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1. 发明公开

EP2944248A4 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ENDOSCOPE 有权
标题翻译： VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUMMENTS，HALBLEITERBAUELEMENT UND ENDOSKOP
公开(公告)号：EP2944248A4
公开(公告)日：2016-10-05
申请号：EP13871159
申请日：2013-09-12
申请人： OLYMPUS CORP
发明人： KOJIMA KAZUAKI
IPC分类号： A61B1/00 , A61B1/04 , A61B1/05 , G02B23/24 , G02B23/26 , H04N5/225 , H04N5/369 , H05K1/02 , H05K1/18 , H05K3/34 , H05K5/04
CPC分类号： H04N5/2257 , A61B1/0011 , A61B1/00124 , A61B1/051 , G02B23/2484 , H04N5/2253 , H04N5/369 , H05K1/021 , H05K1/181 , H05K1/189 , H05K3/3431 , H05K5/04 , H05K2201/055 , H05K2201/066 , H05K2201/10121 , H05K2201/10151 , H05K2203/1305 , H05K2203/302
摘要： A manufacturing method of an image pickup apparatus 1 includes a step of manufacturing an image pickup device chip 20, a step of manufacturing a wiring board 30 having first terminals 31 and second terminals 32 disposed on both sides of a first primary surface 30SA with a central flexible portion 30F intervened in between, a step of joining a heat conductive block 40 to a second primary surface 30SB of the wiring board 30, a step of joining the image pickup device chip 20 to the first terminals 31 of the wiring board 30, a step of performing solder joining of core wires 51 of a cable 50 to the second terminals 32 of the wiring board 30 by conducting heat generated by a heat tool 80 through the heat conductive block 40, a step of bending the wiring board 30, and a step of performing housing inside a frame member 70, and sealing with sealing resin 71.
摘要翻译：图像拾取装置1的制造方法包括制造图像拾取器件芯片20的步骤，制造具有第一端子31的布线板30和设置在第一主表面30SA的两侧上的第二端子32的步骤，其具有中心介于其间的柔性部分30F，将导热块40接合到布线板30的第二主表面30SB的步骤，将图像拾取装置芯片20连接到布线板30的第一端子31的步骤，通过从热传导块40导热由热工具80产生的热量，将布线基板30的芯线51焊接到布线基板30的第二端子32的步骤，使布线板30弯曲的步骤在框架构件70内执行壳体的步骤，并且用密封树脂71密封。

2. 发明公开

EP2614767A4 IMAGE PICKUP DEVICE, ENDOSCOPE TIP SECTION PROVIDED WITH THE IMAGE PICKUP DEVICE, AND ENDOSCOPE TIP UNIT 审中-公开
标题翻译：与图像记录单元EQUIPPED内窥镜末端部分和范围顶部单元图样单位
公开(公告)号：EP2614767A4
公开(公告)日：2015-09-02
申请号：EP11823414
申请日：2011-08-24
申请人： OLYMPUS CORP
发明人： KOJIMA KAZUAKI
IPC分类号： A61B1/04 , A61B1/00 , A61B1/05 , H01L27/146
CPC分类号： A61B1/05 , A61B1/00096 , A61B1/0011 , A61B1/051 , H01L27/14618 , H01L27/14625 , H01L2224/05553 , H01L2224/48091 , H01L2924/00014

3. 发明公开

EP1962333A4 SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开
标题翻译： HERSTELLUNGSVERFAHRENFÜRHALBLEITERBAUELEMENTE
公开(公告)号：EP1962333A4
公开(公告)日：2009-09-02
申请号：EP06833633
申请日：2006-11-29
申请人： OLYMPUS CORP
发明人： KOJIMA KAZUAKI
IPC分类号： H01L21/301
CPC分类号： H01L21/78
摘要： Provided is a method for manufacturing a highly reliable semiconductor device, which contributes to improvement of yield by reducing chipping or suppressing generation of chipping in a dicing step of a bonded substrate wherein different types of substrates are bonded. The semiconductor device has the bonded substrate composed of a semiconductor substrate and a different type substrate composed of a material other than that of the semiconductor bonded on the surface of the semiconductor substrate. The dicing step of making the bonded substrate into semiconductor chips is provided with a first dicing step of forming at least a groove having a depth of half or more of the thickness of the semiconductor substrate on the surface of the semiconductor substrate, and a second dicing step of cutting the entire bonded substrate along the groove to separate the bonded substrate into a plurality of semiconductor chips.
摘要翻译：本发明提供一种可靠性高的半导体装置的制造方法，该方法通过减少在贴合了不同种类的基板的贴合基板的切割工序中的碎屑的产生或破裂的产生，有助于提高成品率。该半导体器件具有由半导体衬底和由与半导体衬底表面上键合的半导体材料不同的材料构成的不同类型衬底的键合衬底。将接合衬底制作成半导体芯片的切割步骤设置有第一切割步骤和第二切割步骤，第一切割步骤至少在半导体衬底的表面上形成具有半导体衬底的厚度的一半以上的深度的凹槽，沿凹槽切割整个键合衬底以将键合衬底分离成多个半导体芯片的步骤。

4. 发明公开

EP1698267A4 CAPSULE DEVICE FOR MEDICAL USE 审中-公开
标题翻译：胶囊装置用于医疗用途
公开(公告)号：EP1698267A4
公开(公告)日：2009-01-14
申请号：EP04807084
申请日：2004-12-15
申请人： OLYMPUS CORP
发明人： KOJIMA KAZUAKI
IPC分类号： A61B1/00 , A61B1/05 , A61J3/07
CPC分类号： A61B1/041 , A61B5/4839 , A61M31/002
摘要： A capsule device for medical use, having various kinds of medical agents depending on applications and capable of contributing to reduction in management costs. The capsule device for medical use, set in a body cavity, at least has a body unit having a function for observing the inside of the body cavity and a medical agent unit having a function for receiving and discharging a medial agent. The body unit and the medical agent unit are constructed so as to be freely connectable and disconnectable.

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