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1. 发明公开

EP4246543A1 MAGNETIC SHEET AND INDUCTOR 审中-实审
公开(公告)号：EP4246543A1
公开(公告)日：2023-09-20
申请号：EP21891957.9
申请日：2021-11-11
申请人： Nitto Denko Corporation
发明人： SENDA, Hiroki , OKUMURA, Keisuke , FURUKAWA, Yoshihiro
IPC分类号： H01F17/04 , H01F1/26
摘要： A magnetic sheet 1 has a first principal surface 2 and a second principal surface 3 facing each other in the thickness direction. The magnetic sheet 1 contains magnetic particles and resin. The ratio of the total amount of carbon and oxygen on one of the first principal surface 2 and second principal surface 3 is 10 mass% or more and 60 mass% or less.

2. 发明公开

EP3767650A1 MAGNETIC WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 无效
公开(公告)号：EP3767650A1
公开(公告)日：2021-01-20
申请号：EP18909811.4
申请日：2018-10-19
申请人： Nitto Denko Corporation
发明人： OKUMURA, Keisuke , FURUKAWA, Yoshihiro
IPC分类号： H01F17/04 , H01F17/00 , H01F38/14 , H01F41/04
摘要： A magnetic wiring circuit board includes an insulating layer; a wire disposed on a one-side surface in a thickness direction of the insulating layer and having a one-side surface in the thickness direction disposed to face the one-side surface in the thickness direction of the insulting layer at spaced intervals thereto, an other-side surface in the thickness direction in contact with the one-side surface in the thickness direction of the insulating layer, and side surfaces each connecting an end edge of the one-side surface in the thickness direction to an end edge of the other-side surface in the thickness direction; and a magnetic layer containing a magnetic particle having a shape of an aspect ratio of 2 or more and embedding the wire. The wire has a first corner portion formed by the one-side surface and the side surface in the thickness direction and having a generally curved shape, and a second corner portion formed by the other-side surface and the side surface in the thickness direction and having a portion in which a length between the two side surfaces facing each other becomes longer as it goes toward the other-side surface in the thickness direction.

3. 发明公开

EP3553801A1 METHOD FOR MANUFACTURING MODULE 审中-公开
公开(公告)号：EP3553801A1
公开(公告)日：2019-10-16
申请号：EP17878408.8
申请日：2017-11-16
申请人： Nitto Denko Corporation
发明人： FURUKAWA, Yoshihiro , OKUMURA, Keisuke
IPC分类号： H01F41/04 , H01F17/00 , H05K1/16 , H05K3/20
摘要： A method for producing a module includes a first step of preparing a seed layer disposed at a one-side surface in a thickness direction of a first peeling layer, a second step of forming a conductive pattern at a one-side surface in the thickness direction of the seed layer by plating allowing electric power to be supplied from the seed layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle, and a fourth step of exposing the other-side surfaces in the thickness direction of the conductive pattern and the first adhesive layer.

4. 发明公开

EP3425644A1 MAGNETIC FILM AND COIL MODULE 有权转让
公开(公告)号：EP3425644A1
公开(公告)日：2019-01-09
申请号：EP17759767.1
申请日：2017-02-22
申请人： Nitto Denko Corporation
发明人： FURUKAWA, Yoshihiro
IPC分类号： H01F1/34 , B32B7/02 , H01F1/147 , H01F1/26 , H01F1/28 , H01F1/375
摘要： A magnetic film includes a first layer having a real part of complex magnetic permeability of 50 or more and an imaginary part of complex magnetic permeability of below 30 at 10 MHz, and a second layer provided on the first layer and having a real part of complex magnetic permeability of 50 or more and an imaginary part of complex magnetic permeability of 30 or more at 10 MHz.

5. 发明公开

EP3065151A1 COMMUNICATION MODULE 审中-公开
标题翻译：通信模块
公开(公告)号：EP3065151A1
公开(公告)日：2016-09-07
申请号：EP14859136.5
申请日：2014-10-10
申请人： Nitto Denko Corporation
发明人： EBE, Hirofumi , FURUKAWA, Yoshihiro , OOKAWA, Tadao
IPC分类号： H01F38/14 , H01F27/28 , H01L23/36
CPC分类号： H02J50/12 , H01F27/22 , H01F38/14 , H01L23/373 , H01L23/3737 , H01L2924/0002 , H02J7/025 , H04B5/0037 , H04B5/0075 , H05K7/2039 , Y02D70/00 , H01L2924/00
摘要： The communication module includes a housing, an element disposed in the housing and generates electric power by a wireless system by induced electricity, a communication circuit that operates based on electric power generated by the element, and a sheet member disposed between the housing and the element and having thermal conductivity and electrical insulation.
摘要翻译：通信模块包括：壳体;布置在壳体中并通过无线系统通过感应电力产生电力的元件;基于由元件产生的电力操作的通信电路;以及布置在壳体和元件之间的片状部件并具有导热性和电绝缘性。

