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1. 发明公开

EP2255899A1 CONTINUOUS REPETITIVE ROLLING METHOD FOR METAL STRIP 有权
标题翻译： KONTINUIERLICHES UND SICH WIEDERHOLENDES WALZVERFAHRENFÜRMETALLSTREIFEN
公开(公告)号：EP2255899A1
公开(公告)日：2010-12-01
申请号：EP09716737.3
申请日：2009-01-15
申请人： NGK Insulators, Ltd. , Sakai, Tetsuo , Utsunomiya, Hiroshi
发明人： SAKAI, Tetsuo , UTSUNOMIYA, Hiroshi , MURAMATSU, Naokuni , TAKEUCHI, Ryota
IPC分类号： B21B1/16 , B21B1/22 , B21C47/00
CPC分类号： B21B1/22 , B21B45/0251 , B21B2001/228 , B21B2003/001 , B21B2265/14 , B21B2265/24
摘要： A flow of rolling with a combination of asymmetric rolling (S1) and skin pass rolling (S3) is shown. Differential-speed rolling is performed as the asymmetric rolling, and a winder temporarily winds a metal strip with a collapsed plate shape by traverse winding (loose winding which allows the metal strip is wound in a zigzag manner: S2). Then, the skin pass rolling is performed, and orderly winding is performed in a coil form (S4). As shown in the flow of rolling, tandem rolling may be performed by arranging two or more rolling mills side by side so that the asymmetric rolling and the skin pass rolling are continuously performed without the traverse winding (S2) in the mid course.
摘要翻译：示出了具有不对称轧制（S1）和表面轧制（S3）的组合的轧制流程。作为不对称轧制进行差速轧制，卷绕机通过横动卷绕（允许金属带以Z字形方式卷绕的松散卷绕）暂时卷绕具有塌缩板形状的金属带。然后，进行表皮轧制，以线圈形式进行有序卷绕（S4）。如轧制流程所示，串联轧制可以通过并列布置两台或多台轧机来进行，从而在中间过程中不用横动卷绕（S2）连续地进行不对称轧制和表面轧制。

2. 发明授权

EP2255899B1 CONTINUOUS REPETITIVE ROLLING METHOD FOR METAL STRIP 有权
标题翻译：连续和在重复轧制工艺FOR金属条
公开(公告)号：EP2255899B1
公开(公告)日：2014-12-10
申请号：EP09716737.3
申请日：2009-01-15
申请人： NGK Insulators, Ltd. , Sakai, Tetsuo , Utsunomiya, Hiroshi
发明人： SAKAI, Tetsuo , UTSUNOMIYA, Hiroshi , MURAMATSU, Naokuni , TAKEUCHI, Ryota
IPC分类号： B21B1/16 , B21B1/22 , B21C47/00
CPC分类号： B21B1/22 , B21B45/0251 , B21B2001/228 , B21B2003/001 , B21B2265/14 , B21B2265/24

