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1. 发明公开

EP0471522A1 Resin composition based on polymaleimide and phenolic aralkyl resin 失效转让
标题翻译： Harzmischung auf Basis von Polymaleimid und Aralkyl-Phenolharz。
公开(公告)号：EP0471522A1
公开(公告)日：1992-02-19
申请号：EP91307360.7
申请日：1991-08-09
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Kitahara, Mikio , Machida, Koichi , Kubo, Takayuki , Torikai, Motoyuki , Asahina, Koutarou , Tanaka, Junsuke , Yamaguchi, Akihiro
IPC分类号： C08K5/3415 , C08L61/12 , C08L35/00
CPC分类号： H01B3/40 , C08K5/3415 , C08L61/06 , C08L63/00 , C08L65/00 , C08L79/08 , H01B3/30 , H01B3/36 , C08L61/12 , C08L2666/14 , C08L2666/22
摘要： A resin composition for sealing semiconductors comprises an organic component (A) which contains (a) a polymaleimide compound represented by the formula (I):

wherein R₁ is a m-valent organic group having two or more carbon atoms and m is an integer of two or more and (b) a phenolic aralkyl resin represented by the formula (II):

wherein X is a divalent group having the formula

or

, and n is an integer of from 0 to 100, or contains a mixture of the phenolic aralkyl resin and a phenol, and component (B) which contains an inorganic filler.
摘要翻译：用于密封半导体的树脂组合物包含含有（a）由式（I）表示的聚马来酰亚胺化合物的有机组分（A）：其中R 1是具有两个或更多个碳原子的m价有机基团，m是 2个以上的整数，（b）由式（II）表示的酚芳烷基树脂：其中X是具有式CHEM>或CHEM的二价基团，n是0的整数至100，或含有酚芳烷基树脂和酚的混合物，以及含有无机填料的组分（B）。

2. 发明公开

EP0400898A3 Heat resistant epoxy resin composition 失效
标题翻译：耐热环氧树脂组合物
公开(公告)号：EP0400898A3
公开(公告)日：1993-01-07
申请号：EP90305668.7
申请日：1990-05-24
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Kitahara, Mikio , Machida, Koichi , Kubo, Takayuki , Torikai, Motoyuki , Asahina, Koutarou , Tanabe, Yoshimitsu , Yamaguchi, Keizaburo , Yamaguchi, Akihiro
IPC分类号： C08K5/3415 , C08L63/00 , C07D207/452
CPC分类号： C07D207/452 , C08K5/3415 , C08L63/00
摘要： Heat-resistant epoxy resin composition obtained by incorporation of 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane in a resin composition consisting essentially of epoxy resin and an epoxy hardener is disclosed.
摘要翻译：公开了通过在基本上由环氧树脂和环氧固化剂组成的树脂组合物中引入2-（4-羟基苯基）-2-（4-马来酰亚胺基苯基）丙烷获得的耐热环氧树脂组合物。

3. 发明公开

EP0397396A2 Resin composition for sealing semiconductors 失效
标题翻译： Zusammensetzungfürdie Versiegelung von Halbleitern。
公开(公告)号：EP0397396A2
公开(公告)日：1990-11-14
申请号：EP90304823.9
申请日：1990-05-03
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Kitahara, Mikio , Machida, Koichi , Kubo, Takayuki , Torikai, Motoyuki , Asahina, Koutarou
IPC分类号： H01L23/29
CPC分类号： C08G59/621 , C08G59/3218 , C08G59/4042 , H01L23/293 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A resin composition for sealing semiconductors which shows high heat resistance and is suitable for sealing semiconductor devices, etc., and which comprises an organic component containing a polymaleimide compound represented by the general formula :
where R₁ is a m-valent organic group having at least 2 carbon atoms and m is a positive integer of 2 or more, epoxy compounds mainly consisting of an epoxy compound represented by the general formula :
where n is a positive integer of 3 - 16 and a compound having two or more phenolic hydroxyl groups, and an inorganic filler.
摘要翻译：一种密封半导体用密封半导体器件等的半导体密封用树脂组合物，其含有下述通式所示的聚马来酰亚胺化合物的有机成分：＆lt; CHEM＆gt;其中R 1为m价有机基团具有至少2个碳原子且m为2以上的正整数的环氧化合物，其主要由通式为：CHEM的环氧化合物组成，其中n为3〜16的正整数，更多的酚羟基和无机填料。

