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1. 发明公开

EP0985486A4 LEADLESS SOLDER 有权
标题翻译： BLEIFREIES很多
公开(公告)号：EP0985486A4
公开(公告)日：2003-01-02
申请号：EP99907920
申请日：1999-03-15
申请人： NIHON SUPERIOR SHA CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： B23K35/26 , B23K20060101 , C22C20060101 , C22C13/00 , H05K1/09 , H05K3/34
CPC分类号： C22C13/00 , B23K35/262
摘要： Ternary leadless solder comprising l-2 wt.% of Cu, 0.002-l wt.% of Ni, and Sn for the rest, wherein the contents of Cu and Ni are preferably 0.3-0.7 wt.% and 0.04-0.l wt.% respectively, a method of adding Ni to a Sn-Cu alloy and a method of adding Cu to a Sn-Ni alloy being employed.
摘要翻译：由三元素Sn-Cu-Ni组成的无铅焊料。 Cu和Ni分别为0.1〜2重量％和0.002〜1重量％。 Cu和Ni的优选重量百分比分别为0.3〜0.7％和0.04〜0.1％。对Sn-Cu和添加剂Cu的基础合金添加Ni与Sn-Ni的基体合金的两种方法都是适用的。

2. 发明公开

EP2096182A4 APPARATUS FOR PRECIPITATION/SEPARATION OF EXCESS COPPER IN LEAD-FREE SOLDER 有权
标题翻译：设备，用于无铅很多剩余的铜沉淀/分离
公开(公告)号：EP2096182A4
公开(公告)日：2010-03-31
申请号：EP06834703
申请日：2006-12-14
申请人： NIHON SUPERIOR SHA CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： C22B25/06 , B23K3/08 , C22B7/00 , C22B9/10
CPC分类号： C22B25/08 , C22B9/10 , C22B15/006

3. 发明公开

EP1908853A4 METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN 有权
标题翻译：用于无铅很多，法求解制粒（CUX）6 Sn 5类连接和方法为它进行恢复锡的分离及其方法分离铜
公开(公告)号：EP1908853A4
公开(公告)日：2010-03-17
申请号：EP06781546
申请日：2006-07-25
申请人： NIHON SUPERIOR SHA CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： C22B25/08 , C22B9/02 , C22B9/10 , H05K3/34
CPC分类号： C22B9/02 , C22B9/023 , C22B15/006 , C22B25/08 , H05K3/3463 , Y02P10/234
摘要： The purpose of the present invention is to separate excess coppers leached out in a lead-free solder bath and recover tin with high efficiency. An element X for forming a (CuX) 6 Sn 5 compound between copper and tin in molten lead-free solders is added to separate out a (CuX) 6 Sn 5 compound. Tin is recovered by binding the (CuX) 6 Sn 5 compound by passing thereof through a multi-perforated plate, further generating swirling currents to precipitate and separate the bound (CuX) 6 Sn 5 compounds and removing thereof.

4. 发明公开

EP1911543A4 SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH 有权
标题翻译：无铅很多关于用于控制焊浴浓度与CU-NI浓度的另外供给和方法
公开(公告)号：EP1911543A4
公开(公告)日：2009-06-17
申请号：EP06781247
申请日：2006-07-19
申请人： NIHON SUPERIOR SHA CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： B23K35/26 , B23K1/08 , B23K101/38 , C22C13/00 , H05K3/24 , H05K3/34
CPC分类号： B23K1/08 , B23K1/0016 , B23K35/262 , B23K2201/42 , C22C13/00 , H05K3/3463 , H05K3/3468
摘要： Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass percent Ni. By replenishing the lead-free solder having the above composition, the density of the solder bath, being sharply changed for using one of a HASL device and a die, is quickly restored back to within an appropriate range.

