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1. 发明授权

EP3264542B1 LIGHT-EMITTING DEVICE 有权
公开(公告)号：EP3264542B1
公开(公告)日：2019-06-05
申请号：EP17181661.4
申请日：2007-03-09
申请人： NICHIA CORPORATION
发明人： NAGAHAMA, Shinichi , HAMA, Atsutomo , SUGIYAMA, Takafumi , HAYASHI, Yukihiro , MORIZUMI, Naoto , MURAZAKI, Yoshinori
IPC分类号： H01S5/022 , H01L33/48 , H01L33/50 , H01S5/00 , H01S5/40

2. 发明公开

EP3142200A1 SEMICONDUCTOR LASER DEVICE 有权
标题翻译： HALBLEITERLASERVORRICHTUNG
公开(公告)号：EP3142200A1
公开(公告)日：2017-03-15
申请号：EP16186071.3
申请日：2016-08-29
申请人： NICHIA CORPORATION
发明人： MORIZUMI, Naoto , NAMIE, Takashi , NAKAGAWA, Takashi , KOMODA, Daisuke , SHOZUI, Hiroaki
IPC分类号： H01S5/00 , H01S5/022 , H01S5/024 , F21S8/10
CPC分类号： H01S5/02208 , F21S41/14 , F21S41/16 , F21S41/192 , F21S43/13 , F21S43/195 , H01S5/005 , H01S5/02212 , H01S5/02272 , H01S5/02288 , H01S5/02296 , H01S5/02469 , H01S5/3013
摘要： A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space between the lateral surfaces of the recess and the support member.
摘要翻译：半导体激光装置包括基底，半导体激光元件，盖，支撑构件，波长转换构件，保持构件和缓冲材料。盖具有形成在盖的上部中的凹部和形成在凹部的底部中的通孔。支撑构件设置在凹部中并具有通孔。支撑构件的通孔的直径小于盖的通孔的直径。支撑构件的热膨胀系数与盖的热膨胀系数不同。波长转换构件被支撑在支撑构件的通孔中。保持构件固定在盖上并保持支撑构件。缓冲材料设置在凹部的侧表面和支撑构件之间的空间的至少一部分中。

3. 发明公开

EP3264542A1 LIGHT-EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：EP3264542A1
公开(公告)日：2018-01-03
申请号：EP17181661.4
申请日：2007-03-09
申请人： NICHIA CORPORATION
发明人： NAGAHAMA, Shinichi , HAMA, Atsutomo , SUGIYAMA, Takafumi , HAYASHI, Yukihiro , MORIZUMI, Naoto , MURAZAKI, Yoshinori
IPC分类号： H01S5/022 , H01L33/48 , H01L33/50 , H01S5/00 , H01S5/40
CPC分类号： H01L33/483 , H01S5/005 , H01S5/02212 , H01S5/02288 , H01S5/02296 , H01S5/4025
摘要： Disclosed is that, in a semiconductor light-emitting device, light from a laser diode is output to the outside after the luminance of the light being enhanced. The light-emitting device includes a support body 11, a light-emitting element 12 constituted by a laser diode mounted on the support body 11; a receptacle 91 fixed to the support body 11 to surround the light-emitting element 12; a cup 91a having an opening part and formed separately from the receptacle 91; a cap 95 provided with a fluorescent member 93 at a central part thereof and is placed to cover the opening part of the cup 91a; and a convergent lens 92 placed in a space in the receptacle 71 and converging light from the light-emitting element 12 to make the light incident on the fluorescent member 93.
摘要翻译：公开了在半导体发光器件中，在光的亮度增强之后，来自激光二极管的光被输出到外部。该发光装置包括支撑体11，由安装在支撑体11上的激光二极管构成的发光元件12，固定在支撑体11上以围绕发光元件12的插座91; 具有开口部并与容器91分开形成的杯91a; 盖95，其在其中心部分设置有荧光部件93，并被放置成覆盖杯91a的开口部分; 收敛透镜92，其配置在插座71的空间内，使来自发光元件12的光聚光而入射到荧光部件93。

4. 发明公开

EP1903361A1 Title of the invention optical component and light emitting device using the same 审中-公开
标题翻译：本发明中，光学元件的相同的标题，并且使用发光器件
公开(公告)号：EP1903361A1
公开(公告)日：2008-03-26
申请号：EP07116357.0
申请日：2007-09-13
申请人： Nippon Electric Glass Co., Ltd. , Nichia Corporation
发明人： KADOMI, Masaaki , UMAYAHARA, Yoshio , FURUYAMA, Tadahito , IWAO, Masaru , HAMA, Atsutomo , SUGIYAMA, Takafumi , HAYASHI, Yukihiro , MORIZUMI, Naoto
IPC分类号： G02B6/42
摘要： There is provided a light emitting device using an optical component capable of emitting light having a wavelength different from that of light exit from an optical fiber (10) and obtaining light of high output, and capable of being easily attached to an end of the optical fiber. The optical component includes an optical fiber holding member (20) for holding an optical fiber (10), a light conversion member (40), and a cap (30) having an inner hole allowing the light conversion member (40) and the optical fiber holding member (20) to be inserted into and an engagement part (31) with an opening (32) for engaging inserted members at one end of the inner hole. The light conversion member (40) inserted into the inner hole of the cap (30) is fitted into the inner hole with the optical fiber holding member (20) pressed against the engagement part. The opening of the engagement part is smaller than a maximum diameter of the light conversion member (40).
摘要翻译：提供了一种使用在能够具有从光纤（10）和高输出的获取光的没有光射出的波长不同的波长发射光的光学部件的发光装置，并且能够在光学的端部容易地安装到纤维。所述光学部件包括在光纤保持部件（20），用于保持光纤（10），一个光转换部件（40）和帽（30），其具有内孔，允许将光转换部件（40）和光学光纤保持件（20）将被插入到与孔的卡合部（31），在开口（32）内，用于在所述一个端部接合插入构件。插入盖（30）的内孔中的光转换部件（40）被装配到与所述光纤保持部件（20）的内孔压靠在接合部。卡合部的开口比所述光转换部件（40）的最大直径小。

5. 发明授权

EP1903361B1 Optical component and light emitting device using the same 有权
公开(公告)号：EP1903361B1
公开(公告)日：2020-04-01
申请号：EP07116357.0
申请日：2007-09-13
申请人： Nippon Electric Glass Co., Ltd. , Nichia Corporation
发明人： KADOMI, Masaaki , UMAYAHARA, Yoshio , FURUYAMA, Tadahito , IWAO, Masaru , HAMA, Atsutomo , SUGIYAMA, Takafumi , HAYASHI, Yukihiro , MORIZUMI, Naoto
IPC分类号： G02B6/42

6. 发明授权

EP3142200B1 SEMICONDUCTOR LASER DEVICE 有权
公开(公告)号：EP3142200B1
公开(公告)日：2017-12-13
申请号：EP16186071.3
申请日：2016-08-29
申请人： NICHIA CORPORATION
发明人： MORIZUMI, Naoto , NAMIE, Takashi , NAKAGAWA, Takashi , KOMODA, Daisuke , SHOZUI, Hiroaki
IPC分类号： H01S5/00 , H01S5/022 , H01S5/024 , F21S8/10
CPC分类号： H01S5/02208 , F21S41/14 , F21S41/16 , F21S41/192 , F21S43/13 , F21S43/195 , H01S5/005 , H01S5/02212 , H01S5/02272 , H01S5/02288 , H01S5/02296 , H01S5/02469 , H01S5/3013
摘要： A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space between the lateral surfaces of the recess and the support member.

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