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1. 发明公开

EP2885051A1 WAFER LEVEL PACKAGES OF HIGH VOLTAGE UNITS FOR IMPLANTABLE MEDICAL DEVICES AND CORRESPONDING FABRICATION METHODS 有权
标题翻译：植入式医疗器械高压单位晶圆级封装
公开(公告)号：EP2885051A1
公开(公告)日：2015-06-24
申请号：EP13719644.0
申请日：2013-04-03
申请人： Medtronic Inc.
发明人： BOONE, Mark R. , ASKARINYA, Mohsen , CRUTCHFIELD, Randolph E. , HERRMANN, Erik , RICOTTA, Mark S. , WANG, Lejun
IPC分类号： A61N1/39 , H01L25/00
CPC分类号： A61N1/3956 , F04C2270/041 , H01L23/49548 , H01L23/49575 , H01L25/16 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2924/01015 , H01L2924/01047 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.

2. 发明公开

EP3873333A1 DIE CARRIER PACKAGE AND METHOD OF FORMING SAME 有权
公开(公告)号：EP3873333A1
公开(公告)日：2021-09-08
申请号：EP19804988.4
申请日：2019-10-25
申请人： Medtronic Inc.
发明人： BOONE, Mark R. , HENSCHEL, Mark E.
IPC分类号： A61B5/024 , A61B5/1459 , A61B5/00 , H01L23/00

3. 发明授权

EP2885051B1 WAFER LEVEL PACKAGES OF HIGH VOLTAGE UNITS FOR IMPLANTABLE MEDICAL DEVICES 有权
标题翻译：用于植入式医疗设备的高压单元晶圆级封装
公开(公告)号：EP2885051B1
公开(公告)日：2017-06-07
申请号：EP13719644.0
申请日：2013-04-03
申请人： Medtronic, Inc.
发明人： BOONE, Mark R. , ASKARINYA, Mohsen , CRUTCHFIELD, Randolph E. , HERRMANN, Erik , RICOTTA, Mark S. , WANG, Lejun
IPC分类号： A61N1/39 , H01L25/00
CPC分类号： A61N1/3956 , F04C2270/041 , H01L23/49548 , H01L23/49575 , H01L25/16 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2924/01015 , H01L2924/01047 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00

4. 发明公开

EP3618920A2 IMPLANTABLE LEAD 有权
公开(公告)号：EP3618920A2
公开(公告)日：2020-03-11
申请号：EP18720471.4
申请日：2018-04-03
申请人： Medtronic, Inc.
发明人： BOONE, Mark R. , KUHN, Jonathan L.
IPC分类号： A61N1/39 , A61N1/05 , A61N1/375

5. 发明授权

EP2900320B1 THERAPY DELIVERY SYSTEM FOR IMPLANTABLE MEDICAL DEVICES 有权
公开(公告)号：EP2900320B1
公开(公告)日：2019-07-17
申请号：EP13784044.3
申请日：2013-09-25
申请人： Medtronic, Inc.
发明人： CABELKA, Lonny V. , CRUTCHFIELD, Randolph E. , BOONE, Mark R. , RASMUSSEN, Marshall J.
IPC分类号： A61N1/378 , A61N1/39

6. 发明公开

EP2900320A1 THERAPY DELIVERY METHOD AND SYSTEM FOR IMPLANTABLE MEDICAL DEVICES 有权
标题翻译：治疗VERFAHREN UND SYSTEMFÜRIMPLANTIERBARE MEDISINISCHE VORRICHTUNGEN
公开(公告)号：EP2900320A1
公开(公告)日：2015-08-05
申请号：EP13784044.3
申请日：2013-09-25
申请人： Medtronic Inc.
发明人： CABELKA, Lonny V. , CRUTCHFIELD, Randolph E. , BOONE, Mark R. , RASMUSSEN, Marshall J.
IPC分类号： A61N1/378 , A61N1/39
CPC分类号： A61N1/378 , A61N1/3782 , A61N1/3975 , A61N1/3981
摘要： Recent advancements in electronics technology have provided opportunities for enhancements to implantable medical devices. The enhancements have contributed to increasing miniaturization and operation efficiency. The techniques of the disclosure facilitate configuring a stimulation therapy waveform based on a patient's physiological response to the stimulation waveform. The generated therapy stimulation waveforms include a stepped leading-edge that may be shaped having a varying slope and varying amplitudes associated with each of the segments of the slope. Unlike the truncated exponential waveform delivered by the conventional therapy delivery circuit which is based on the behavior of the output capacitors (i.e., i=C(dV/dt)), the stimulation waveform of the present disclosure may be dynamically shaped as a function of an individual patient's response. The dynamically shaped therapy stimulation waveforms facilitate achieving lower capture thresholds which reduces the device's supply consumption and reduction of tissue damage.
摘要翻译：电子技术的最新进展为植入式医疗设备的增强提供了机会。增强功能有助于提高小型化和运营效率。本公开的技术有助于基于患者对刺激波形的生理反应来配置刺激治疗波形。产生的治疗刺激波形包括阶梯式前缘，其可以被成形为具有与斜率的每个段相关联的变化的斜率和变化的幅度。与基于输出电容器的行为（即，i = C（dV / dt））的传统治疗传递电路传递的截断指数波形不同，本公开的刺激波形可以动态地形成为个人病人的反应。动态形状的治疗刺激波形有助于实现较低的捕获阈值，这降低了装置的供应消耗并减少了组织损伤。

8. 发明公开

EP4291090A1 OPTICAL BASED GLUCOSE SENSOR 审中-实审
公开(公告)号：EP4291090A1
公开(公告)日：2023-12-20
申请号：EP22706713.9
申请日：2022-02-03
申请人： Medtronic, Inc.
发明人： PROBST, David L. , BOONE, Mark R.
IPC分类号： A61B5/145 , A61B5/1486 , A61B5/1459 , A61B5/00 , A61B5/1455

9. 发明公开

EP3861572A1 INTEGRATED CIRCUIT PACKAGE 有权
公开(公告)号：EP3861572A1
公开(公告)日：2021-08-11
申请号：EP19787539.6
申请日：2019-09-30
申请人： Medtronic, Inc.
发明人： BOONE, Mark R. , HENSCHEL, Mark E.
IPC分类号： H01L25/075 , H01L33/62 , H01S5/022 , H01S5/042 , H01S5/42 , A61N1/00

10. 发明授权

EP3191181B1 MULTI-PRIMARY TRANSFORMER CHARGING CIRCUITS FOR IMPLANTABLE MEDICAL DEVICES 有权
公开(公告)号：EP3191181B1
公开(公告)日：2018-09-26
申请号：EP15747924.7
申请日：2015-07-28
申请人： Medtronic, Inc.
发明人： CRUTCHFIELD, Randolph E. , BOONE, Mark R. , CABELKA, Lonny V. , MEADOR, John T.
IPC分类号： A61N1/378 , A61N1/39
CPC分类号： A61N1/3975 , A61N1/3782 , A61N1/3956 , H02J7/0021 , H02J7/007
摘要： An implantable medical device includes a low-power circuit and a multi-cell power source. The cells of the power source are coupled to a transformer in a parallel configuration. The transformer includes multiple secondary windings and each of the windings is coupled to a capacitor that stores energy for delivery of a therapy to a patient. In accordance with embodiments of this disclosure, the low power circuit is configured to control simultaneous delivery of energy from each of the cells to a plurality of capacitors through the transformer.

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