3. 发明公开

EP3318648A1 COPPER ALLOY AND METHOD FOR PRODUCING SAME 有权
标题翻译：铜合金及其制造方法
公开(公告)号：EP3318648A1
公开(公告)日：2018-05-09
申请号：EP17770436.8
申请日：2017-03-24
申请人： NGK Insulators, Ltd. , National University Corporation Yokohama National University
发明人： TAKEDA, Mahoto , SASAKI, Koudai , MURAMATSU, Naokuni , NAKAJIMA, Takanari
IPC分类号： C22C9/02 , C22C9/01 , C22F1/00 , C22F1/08
摘要： A copper alloy disclosed in the present description has a basic alloy composition represented by Cu 100-(x+y) Sn x Al y (where 8 ≤ x ≤ 12 and 8 ≤ y ≤ 9 are satisfied), in which a main phase is a βCuSn phase with Al dissolved therein, and the βCuSn phase undergoes martensitic transformation when heat-treated or worked. A method for producing a copper alloy disclosed in the present description is a method for producing a copper alloy that undergoes martensitic transformation when heat-treated or worked. Among a casting step of melting and casting a raw material containing Cu, Sn, and Al and having a basic alloy composition represented by Cu 100-(x+y) Sn x Al y (where 8 ≤ x ≤ 12 and 8 ≤ y ≤ 9 are satisfied) so as to obtain a cast material, and a homogenization step of homogenizing the cast material in a temperature range of a βCuSn phase so as to obtain a homogenized material, the method includes at least the casting step.
摘要翻译：在本说明书中公开的铜合金具有以Cu100-（x + y）SnxAly（其中，满足8≤x≤12且8≤y≤9）表示的基本合金组成，其中主相为βCuSn相， Al在其中溶解，并且当热处理或加工时βCuSn相发生马氏体相变。本说明书中公开的铜合金的制造方法是在热处理或加工时发生马氏体相变的铜合金的制造方法。在对含有Cu，Sn，Al的原料进行熔炼铸造的铸造工序中，以Cu100-（x + y）SnxAly（满足8≤x≤12,8≤y≤9）为代表的碱性合金组成，以获得铸造材料和均匀化步骤，在该铸造材料在βCuSn相的温度范围内均质化以获得均化材料，该方法至少包括铸造步骤。

4. 发明授权

EP2264199B1 FORGED BERYLLIUM-COPPER BULK MATERIAL 有权
标题翻译： BULK锻造铍
公开(公告)号：EP2264199B1
公开(公告)日：2016-12-28
申请号：EP09725472.6
申请日：2009-02-25
申请人： NGK Insulators, Ltd.
发明人： MURAMATSU, Naokuni
IPC分类号： C22C9/00 , C22C9/06 , C22F1/08 , C22F1/00
CPC分类号： C22C9/06 , C22C9/00 , C22F1/08

5. 发明授权

EP2690196B1 METHOD FOR PROCESSING THIN CU PLATE 有权
标题翻译：一种用于处理薄铜板
公开(公告)号：EP2690196B1
公开(公告)日：2015-11-18
申请号：EP12761166.3
申请日：2012-03-06
申请人： NGK Insulators, Ltd.
发明人： MURAMATSU, Naokuni , AOSHIMA, Shoju
IPC分类号： C23C10/18 , C23C24/10 , B23K26/32 , B23K26/34 , B23K35/00 , B23K35/02 , B23K35/30 , B22F7/04 , C22C9/00 , C22C9/06 , C22C16/00 , C22C19/05 , C22C19/07 , C22C29/06 , C22C29/08 , C22C29/10 , C22C29/14 , C22C1/04 , C22C32/00 , C22C45/10
CPC分类号： B23K26/32 , B22F7/04 , B22F2007/047 , B22F2998/00 , B22F2998/10 , B23K26/342 , B23K35/007 , B23K35/0244 , B23K35/025 , B23K35/3033 , B23K2203/05 , B23K2203/12 , B23K2203/18 , B23K2203/26 , C22C1/0433 , C22C1/0458 , C22C9/00 , C22C9/06 , C22C16/00 , C22C19/056 , C22C19/058 , C22C19/07 , C22C32/0052 , C22C45/10 , C23C24/10 , B22F3/22 , B22F3/105 , C22C29/06 , C22C29/16 , C22C29/14

