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1. 发明公开

EP1253607A1 INDUCTANCE PART AND ITS MANUFACTURING METHOD 审中-公开
标题翻译：印度尼西亚联合王国的赔偿责任
公开(公告)号：EP1253607A1
公开(公告)日：2002-10-30
申请号：EP01974887.0
申请日：2001-10-16
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KANETAKA, Toyonori , YOSHIZAWA, Toshihiro , YAMAMOTO, Hiromasa
IPC分类号： H01F41/04 , H01F17/00
CPC分类号： H01F41/046 , H01F17/0033 , H01F17/045
摘要： An inductance component comprising a column-shaped magnetic material substrate 21, conductor layer 24 covering ends and a peripheral surface of the substrate, coil portion 27 having groove portion 25 and wire conductor portion 26 formed in the conductor layer covering the peripheral surface, electrode portions 28 including the conductor layer covering the ends of the substrate, and magnetic material portion 31 made of sintered magnetic material on the coil portion, wherein the conductor layer has a melting point higher than a sintering temperature of the sintered magnetic material. The manufacturing process comprises; forming a substrate, forming a conductor layer, forming a coil portion, forming electrode portions at ends of the substrate, and forming a magnetic material portion of sintered magnetic material on the coil portion. The present invention provides an inductance component with high inductance, low magnetic flux leakage, and less bad magnetic effects to adjacent components.
摘要翻译：一种电感元件，包括柱形磁性材料基板21，覆盖端部的导体层24和基板的外围表面，具有沟槽部分25的线圈部分27和形成在覆盖外围表面的导体层中的导线部分26，电极部分包括覆盖基板的端部的导体层和在线圈部分上由烧结磁性材料制成的磁性材料部分31，其中导体层的熔点高于烧结磁性材料的烧结温度。制造工艺包括形成衬底，形成导体层，形成线圈部分，在衬底的端部形成电极部分，以及在线圈部分上形成烧结磁性材料的磁性材料部分。本发明提供一种具有高电感，低磁通泄漏和对相邻部件的不良磁效应的电感分量。

2. 发明公开

EP1195781A1 METHOD OF MANUFACTURING CHIP INDUCTOR 审中-公开
标题翻译：处理芯片电感
公开(公告)号：EP1195781A1
公开(公告)日：2002-04-10
申请号：EP01921819.7
申请日：2001-04-12
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KANETAKA, Toyonori , YOSHIZAWA, Toshihiro , FUJIMORI, Akira , NAKAYAMA, Hideaki , YAMAMOTO, Hiromasa , TAOKA, Mikio , YAMADA, Kenichi
IPC分类号： H01F41/04
CPC分类号： H01F41/041 , H01F27/027 , H01F27/292 , H01F41/127
摘要： Manufacturing method of the present invention comprises the steps of a conductive layer forming process for forming conductive layer 4 on outer periphery 2 and end surfaces 3 of substrate 1, a coil portion forming process for forming coil portion 7 having conductor 5 and groove 6 by cutting spirally the conductive layer 4, an etching process for etching the substrate 1 having the coil portion 7 formed thereon; an insulation resin coating process for forming outer coating 8 by coating a surface of the conductive layer 4 with insulation resin 13; and an electrode forming process for forming electrodes 9 at both ends of the coil portion 7, and for making electric contacts between electrodes 9 and the conductive layer 4. A chip inductor having a flattened mounting surface of the outer coating is obtained when insulation resin layer 8 is formed by an electrodeposition in the insulation resin coating process. The chip inductor can be securely mounted to a circuit board.

3. 发明授权

EP0982742B1 MODULE AND METHOD OF MANUFACTURE 有权
标题翻译：组件及其制造方法
公开(公告)号：EP0982742B1
公开(公告)日：2007-08-15
申请号：EP99909182.0
申请日：1999-03-11
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD
发明人： IBATA, Akihiko , OOBA, Michio , YOSHIZAWA, Toshihiro
IPC分类号： H01F27/00 , H03H7/01
CPC分类号： H01G4/35 , H01F17/045 , H01G4/38 , H01G4/40 , H03H7/0115 , H03H2001/0085 , Y10T29/4902
摘要： A module includes a capacitor composed of an insulating layer and electrodes, and a continuous spiral conductor, and a plurality of terminals formed in contact with the peripheries of the capacitor. The spiral electric conductor is composed of the same material as the terminals of the module. The spiral conductor has its axis parallel with the surface of the conductor layer that composes the capacitor. The module can include a plurality of capacitors inside. As a result, the module shows preferable electric properties compared to those according to the prior art. Since many kinds of filter circuits can be formed by slightly changing production conditions, this module is suited to the production of a variety of products in small quantity.

