发明人： LI, Hao , CHEN, Xiaomian , CHEN, Peng , LIU, Tingming
IPC分类号： F21K99/00 , F21V19/00 , F21Y115/10 , F21Y103/10
CPC分类号： F21V19/009 , F21K9/27 , F21K9/272 , F21K9/90 , F21V19/003 , F21V19/004 , F21Y2103/10 , F21Y2115/10 , Y02B20/386 , Y10T29/49826
摘要： Various embodiments may relate to an LED retrofit lamp, including a lamp tube, an LED light engine disposed in the lamp tube, and end caps arranged at two open ends of the lamp tube, the LED light engine including a circuit board and at least one light source disposed on the circuit board. The LED retrofit lamp further includes one pair of retaining structures fixed at two opposite ends of the circuit board, respectively, and at least one pair of elastic tension structures connected to the retaining structures. The elastic tension structure goes through the end cap from one side of the end cap and is locked at the other side of the end cap. In addition, various embodiments may also relate to a process for manufacturing the LED retrofit lamp.

9. 发明授权

EP2694868B1 LIGHT-EMITTING DEVICE 有权转让
公开(公告)号：EP2694868B1
公开(公告)日：2015-11-25
申请号：EP12726412.5
申请日：2012-06-04
申请人： OSRAM GmbH
发明人： CHEN, Peng , LI, Hao , LIU, Tingming , ZHENG, Shengmei
IPC分类号： F21V3/04 , F21V17/16 , F21V19/00 , F21S4/00 , F21Y101/02 , F21Y103/00
CPC分类号： F21V17/16 , F21S4/28 , F21V3/062 , F21V17/164 , F21V19/004 , F21V19/0045 , F21V29/70 , F21V29/75 , F21V29/76 , F21Y2103/10 , F21Y2115/10
摘要： A light-emitting device having a cover (1), a heat sink (2) and a light-emitting assembly (3), wherein the heat sink (2) has at least one first locking part (a), the cover (1) has at least one second locking part (b) corresponding to the first locking part (a), the second locking part (b) engages with the first locking part (a) to form an enclosed cavity (5) for the light-emitting assembly (3), and the second locking part (b) has a pressing part (b1) pressing the light-emitting assembly (3) against the heat sink (2).

10. 发明公开

EP2867580A1 ILLUMINATING DEVICE 审中-公开
标题翻译：照明设备
公开(公告)号：EP2867580A1
公开(公告)日：2015-05-06
申请号：EP13736811.4
申请日：2013-06-27
申请人： OSRAM GmbH
发明人： LI, Hao , CHEN, Xiaomian , CHEN, Peng , FENG, ChengCheng
IPC分类号： F21V19/00 , F21K99/00 , F21S4/00 , F21Y103/00 , F21Y101/02
CPC分类号： F21V19/0055 , F21K9/275 , F21V15/015 , F21Y2103/10 , F21Y2115/10
摘要： Various embodiments may relate to an illuminating device including a housing, an electronic assembly accommodated in the housing, and at least one adjusting mechanism arranged on at least one side of the electronic assembly, the adjusting mechanism is in operative connection with the electronic assembly and is operated from outside of the housing so that the electronic assembly is tensionedly held in the housing.
摘要翻译：本发明涉及一种具有壳体（1）和容纳在壳体（1）中的电子组件（2）的照明装置（100），其特征在于还包括至少一个调节机构（3）所述电子组件（2）的一侧，所述调节机构（3）与所述电子组件（2）可操作地连接并且可以从所述壳体（1）的外部操作，使得所述电子组件（2）被张紧地保持在外壳（1）中。

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