5. 发明公开

EP1043112A4 LEAD-FREE SOLDER 有权
标题翻译： BLEIFREIES LOT
公开(公告)号：EP1043112A4
公开(公告)日：2003-01-02
申请号：EP99944854
申请日：1999-09-28
申请人： NIHON SUPERIOR SHA CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： B23K35/26 , B23K20060101 , C22C20060101 , C22C13/00 , H05K1/09 , H05K3/34
CPC分类号： C22C13/00 , B23K35/262
摘要： A lead-free solder characterized as comprising 0.1 to 2 wt % of Cu, 0.002 to 1 wt % of Ni with the residue being Sn. The solder preferably contains Cu in an amount of 0.3 to 0.7 wt %, and more preferably it contains Cu in an amount of 0.3 to 0.7 wt % and Ni in an amount of 0.04 to 0.1 wt %. The solder can be prepared by adding Ni to a molten mother alloy of Sn-Cu, or by adding Cu to a molten mother alloy of Sn-Ni. A lead-free solder which further comprises 0.001 to 1 wt % of Ga is also disclosed. The lead-free solder can form a solder joint having a high strength and stability comparable to those of a conventional Sn-Pb eutectic solder.
摘要翻译： 1。一种无铅焊料，其特征在于，含有0.1〜2重量％的Cu，0.002〜1重量％的Ni，残渣为Sn。焊料优选含有0.3〜0.7重量％的Cu，更优选含有0.3〜0.7重量％的Cu和0.04〜0.1重量％的Ni。焊料可以通过将Ni添加到Sn-Cu的熔融母合金中，或者通过将Cu添加到Sn-Ni的熔融母合金中来制备。还公开了进一步包含0.001至1重量％的Ga的无铅焊料。无铅焊料可形成具有与常规Sn-Pb共晶焊料相当的高强度和高稳定性的焊点。

6. 发明公开

EP2218540A4 SOLDER JOINT 有权
标题翻译：焊接连接
公开(公告)号：EP2218540A4
公开(公告)日：2013-02-20
申请号：EP08840759
申请日：2008-10-20
申请人： NIHON SUPERIOR SHA CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： B23K35/26 , C22C13/00
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , H05K3/3457 , Y10T428/12708
摘要： A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt% Cu, 0.001-6 wt% Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt% and preferably 0.03 wt%. The upper limit of the range of Ni is 0.3 wt% and preferably 0.1 wt%. The lower limit of the range of Cu is 0.1 wt% and preferably 0.2 wt%. The upper limit of the range of Cu is 7 wt% and preferably 0.92 wt%. The invention includes the solder joint essentially having these compositions.

7. 发明公开

EP2243590A4 METHOD OF REGULATING NICKEL CONCENTRATION IN LEAD-FREE SOLDER CONTAINING NICKEL 审中-公开
标题翻译：调节方法镍浓度的，无铅含镍的LOT
公开(公告)号：EP2243590A4
公开(公告)日：2012-01-25
申请号：EP08711815
申请日：2008-02-22
申请人： NIHON SUPERIOR SHA CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： B23K35/26 , B23K1/018 , B23K1/08 , B23K1/20 , B23K35/40 , C22B9/10 , C22C1/02 , C22C3/00 , C22C13/00 , H05K3/34
CPC分类号： C22C1/02 , B23K1/018 , B23K1/20 , B23K35/262 , C21D2211/004 , C22B9/10 , C22B25/08 , C22C1/03 , C22C3/00 , C22C13/00
摘要： A method by which the amount of nickel contained in an alloy having a composition represented by Sn-X-Ni can be regulated. The method of nickel concentration regulation comprises adding phosphorus to Sn-X-Ni in a molten state (wherein X is one or more elements selected from the group consisting of Ag, Zn, Cu, Bi, Au, Ti, Ge, Ga, Si, and Ce), holding the mixture at 250-400°C, and removing the resultant dross floating on the surface of the liquid phase and containing a P-Ni compound and a P-Sn-Ni compound. An example of X is copper, and the content thereof may be 0.3-5 wt%. The phosphorus may be added in the state of a Sn-P alloy. The upper limit of the amount of the phosphorus to be added may be about half the nickel amount in terms of atomic amount.

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