4. 发明公开

EP1338391A1 METHOD OF MANUFACTURING CERAMIC MATERIAL BODY 审中-公开
标题翻译：法生产陶瓷体
公开(公告)号：EP1338391A1
公开(公告)日：2003-08-27
申请号：EP01980984.7
申请日：2001-11-06
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： IBATA, Akihiko , OBA, Michio , YOSHIZAWA, Toshihiro
IPC分类号： B28B11/14
CPC分类号： B28B11/10 , B28B11/14 , B28B11/168
摘要： A method of manufacturing ceramic bodies comprising the steps of: preparing a ceramic sheet; forming through holes in the ceramic sheet, each of the through hole forming at least one part of the contour of each ceramic bodies; and cutting the ceramic sheet into pieces of ceramic bodies. The ceramic sheet can be a single ceramic sheet or a laminate of ceramic sheets. The method of manufacturing ceramic bodies further comprises a step of forming a recess in the ceramic sheet, or pressure molding or partially removing of the ceramic body, as required. The manufacturing method provides inexpensive production of small ceramic elements having a complicated shape and extremely smooth surfaces with less uneven filling and nonuniform density.

5. 发明公开

EP0785559A1 CHIP COIL 失效
标题翻译：芯片线圈
公开(公告)号：EP0785559A1
公开(公告)日：1997-07-23
申请号：EP96920018.7
申请日：1996-05-31
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KANETAKA, Toyonori , TAOKA, Mikio , YOSHIZAWA, Toshihiro
IPC分类号： H01F17/00
CPC分类号： H01F27/292 , H01F17/0033 , H03H7/0115
摘要： The present invention relates to a chip coil for use in the electronic appliance or such other equipment, and intended to present a chip coil of an excellent mounting capability. Recesses (6) are provided only in the top and bottom surfaces of main body (1) having a square pillar shape, and in the bottom surface of main body (1) an insulation resin (4) is provided in the recess (6) to cover coil (2) within the space of recess (6).
摘要翻译：本发明涉及一种用于电子设备或其他设备中的片状线圈，并且旨在提供一种具有优异安装能力的片状线圈。凹部6仅设置在方柱形状的主体1的上表面和下表面中，并且在主体1的底表面中在凹部6中设置绝缘树脂4，以覆盖凹槽（6）的空间内的线圈（2）。

6. 发明授权

EP0921542B1 CHIP INDUCTOR AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：片式电感器及其制造方法
公开(公告)号：EP0921542B1
公开(公告)日：2005-11-09
申请号：EP98911019.2
申请日：1998-03-26
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KANETAKA, Toyonori , YOSHIZAWA, Toshihiro , FUJIMORI, Akira , TAOKA, Mikio , NAKAYAMA, Hideaki
IPC分类号： H01F41/12 , H01F17/00 , H01F41/02
CPC分类号： H01F27/292 , H01F17/0033 , H01F17/045 , H01F27/327 , H01F41/041 , H01F41/122 , Y10T29/4902 , Y10T29/49073
摘要： The electrical characteristic of the chip inductor is improved by preventing the occurrence of short circuits among the linear conductor sections of the coil section of the inductor by appropriately insulating the conductor sections from each other and, at the same time, the mounting surface of the exterior section of the inductor is flattened so that the inductor can be mounted accurately on an object. The chip inductor is provided with a prism-like main body (1) made of an insulating material, electrode sections (6) positioned to both end sections of the main body (1), the coil section (5) which is connected to the electrode sections (6) and, at the same time, positioned on the outer periphery of the main body (1) between the electrode sections (6), and the exterior section (9) coating the coil section (5) with an insulating resin (8). The coil section (5) has the linear conductor sections (3) and groove sections (4) formed by grooving a conductor layer (2) formed on the surface of the main body (1). The internal spaces of the groove sections (4) are also filled up with the insulating resin (8).

