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1. 发明公开

EP4044226A1 A SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF A SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：EP4044226A1
公开(公告)日：2022-08-17
申请号：EP21157363.9
申请日：2021-02-16
申请人： Nexperia B.V.
发明人： Chau, On Lok , Wong, Fei , Hor, William , Bi, Billie , Shiu, Ivan
IPC分类号： H01L23/495 , H01L23/31
摘要： This present invention relates to a semiconductor device comprising a lead frame, a metal pad, wherein the metal pad is connected to a back side of the semiconductor device via the lead frame. The semiconductor device further comprises a die pad, wherein the die pad is attached to the lead frame via a die attach material, and an encapsulant that is disposed on the top surface of the lead frame. The encapsulant isolates the metal pad from the die pad.

2. 发明公开

EP4350764A1 A SEMICONDUCTOR PACKAGE ASSEMBLY 审中-公开
公开(公告)号：EP4350764A1
公开(公告)日：2024-04-10
申请号：EP22199871.9
申请日：2022-10-05
申请人： Nexperia B.V.
发明人： Böttcher, Tim , Funke, Hans-Juergen , Shiu, Ivan
IPC分类号： H01L23/495
摘要： A semiconductor package assembly is proposed, consisting of a semiconductor package and a molding resin case, the semiconductor package at least comprising a lead frame having a first lead frame side and a second lead frame side opposite to the first lead frame side; a semiconductor die structure having a first die side and a second die side opposite to the first die side, the semiconductor die structure being mounted with its second die side on the first lead frame side of the lead frame, resulting in a first conductive connection; at least one bond element being connected to the first die side of the semiconductor die structure, resulting in at least one further conductive connection; with the molding resin case encapsulating at least the semiconductor die structure, the lead frame and a first part of the at least one bond element connected to the semiconductor die structure, leaving at least the second lead frame side and the other part of the at least one bond element partly exposed, wherein the at least one bond element is provided with electric field modulation structures structured to, during operation of the semiconductor package assembly, alter an electric field created between the first conductive connection and the at least further conductive connection.

3. 发明公开

EP4345889A1 A METHOD OF IMPROVING PACKAGE CREEPAGE DISTANCE 审中-公开
公开(公告)号：EP4345889A1
公开(公告)日：2024-04-03
申请号：EP22198468.5
申请日：2022-09-28
申请人： Nexperia B.V.
发明人： Funke, Hans-Juergen , Shiu, Ivan , Böttcher, Tim
IPC分类号： H01L23/495 , H01L23/60
摘要： The present disclosure relates to a method of improving semiconductor package creepage, wherein the package comprises a semiconductor device, and a plurality of electrically conductive contacts at a surface of the package, the package comprising insulating material for electrically insulating the package between the plurality of electrically conductive contacts, wherein an initial creepage distance is defined by the shortest distance over the surface of the package between two of the plurality of contacts, and the method comprising the steps of: applying a layer of insulating material over at least part of at least one of the two contacts, wherein said insulating material is applied in a thin layer and selected to obtain a package thermal resistance increase less than a factor 3 as compared to an uncoated semiconductor package, to increase the initial creepage distance and improve package creepage of the semiconductor package.

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