4. 发明公开

EP0360461A2 Resin compositions for sealing semiconductors 失效
标题翻译： Harzzusammensetzungen zum Abdichten von Halbleitern。
公开(公告)号：EP0360461A2
公开(公告)日：1990-03-28
申请号：EP89309070.4
申请日：1989-09-07
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Kitahara, Mikio , Machida, Koichi , Kubo, Takayuki , Torikai, Motoyuki , Asahina, Koutarou
IPC分类号： C08L63/00 , C08L51/08
CPC分类号： C08L51/08 , C08G59/063 , C08G59/10 , C08G59/3218 , C08G59/3227 , C08L63/00 , C08L2666/14 , C08L83/00
摘要： A resin composition for sealing semiconductors which comprises (a) a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent and (c) an inorganic filler, is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.
摘要翻译：一种用于密封半导体的树脂组合物，其包含（a）由（i）具有特定结构的环氧树脂或具有特定结构的环氧树脂的接枝聚合物和乙烯基聚合物组成的改性环氧树脂，和（ii）硅氧烷聚合物在油状态下或作为均匀分散在环氧树脂或接枝聚合物中的平均粒径不大于1.0微米的颗粒，（b）硬化剂和（c）无机填料。用于密封半导体的树脂组合物表现出低热膨胀系数和低弹性模量，当施加热冲击时产生低应力，并且即使在吸湿之后也显示出在焊接期间的高耐热性。因此，如果组合物用于密封具有高集成度的大型半导体器件或小型，薄型半导体（例如扁平封装），则这些半导体提供高可靠性。

5. 发明公开

EP0397396A3 Resin composition for sealing semiconductors 失效
标题翻译：用于密封半导体的树脂组合物
公开(公告)号：EP0397396A3
公开(公告)日：1991-08-21
申请号：EP90304823.9
申请日：1990-05-03
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Kitahara, Mikio , Machida, Koichi , Kubo, Takayuki , Torikai, Motoyuki , Asahina, Koutarou
IPC分类号： H01L23/29
CPC分类号： C08G59/621 , C08G59/3218 , C08G59/4042 , H01L23/293 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A resin composition for sealing semiconductors which shows high heat resistance and is suitable for sealing semiconductor devices, etc., and which comprises an organic component containing a polymaleimide compound represented by the general formula :
where R₁ is a m-valent organic group having at least 2 carbon atoms and m is a positive integer of 2 or more, epoxy compounds mainly consisting of an epoxy compound represented by the general formula :
where n is a positive integer of 3 - 16 and a compound having two or more phenolic hydroxyl groups, and an inorganic filler.

6. 发明公开

EP0350326A2 Resin compositions for sealing semiconductors 失效
标题翻译：用于密封半导体的树脂组合物
公开(公告)号：EP0350326A2
公开(公告)日：1990-01-10
申请号：EP89306928.6
申请日：1989-07-07
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Machida, Koichi , Kitahara, Mikio , Kubo, Takayuki , Torikai, Motoyuki , Asahina, Koutarou
IPC分类号： C08G59/32 , C08F283/10 , C08K3/00 , H01L23/29 , C08L51/08
CPC分类号： H01L23/293 , C08F283/10 , C08F285/00 , C08G59/063 , C08G59/3218 , H01L2924/0002 , H01L2924/00
摘要： A resin composition for sealing semiconductors which comprises (a) a modified epoxy resin composed of (i) a graft polymer of an epoxy resin having the structure (I);
and a vinyl polymer and (ii) a soft vinyl-modified silicone polymer as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer, (b) a hardening agent and (c) an inorganic filler, is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.
摘要翻译：一种半导体密封用树脂组合物，其含有（a）由（i）具有结构（I）的环氧树脂的接枝聚合物构成的改性环氧树脂; 乙烯基聚合物和（ii）软质乙烯基改性硅氧烷聚合物作为均匀分散在接枝聚合物中的平均粒径不超过1.0微米的颗粒，（b）硬化剂和（c）无机填料，在此被提供。用于密封半导体的树脂组合物呈现低热膨胀系数和低弹性模量，当施加热冲击时产生低应力并且即使在吸湿后也在焊接期间表现出高耐热性。因此，如果该组合物用于密封具有高度集成度的大规模半导体器件或诸如扁平封装的小尺寸薄半导体，则这些半导体提供高可靠性。