7. 发明公开

EP1536434A1 COIL PART AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译： SPULENTEIL UND VERFAHREN ZU SEINER HERSTELLUNG
公开(公告)号：EP1536434A1
公开(公告)日：2005-06-01
申请号：EP03766689.8
申请日：2003-08-01
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： NAKAYAMA, Hideaki , SEO, Toshiyuki , YAMAMOTO, Hiromasa , YOSHIZAWA, Toshihiro , FUJIMORI, Akira , KANETAKA, Toyonori
IPC分类号： H01F17/02 , H01F27/29 , H01F41/04
CPC分类号： H01F17/02 , H01F17/0033 , H01F17/045 , H01F27/027 , H01F27/327 , H01F41/041 , Y10T428/24917
摘要： A coil component of the present invention has prismatic base body (1), copper plated layer (2) formed on the outer periphery of base body (1), coil section (3) that is formed by spirally grooving copper plated layer (2) and has linear section (3a) and groove (3b), exterior section (8) formed on coil section (3), and electrode section (9). Insulating coating layer (4) is disposed between copper plated layer (2) formed on the outer periphery of longitudinal section (1a) of base body (1) and exterior section (8). The copper plated layer of the coil section can be suppressed from being exposed at the surface of exterior section (8).
摘要翻译：本发明的线圈部件具有棱形基体（1），形成在基体（1）的外周的铜电镀层（2），由螺旋形切槽的镀铜层（2）形成的线圈部（3）并具有形成在线圈部（3）上的直线部（3a）和槽（3b），外部部分（8）和电极部（9）。绝缘涂层（4）设置在形成在基体（1）的纵向部分（1a）的外周上的铜镀层（2）和外部部分（8）之间。可以抑制线圈部分的镀铜层暴露在外部部分（8）的表面。

8. 发明授权

EP0785559B1 CHIP COIL 失效
标题翻译：芯片线圈
公开(公告)号：EP0785559B1
公开(公告)日：2002-08-14
申请号：EP96920018.7
申请日：1996-05-31
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KANETAKA, Toyonori , TAOKA, Mikio , YOSHIZAWA, Toshihiro
IPC分类号： H01F17/00 , H01F27/29
CPC分类号： H01F27/292 , H01F17/0033 , H03H7/0115
摘要： A chip coil used for electronic appliances, which improves mounting efficiency. Processes (6) are formed in only the upper and lower surfaces of a prismatic main body (1), and an insulating resin (4) is filled in the recess (6) of the lower surface to cover a coil (2) in the recess (6).
摘要翻译：用于电子设备的芯片线圈，提高了安装效率。仅在棱柱形主体（1）的上表面和下表面中形成工艺（6），并且绝缘树脂（4）填充在下表面的凹槽（6）中以覆盖凹处（6）。

9. 发明公开

EP0982742A1 MODULE AND METHOD OF MANUFACTURE 有权
标题翻译： BAUGRUPPE UND VERFAHREN ZUR HERSTELLUNG
公开(公告)号：EP0982742A1
公开(公告)日：2000-03-01
申请号：EP99909182.0
申请日：1999-03-11
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： IBATA, Akihiko , OOBA, Michio , YOSHIZAWA, Toshihiro
IPC分类号： H01F27/00
CPC分类号： H01G4/35 , H01F17/045 , H01G4/38 , H01G4/40 , H03H7/0115 , H03H2001/0085 , Y10T29/4902
摘要： A composite component of the invention comprises a spiral strip of conductor and a plurality of terminals formed in close contact to an external periphery of a capacitor constructed of an insulation layer and electrode layers. The spiral strip of conductor is made of the same material as the terminals of the composite component. The composite component is characterized by its structure that a spiral axis of the spiral strip of conductor is in parallel with a plane of the electrode layers composing the capacitor. Also, the composite component of this invention is able to contain therein a plurality of the capacitors. Therefore, the composite component exhibits superior electrical characteristics not available from similar composite component of the prior art. Furthermore, a method of the invention is capable of manufacturing composite components containing a large variety of filter circuits without requiring a substantial change in the manufacturing condition. The method is therefore suitable for manufacturing the composite components of small quantity, but in numerous variations.
摘要翻译：本发明的复合部件包括导体的螺旋带和与由绝缘层和电极层构成的电容器的外周紧密接触形成的多个端子。导体的螺旋带由与复合部件的端子相同的材料制成。复合部件的特征在于其结构是导体的螺旋带的螺旋轴线与构成电容器的电极层的平面平行。此外，本发明的复合部件能够容纳多个电容器。因此，复合组分表现出优异的电学特性，其不可用于现有技术的类似复合组分。此外，本发明的方法能够制造包含各种滤波器电路的复合元件，而不需要制造条件的实质性改变。因此，该方法适用于制造少量的复合材料，但在许多变型中。

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