会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明公开
    • Electronic device and producing method thereof
    • Elektronische Vorrichtung und Herstellungsverfahrendafür
    • EP2775623A2
    • 2014-09-10
    • EP13192275.9
    • 2013-11-11
    • OMRON CORPORATION
    • Nishikawa, KazuyoshiSanda, TakaakiImabayashi, TomonariInoue, DaisukeSugimoto, MakotoKishimoto, YukitakaHiratsuka, MikioKameda, TakamasaHonjo, TakuyaHirao, Koichi
    • H03K17/945
    • H03K17/9505
    • A post-sealing stress remaining in an electronic device is relaxed to detect the approach or presence of a detection target with stable accuracy. An electronic device includes a detection unit (210) configured to detect the approach or presence of the detection target, an electronic component that is electrically connected to the detection unit (210), a case member configured to accommodate the detection unit and the electronic component therein, and a sealing resin (120) that is formed in the case member. The sealing resin (120) includes a thermosetting resin portion (121) that is formed in the case member so as to seal the detection unit, and a thermoplastic resin portion (122) that is formed so as to seal a portion other than the thermosetting resin portion (121) in the case member. The thermoplastic resin portion (122) has a hardness (Shore D) of 60 or less.
    • 电子设备中残留的密封后应力被放宽,以检测出具有稳定精度的检测目标的接近或存在。 电子设备包括被配置为检测检测对象的接近或存在的检测单元(210),电连接到检测单元(210)的电子部件,被配置为容纳检测单元和电子部件 以及形成在所述壳体部件中的密封树脂(120)。 密封树脂(120)包括形成在壳体构件中以密封检测单元的热固性树脂部分(121),以及热塑性树脂部分(122),其形成为密封热固性树脂 树脂部分(121)。 热塑性树脂部(122)的硬度(肖氏D)为60以下。
    • 8. 发明公开
    • Proximity sensor
    • 接近传感器
    • EP2355355A3
    • 2014-03-12
    • EP11153212.3
    • 2011-02-03
    • Omron Corporation
    • Mizusaki, HiroyukiInoue, DaisukeKutsuhara, Susumu
    • H03K17/95
    • H03K17/9505
    • A proximity sensor includes a circuit board (30) provided with a processing circuit, a light emitting device (32) mounted on the surface (30a) of the circuit board (30), and a light-transmitting cylindrical light guide (43) surrounding the portion of the circuit board (30) having the light emitting device (32) mounted thereon and guiding the outgoing light from the light emitting device (32) to be emitted to outside. The cylindrical light guide (43) includes the first light emitting surface as the first light outgoing region causing the light emitted from the light emitting device (32) to pass therethrough and directly emitting the light to outside, a reflective surface (43a1) reflecting the light emitted from the light emitting device (32) to guide the light through the cylindrical light guide (43) in the circumferential direction, and the second light emitting surface (43a2) as the second light outgoing region emitting, to outside, the light reflected on the reflective surface (43a1) and propagated through the cylindrical light guide (43).
    • 一种接近传感器,包括设置有处理电路的电路板(30),安装在电路板(30)的表面(30a)上的发光器件(32),以及围绕该器件的透光圆柱形光导(43) 电路板(30)的安装有发光器件(32)的部分并且引导来自发光器件(32)的出射光被发射到外部。 圆筒形状的导光体(43)具有作为使从发光元件(32)射出的光通过并直接向外部射出的第1射出区域的第1射出面,反射面(43a1),该反射面 从发光装置32射出的光在圆周方向上通过圆筒状导光体43而引导,并且作为第二出射区域的第二发光面43a2向外部射出反射光 在反射表面(43a1)上并且通过圆柱形光导(43)传播。
    • 9. 发明公开
    • Proximity sensor
    • Näherungssensor
    • EP2355355A2
    • 2011-08-10
    • EP11153212.3
    • 2011-02-03
    • Omron Corporation
    • Mizusaki, HiroyukiInoue, DaisukeKutsuhara, Susumu
    • H03K17/95
    • H03K17/9505
    • A proximity sensor includes a circuit board (30) provided with a processing circuit, a light emitting device (32) mounted on the surface (30a) of the circuit board (30), and a light-transmitting cylindrical light guide (43) surrounding the portion of the circuit board (30) having the light emitting device (32) mounted thereon and guiding the outgoing light from the light emitting device (32) to be emitted to outside. The cylindrical light guide (43) includes the first light emitting surface as the first light outgoing region causing the light emitted from the light emitting device (32) to pass therethrough and directly emitting the light to outside, a reflective surface (43a1) reflecting the light emitted from the light emitting device (32) to guide the light through the cylindrical light guide (43) in the circumferential direction, and the second light emitting surface (43a2) as the second light outgoing region emitting, to outside, the light reflected on the reflective surface (43a1) and propagated through the cylindrical light guide (43).
    • 接近传感器包括设置有处理电路的电路板(30),安装在电路板(30)的表面(30a)上的发光器件(32)和围绕 所述电路板(30)的安装有所述发光装置(32)的部分,并且将来自所述发光装置(32)的出射光引导到外部。 圆柱形导光体43包括作为第一光出射区域的第一发光面,使从发光元件32射出的光直通光,直接将光发射到外部;反射面43a1, 从发光装置(32)发射的光沿圆周方向引导光通过圆柱形导光体(43),而作为第二光出射区域的第二发光面(43a2)向光反射的外部发射 在反射面(43a1)上并且通过圆柱形光导(43)传播。