6. 发明授权

EP3229243B1 SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM 有权
公开(公告)号：EP3229243B1
公开(公告)日：2020-09-09
申请号：EP15864917.8
申请日：2015-12-03
申请人： Nitto Denko Corporation
发明人： FURUKAWA, Yoshihiro
IPC分类号： H01F1/00 , C08J5/18 , C08L33/02 , C08L33/04 , C08L33/20 , C08L63/00 , H05K9/00 , H01F27/36 , H01F38/14

7. 发明公开

EP4012732A1 INDUCTOR 有权
公开(公告)号：EP4012732A1
公开(公告)日：2022-06-15
申请号：EP20852096.5
申请日：2020-06-19
申请人： Nitto Denko Corporation
发明人： FURUKAWA, Yoshihiro , OKUMURA, Keisuke
IPC分类号： H01F17/04 , H01F27/24
摘要： An inductor 1 includes a first wire 21 and a second wire 22, a first magnetic layer 31 containing magnetic particles having an approximately spherical shape, a second magnetic layer 51 containing magnetic particles having an approximately flat shape, and a third magnetic layer 71 containing magnetic particles having an approximately flat shape. The relative permeability of each of the second magnetic layer 51 and the third magnetic layer 71 is higher than the relative permeability of the first magnetic layer 31. A fourth surface 54 of the first magnetic layer 31 has a second concave portion 60. A sixth surface 74 of the third magnetic layer 71 has a fourth concave portion 80.

8. 发明公开

EP3780032A1 MAGNETIC WIRING CIRCUIT BOARD 审中-实审
公开(公告)号：EP3780032A1
公开(公告)日：2021-02-17
申请号：EP19784782.5
申请日：2019-04-02
申请人： Nitto Denko Corporation
发明人： FURUKAWA, Yoshihiro , OKUMURA, Keisuke
IPC分类号： H01F17/00 , B32B15/08 , H01F17/04 , H05K1/16
摘要： A magnetic wiring circuit board includes an insulating layer, a plurality of wiring portions spaced from each other in a direction perpendicular to a thickness direction on one surface in the thickness direction of the insulating layer, a magnetic layer disposed so as to embed the plurality of wiring portions on the one surface in the thickness direction of the insulating layer and having one surface in the thickness direction spaced at one side in the thickness direction with respect to one surfaces in the thickness direction of the plurality of wiring portions, and a suppressing portion for suppressing magnetic coupling of at least the two wiring portions formed so as to extend from the one surface in the thickness direction of the magnetic layer toward the other side in the thickness direction relative to a phantom line connecting the one surfaces in the thickness direction of at least the two wiring portions in the magnetic layer between at least the two wiring portions adjacent to each other.

9. 发明公开

EP4012731A1 INDUCTOR 审中-实审
公开(公告)号：EP4012731A1
公开(公告)日：2022-06-15
申请号：EP20851819.1
申请日：2020-06-19
申请人： Nitto Denko Corporation
发明人： FURUKAWA, Yoshihiro , OKUMURA, Keisuke
IPC分类号： H01F17/04 , H01F37/00 , H01F27/24 , H01F27/36
摘要： An inductor 1 includes a first wire 2 and a second wire 3 adjacent to each other and separated by an interval therebetween; a first magnetic layer 4 having a first surface 11 continuing in the surface direction, a second surface 12 separated from the first surface 11 by an interval in the thickness direction and continuing in the surface direction, and an inner peripheral surface 10 in contact with an outer peripheral surface 17 of the first wire and an outer peripheral surface 17 of the second wire between the first surface 11 and the second surface 12; a second magnetic layer 5 disposed on the first surface 11; and a third magnetic layer 6 disposed on the second surface 12. The second magnetic layer 5 has a third surface 13 facing and separated from the first surface 11 by an interval in the thickness direction. The relative permeability of each of the second magnetic layer 5 and the third magnetic layer 6 is higher than the relative permeability of the first magnetic layer 4. The inductor 1 further includes a suppression portion 7 that is located between the first wire 2 and second wire 3 when being projected in the thickness direction and is configured to suppress the magnetic coupling between the first wire 2 and second wire 3. The suppression portion 7 includes a slit 21 located between the first surface 11 and the third surface 13.

10. 发明公开

EP3553800A1 METHOD FOR PRODUCING MODULE 审中-公开
公开(公告)号：EP3553800A1
公开(公告)日：2019-10-16
申请号：EP17877412.1
申请日：2017-11-16
申请人： Nitto Denko Corporation
发明人： OKUMURA, Keisuke , FURUKAWA, Yoshihiro
IPC分类号： H01F41/04 , H01F17/00 , H05K1/16 , H05K3/20
摘要： A method for producing a module includes a first step of preparing a conductive layer disposed at one side in a thickness direction of a first peeling layer, a second step of forming a conductive pattern from the conductive layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle and a first resin component, and a fourth step of peeling the first peeling layer.

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