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1. 发明公开

EP2214181A1 LAMINATED ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE PROVIDED WITH THE SAME 有权
标题翻译： GESCHICHTETE ELEKTRONISCHE KOMPONENTE UND ELEKTRONISCHES KOMPONENMODUL DAMIT
公开(公告)号：EP2214181A1
公开(公告)日：2010-08-04
申请号：EP08863829.1
申请日：2008-12-19
申请人： Murata Manufacturing Co. Ltd.
发明人： NOMA, Takashi , SASAKI, Jun , YAMADA, Kosuke
IPC分类号： H01F17/00 , H01F27/00 , H01G4/30 , H01G4/40
CPC分类号： H01F17/0013 , H01F38/10 , H01G4/40
摘要： A multilayer electronic component that can suppress the formation of projections and depressions on a surface and an electronic component unit including the multilayer electronic component are provided.
Coil electrodes (8) having a shape of ring-shaped wiring with a part removed therefrom are electrically connected to each other to constitute a coil (L). Magnetic layers (4) are stacked together with the plurality of coil electrodes (8). The coil electrodes (8a, 8c, 8e) having a radius r1 and the coil electrodes (8b, 8d) having a radius r2 that is smaller than the radius r1 are alternately arranged in a stacking direction.
摘要翻译：提供了能够抑制表面上的凹凸形成的多层电子部件和包括该多层电子部件的电子部件单元。具有从其去除部分的环形布线形状的线圈电极（8）彼此电连接以构成线圈（L）。磁层（4）与多个线圈电极（8）堆叠在一起。具有半径r1的线圈电极（8a，8c，8e）和半径r2小于半径r1的线圈电极（8b，8d）在堆叠方向上交替布置。

2. 发明授权

EP2096709B1 RADIO IC DEVICE 有权
标题翻译： IC-RADIOGERÄT
公开(公告)号：EP2096709B1
公开(公告)日：2012-04-25
申请号：EP08865022.1
申请日：2008-12-08
申请人： MURATA MANUFACTURING CO., LTD.
发明人： KATO, Noboru , SASAKI, Jun , YAMADA, Kosuke
IPC分类号： H01Q1/50 , B42D15/10 , G06K19/07 , G06K19/077 , H01F17/00 , H01Q1/38
CPC分类号： H01Q1/2225 , G06K19/07749 , H01F2017/002
摘要： Provided is a radio IC device which is hardly affected by a use environment and can be used in a wide range while suppressing fluctuations of radiation characteristic. The radio IC device includes: a radio IC; a power feed circuit substrate (20); and a radiation plate (52). The power feed circuit substrate (20) is electrically connected to the radio IC and has a built-in power feed circuit (21) having a resonance circuit including inductance elements (L1, L2, L3, L4) and/or a rectification circuit. The power feed circuit substrate (20) is bonded to the radiation plate (52). The radiation plate (52) emits a transmission signal supplied from the power feed circuit (21) and supplies a received signal to the power feed circuit (21). The inductance elements (L1, L2) and the inductance elements (L3, L4) are spirally wound respectively in opposite directions and connected to each other with inverse phases.

3. 发明公开

EP2096709A1 RADIO IC DEVICE 有权
标题翻译： IC-RADIOGERÄT
公开(公告)号：EP2096709A1
公开(公告)日：2009-09-02
申请号：EP08865022.1
申请日：2008-12-08
申请人： MURATA MANUFACTURING CO., LTD.
发明人： KATO, Noboru , SASAKI, Jun , YAMADA, Kosuke
IPC分类号： H01Q1/50 , B42D15/10 , G06K19/07 , G06K19/077 , H01F17/00 , H01Q1/38
CPC分类号： H01Q1/2225 , G06K19/07749 , H01F2017/002
摘要： To provide a wireless IC device that is less susceptible to, for example, the environment in which the, wireless IC device is used, that is capable of suppressing a variation in the radiation characteristics, and that is capable of being used in a wideband.
A wireless IC device includes a wireless IC, a feeder circuit board (20), and a radiation strip (52). The feeder circuit board (20) is electrically connected to the wireless IC and incorporates a feeder circuit (21) including a resonant circuit and/or a matching circuit that includes inductance elements (L1, L2, L3, L4). The feeder circuit board (20) is adhered to the radiation strip (52) that radiates a transmission signal supplied from the feeder circuit (21) and supplies a received signal to the feeder circuit (21). The inductance elements (L1, L2) and the inductance elements (L3, L4) are helically formed with being wound in opposite directions. The inductance elements (L1, L2) are out of phase with and coupled to the inductance elements (L3, L4).
摘要翻译：为了提供对能够抑制辐射特性的变化并且能够在宽带中使用的无线IC器件使用的环境不太敏感的无线IC器件。无线IC器件包括无线IC，馈电电路板（20）和辐射带（52）。馈电电路板（20）与无线IC电连接，并且包括一个馈电电路（21），它包括一个包含电感元件（L1，L2，L3，L4）的谐振电路和/或匹配电路。馈电电路板（20）被粘附到辐射带（52），辐射带（52）辐射从馈电电路（21）提供的传输信号，并将接收到的信号提供给馈电电路（21）。电感元件（L1，L2）和电感元件（L3，L4）以相反的方向缠绕形成。电感元件（L1，L2）与电感元件（L3，L4）异相并耦合。

4. 发明授权

EP2214181B1 LAMINATED ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE PROVIDED WITH THE SAME 有权
标题翻译：分层电子元器件及电子组件模块
公开(公告)号：EP2214181B1
公开(公告)日：2016-04-13
申请号：EP08863829.1
申请日：2008-12-19
申请人： Murata Manufacturing Co. Ltd.
发明人： NOMA, Takashi , SASAKI, Jun , YAMADA, Kosuke
IPC分类号： H01F17/00 , H01F27/00 , H01G4/30 , H01G4/40 , H01F38/10
CPC分类号： H01F17/0013 , H01F38/10 , H01G4/40

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