6. 发明公开

EP2479298A1 COPPER ALLOY FOIL, FLEXIBLE PRINTED WIRING BOARD OBTAINED USING SAME, AND PROCESS FOR PRODUCING COPPER ALLOY FOIL 有权
标题翻译：合金铜箔，柔性印刷电路板组装体和方法生产铜合金箔
公开(公告)号：EP2479298A1
公开(公告)日：2012-07-25
申请号：EP10815489.9
申请日：2010-09-13
申请人： NGK Insulators, Ltd. , Tohoku University
发明人： MURAMATSU, Naokuni , KIMURA, Hisamichi , INOUE, Akihisa
IPC分类号： C22C9/00 , C22F1/08 , H05K1/09 , C22F1/00
CPC分类号： H05K1/09 , C22C1/10 , C22C9/00 , C22F1/08 , H01B1/026 , H05K1/0393 , H05K2201/0355
摘要： The zirconium content of the alloy composition of a copper alloy foil 10 of the present invention is 3.0 to 7.0 atomic percent, and the copper alloy foil 10 includes copper matrix phases 30 and composite phases 20 composed of copper-zirconium compound phases 22 and copper phases 21. As shown in Fig. 1 , the copper matrix phases 30 and the composite phases 20 form a matrix phase-composite phase layered structure and are arranged alternately parallel to a rolling direction as viewed in a cross-section perpendicular to the width direction. In addition, the copper-zirconium compound phases 22 and the copper phases 21 in the composite phases 20 form a composite phase inner layered structure and are arranged alternately parallel to the rolling direction at a phase pitch of 50 nm or less as viewed in the above cross-section. This double layered structure presumably makes the copper alloy foil 10 densely layered to provide a strengthening mechanism similar to multilayer reinforced composite materials.
摘要翻译：的铜合金的合金组合物的锆含量贴膜本发明的图10是3.0〜7.0原子％，且该铜合金箔10包括铜母相30和铜 - 锆化合物相22和铜相的复合体相20 21.如在图1中，铜母相30和复合相20形成基体相复合相层状结构和交替排列平行于当在横截面垂直于该宽度方向观察的轧制方向。此外，铜 - 锆化合物相22和铜相21的复合相20形成复合相内层状结构，交替排列平行于轧制方向上为50nm或更小的相沥青作为上方观察横截面。这种双层结构想必使铜合金箔10密集地层叠以提供类似于多层强化复合材料的加固机制。

7. 发明公开

EP3718665A1 CONDUCTIVE END MEMBER AND MANUFACTURING METHOD THEREFOR 审中-公开
公开(公告)号：EP3718665A1
公开(公告)日：2020-10-07
申请号：EP18882669.7
申请日：2018-11-22
申请人： NGK Insulators, Ltd. , Tohoku University
发明人： MURAMATSU, Naokuni , NAKAJIMA, Takanari , GOTO, Takashi
IPC分类号： B22F7/06 , B23K11/30
摘要： An electrically conductive tip member includes: an inner periphery portion including a Cu matrix phase and a second phase that is dispersed in the Cu matrix phase and contains a Cu-Zr-based compound, the inner periphery portion having an alloy composition of Cu-xZr (where x is the atomic percentage of Zr and satisfies 0.5 ≤ x ≤ 16.7); and an outer periphery portion that is present on an outer circumferential side of the inner periphery portion, made of a metal containing Cu, and has higher electrical conductivity than the inner periphery portion.

8. 发明授权

EP2915890B1 COPPER ALLOY AND PROCESS FOR MANUFACTURING SAME 有权
公开(公告)号：EP2915890B1
公开(公告)日：2018-06-20
申请号：EP13850956.7
申请日：2013-10-24
申请人： NGK Insulators, Ltd. , Tohoku University
发明人： GOTO, Takashi , KIMURA, Hisamichi , INOUE, Akihisa , MURAMATSU, Naokuni
IPC分类号： C22C9/00 , B22F1/00 , B22F3/14 , B22F3/24 , C22F1/08 , H01B1/02 , H01B13/00 , C22F1/00
CPC分类号： C22C9/00 , B22F3/105 , B22F3/24 , B22F9/08 , C22C1/0425 , C22C1/0491 , C22F1/08 , H01B1/026 , H01B13/00
摘要： A copper alloy of the present invention contains 5.00 to 8.00 atomic percent of Zr and includes Cu and a Cu-Zr compound, and two phases of the Cu and the Cu-Zr compound form a mosaic-like structure which includes no eutectic phase and in which when viewed in cross section, crystals having a size of 10 µm or less are dispersed. This copper alloy is formed by a manufacturing method including a sintering step of performing spark plasma sintering on a Cu-Zr binary system alloy powder at a temperature of 0.9Tm°C or less (Tm(°C): melting point of the alloy powder) by supply of direct-current pulse electricity, the Cu-Zr binary system alloy powder having an average grain diameter of 30 µm or less and a hypoeutectic composition which contains 5.00 to 8.00 atomic percent of Zr. The Cu-Zr compound may include at least one of Cu 5 Zr, Cu 9 Zr 2 , and Cu 8 Zr 3 .

