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1. 发明授权

EP0500292B1 Heat-resistant polyimide adhesive 失效
标题翻译：的耐热性聚酰亚胺粘合剂。
公开(公告)号：EP0500292B1
公开(公告)日：1995-01-11
申请号：EP92301272.8
申请日：1992-02-17
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Tamai, Shoji , Yamaguchi, Akihiro , Iiyama, Katsuaki
IPC分类号： C08G73/10 , C09J179/08
CPC分类号： C08G73/1071 , Y10S526/935

2. 发明公开

EP0294144A1 Polyimide resin composition 失效
标题翻译：聚酰亚胺树脂组合物
公开(公告)号：EP0294144A1
公开(公告)日：1988-12-07
申请号：EP88304936.3
申请日：1988-05-31
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Ohta, Masahiro , Iiyama, Katsuaki , Kawashima, Saburo , Tamai, Shoji , Oikawa, Hideaki , Yamaguchi, Akihiro
IPC分类号： C08L79/08
CPC分类号： C08L79/08 , Y10S525/906 , Y10S525/928 , C08L81/00
摘要： This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.
The polyimide resin composition of this invention consists of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide consists of recurring units of the following formula:
wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example,
The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula:
aromatic polysulfone consisting of recurring units of the formula:
or aromatic polyetherimide consisting of recurring units of the formula:
摘要翻译：本发明涉及模塑树脂组合物，并且更具体地涉及除了优异的高温稳定性，耐化学性和机械强度之外还具有显着改进的模塑能力的聚酰亚胺树脂组合物。本发明的聚酰亚胺树脂组合物由99.9〜50重量％的聚酰亚胺和0.1〜50重量％的高温工程聚合物构成。聚酰亚胺由下式的重复单元组成：其中X是磺酰基或羰基，R是选自脂族基，脂环族基，单芳族基，稠合芳基和非稠合芳基的四价基团。 R为例如高温工程聚合物为例如由下式的重复单元组成的聚苯硫醚：由下式的重复单元组成的芳族聚砜：或由下式的重复单元组成的芳族聚醚酰亚胺：

3. 发明公开

EP0269319A2 Polyimide 无效
标题翻译：聚酰亚胺。
公开(公告)号：EP0269319A2
公开(公告)日：1988-06-01
申请号：EP87310002.8
申请日：1987-11-12
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Oikawa, Hideaki , Koga, Nobuhito , Iiyama, Katsuaki , Kawashima, Saburo , Tamai, Shoji , Ohta, Masahiro , Yamaguchi, Akihiro
IPC分类号： C08G73/10
CPC分类号： C08G73/1071 , C08G73/1046
摘要： Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability.
The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives.
The polyimide has recurring units of the following formula (I):
wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage.
The polyimide of this invention is prepared by reacting 4,4ʹ-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V):
and successively imidizing the resultant polyamic acid.
摘要翻译：本发明的聚酰亚胺除了具有显着的高温稳定性外，几乎是无色的，并且具有非常高的透光率以及优异的加工性和高温下的粘合性。该聚酰亚胺是一种新型聚酰亚胺，可用于空间和航空材料，电气和电子部件，汽车部件以及高温粘合剂。聚酰亚胺具有下式（I）的重复单元：其中X是选自键，含1至10个碳的二价烃基，六氟化异丙叉基，羰基，磺酰基和硫代自由基，酰亚胺环的每个氮原子同时位于醚键或对位。本发明的聚酰亚胺通过使4,4' - （对亚苯基二氧基）二邻苯二甲酸二酐与具有以下通式（V）的醚二胺反应：并依次酰亚胺化所得聚酰胺酸制备。 Ë

4. 发明授权

EP0367482B1 Polyimides and process for the preparation thereof 失效
标题翻译：聚酰亚胺，以及它们的制备方法。
公开(公告)号：EP0367482B1
公开(公告)日：1994-09-21
申请号：EP89310983.5
申请日：1989-10-25
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Tamai, Shoji , Kawashima, Saburo , Ohta, Masahiro , Iiyama, Katsuaki , Oikawa, Hideaki , Ohkoshi, Kouji , Yamaguchi, Akihiro
IPC分类号： C08G73/10
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071