7. 发明授权

EP0471522B1 Resin composition based on polymaleimide and phenolic aralkyl resin 失效转让
标题翻译：基于聚马来酰亚胺和芳烷基酚醛树脂的树脂混合物
公开(公告)号：EP0471522B1
公开(公告)日：1995-12-13
申请号：EP91307360.7
申请日：1991-08-09
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Kitahara, Mikio , Machida, Koichi , Kubo, Takayuki , Torikai, Motoyuki , Asahina, Koutarou , Tanaka, Junsuke , Yamaguchi, Akihiro
IPC分类号： C08K5/3415 , C08L61/12 , C08L35/00
CPC分类号： H01B3/40 , C08K5/3415 , C08L61/06 , C08L63/00 , C08L65/00 , C08L79/08 , H01B3/30 , H01B3/36 , C08L61/12 , C08L2666/14 , C08L2666/22

8. 发明公开

EP0397395A3 Resin composition for sealing semiconductors 失效
标题翻译：用于密封半导体的树脂组合物
公开(公告)号：EP0397395A3
公开(公告)日：1993-09-15
申请号：EP90304822.1
申请日：1990-05-03
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Kitahara, Mikio , Machida, Koichi , Kubo, Takayuki , Torikai, Motoyuki , Asahina, Koutarou
IPC分类号： C08G59/40 , C08G59/62 , C08L63/00 , H01L23/29 , C08G73/12 , C08L79/08
CPC分类号： H01B3/40 , C08G59/4042 , C08G59/621 , C08L63/00 , C08L2666/14
摘要： A resin composition for sealing semiconductors which exhibits high heat resistance and is suitable for sealing semiconductor devices, etc., and which comprises an organic component containing a polymaleimide compound represented by the general formula :

where R₁ is a m-valent organic group having at least 2 carbon atoms and m is a positive integer of 2 or more, and phenols mainly consisting of a phenol compound represented by the general formula :

where n is a positive integer of 3 - 16, or an organic component containing (c) epoxy resin in addition to the polymaleimide and the phenol compound, and an inorganic filler.
摘要翻译：一种用于密封半导体的耐热性高，适用于密封半导体器件等的半导体用树脂组合物，其包含含有下述通式表示的聚马来酰亚胺化合物的有机成分：，其中R 1为m价有机基团具有至少2个碳原子，m为2以上的正整数，以及主要由通式为：CHEM的苯酚化合物组成的酚类，n为3〜16的正整数，或含有（c）除了聚马来酰亚胺和酚化合物之外的环氧树脂和无机填料。

9. 发明公开

EP0350326A3 Resin compositions for sealing semiconductors 失效
标题翻译：用于密封半导体的树脂组合物
公开(公告)号：EP0350326A3
公开(公告)日：1991-12-18
申请号：EP89306928.6
申请日：1989-07-07
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Machida, Koichi , Kitahara, Mikio , Kubo, Takayuki , Torikai, Motoyuki , Asahina, Koutarou
IPC分类号： C08G59/32 , C08F283/10 , C08K3/00 , H01L23/29 , C08L51/08
CPC分类号： H01L23/293 , C08F283/10 , C08F285/00 , C08G59/063 , C08G59/3218 , H01L2924/0002 , H01L2924/00
摘要： A resin composition for sealing semiconductors which comprises (a) a modified epoxy resin composed of (i) a graft polymer of an epoxy resin having the structure (I);
and a vinyl polymer and (ii) a soft vinyl-modified silicone polymer as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer, (b) a hardening agent and (c) an inorganic filler, is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.

10. 发明公开

EP0354033A3 Resin compositions for sealing semiconductors 失效
标题翻译：用于密封半导体的树脂组合物
公开(公告)号：EP0354033A3
公开(公告)日：1991-11-13
申请号：EP89307896.4
申请日：1989-08-03
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Machida, Koichi , Kitahara, Mikio , Kubo, Takayuki , Torikai, Motoyuki , Asahina, Koutarou
IPC分类号： C08L63/00 , C08G59/40 , C08G59/56 , C08G73/12 , C08L79/08
CPC分类号： H01B3/40 , C08G59/4042 , C08L63/00 , H01B3/306 , C08L79/08
摘要： A resin composition for sealing semiconductors which comprises (a) an epoxy resin, (b) a hardening agent, (c) an inorganic filler and (d) a polymaleimide having a specific structure is herein provided. Preferably, the resin composition comprises, as all of or a part of the epoxy resin, a modified epoxy resin composed of (i) a graft polymer of an epoxy resin and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal semiconductor devices on a large scale having degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.

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