9. 发明公开

EP2915890A1 COPPER ALLOY AND PROCESS FOR MANUFACTURING SAME 有权
标题翻译： KUPFERLEGIERUNG UND VERFAHREN ZU SEINER HERSTELLUNG
公开(公告)号：EP2915890A1
公开(公告)日：2015-09-09
申请号：EP13850956.7
申请日：2013-10-24
申请人： NGK Insulators, Ltd. , Tohoku University
发明人： GOTO, Takashi , KIMURA, Hisamichi , INOUE, Akihisa , MURAMATSU, Naokuni
IPC分类号： C22C9/00 , B22F1/00 , B22F3/14 , B22F3/24 , C22F1/08 , H01B1/02 , H01B13/00 , C22F1/00
CPC分类号： C22C9/00 , B22F3/105 , B22F3/24 , B22F9/08 , C22C1/0425 , C22C1/0491 , C22F1/08 , H01B1/026 , H01B13/00
摘要： A copper alloy of the present invention contains 5.00 to 8.00 atomic percent of Zr and includes Cu and a Cu-Zr compound, and two phases of the Cu and the Cu-Zr compound form a mosaic-like structure which includes no eutectic phase and in which when viewed in cross section, crystals having a size of 10 µm or less are dispersed. This copper alloy is formed by a manufacturing method including a sintering step of performing spark plasma sintering on a Cu-Zr binary system alloy powder at a temperature of 0.9Tm°C or less (Tm(°C): melting point of the alloy powder) by supply of direct-current pulse electricity, the Cu-Zr binary system alloy powder having an average grain diameter of 30 µm or less and a hypoeutectic composition which contains 5.00 to 8.00 atomic percent of Zr. The Cu-Zr compound may include at least one of Cu 5 Zr, Cu 9 Zr 2 , and Cu 8 Zr 3 .
摘要翻译：本发明的铜合金含有5.00〜8.00原子％的Zr，并且包括Cu和Cu-Zr化合物，并且Cu和Cu-Zr化合物的两相形成不包含共晶相的马赛克状结构，当从横截面观察时，分散尺寸为10μm或更小的晶体。该铜合金通过包括在0.9Tm℃以下的温度下在Cu-Zr二元系合金粉末上进行放电等离子体烧结的烧结工序（Tm（℃）：合金粉末的熔点）），通过供给直流脉冲电，平均粒径为30μm以下的Cu-Zr二元系合金粉末和含有5.00〜8.00原子％的Zr的亚共晶组成。 Cu-Zr化合物可以包括Cu 5 Zr，Cu 9 Zr 2和Cu 8 Zr 3中的至少一种。

10. 发明授权

EP2479297B1 COPPER ALLOY WIRE AND PROCESS FOR PRODUCING SAME 有权
标题翻译：铜合金线材及其制造方法
公开(公告)号：EP2479297B1
公开(公告)日：2015-02-25
申请号：EP10815488.1
申请日：2010-09-13
申请人： NGK Insulators, Ltd. , Tohoku University
发明人： MURAMATSU, Naokuni , KIMURA, Hisamichi , INOUE, Akihisa
IPC分类号： C22C9/00 , B22D11/059 , B22D21/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00 , B22D11/00 , C22F1/00
CPC分类号： H01B1/026 , C22C1/02 , C22C9/00 , C22F1/08

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