5. 发明授权

EP0294195B1 Polyimide resin composition 失效
标题翻译：聚酰亚胺树脂的制备。
公开(公告)号：EP0294195B1
公开(公告)日：1993-11-24
申请号：EP88305033.8
申请日：1988-06-02
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Ohta, Masahiro , Tamai, Shoji , Kawashima, Saburo , Oikawa, Hideaki , Yamaguchi, Akihiro , Iiyama, Katsuaki
IPC分类号： C08L79/08
CPC分类号： C08L79/08

6. 发明公开

EP0511813A3 Heat-resistant adhesive and method of adhesion by using adhesive 失效
标题翻译：耐高温粘合剂和使用粘合剂的粘合方法
公开(公告)号：EP0511813A3
公开(公告)日：1993-08-25
申请号：EP92303787.3
申请日：1992-04-27
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Oikawa, Hideaki , Iiyama, Katsuaki , Tamai, Shoji , Kawashima, Saburo , Yamaguchi, Akihiro , Asanuma, Tadashi
IPC分类号： C08G73/10 , C09J179/08
CPC分类号： C08G73/1071 , C08G73/1014 , C08G73/1017 , C09J179/08 , H05K3/386 , Y10S525/928
摘要： The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride and/or 3,3′,4,4′-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound ; or comprises a polyimide solution containing the polyimide in a good solvent. The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength. Consequently, the heat-resistant adhesive of the invention is very useful for the adhesion of structural and electronic materials and other industrial materials.

7. 发明授权

EP0341052B1 Polyimide resin composition 失效
公开(公告)号：EP0341052B1
公开(公告)日：1993-03-10
申请号：EP89304477.6
申请日：1989-05-04
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Ohta, Masahiro , Iiyama, Katsuaki , Kawashima, Saburo , Tamai, Shoji , Oikawa, Hideaki , Yamaguchi, Akihiro
IPC分类号： C08L79/08
CPC分类号： C08L79/08

8. 发明公开

EP0350203A3 Process for preparing polyimide having excellent high temperature stability 失效
标题翻译：制备具有极好的高温稳定性的聚酰亚胺的方法
公开(公告)号：EP0350203A3
公开(公告)日：1990-10-31
申请号：EP89306579.7
申请日：1989-06-28
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Ohta, Masahiro , Iiyama, Katsuaki , Kawashima, Saburo , Tamai, Shoji , Oikawa, Hideaki , Yamaguchi, Akihiro
IPC分类号： C08G73/10
CPC分类号： C08G73/14 , C08G73/1003 , C08G73/1014 , C08G73/1042 , C08G73/1078
摘要： This invention relates to a process for preparing polyimide having good heat-stability and excellent flowability in a molten state. The polyimide is prepared by reacting 3,3′-diaminobenzophnone or bis(3-aminophenyl)sulfone, tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and dicarboxylic anhydrides such as glutaric anhydride, 1,2-hexanedicarboxylic anhydride, phthalic anhydride and 3,4-benzophenonedicarboxylic anhydride. The molar ratio of aromatic diamine : tetracarboxylic dianhydride : dicarboxylic anhydride is 1 :(0.9 to 1.0) : (0.001 to 1.0).

9. 发明公开

EP0294195A2 Polyimide resin composition 失效
标题翻译： Polyimid Harzzubereitung。
公开(公告)号：EP0294195A2
公开(公告)日：1988-12-07
申请号：EP88305033.8
申请日：1988-06-02
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Ohta, Masahiro , Tamai, Shoji , Kawashima, Saburo , Oikawa, Hideaki , Yamaguchi, Akihiro , Iiyama, Katsuaki
IPC分类号： C08L79/08
CPC分类号： C08L79/08
摘要： Resin composition composed of 99.9 to 50 % by weight of a polyimide having a repeating unit of the formula as defined below and 0.1 to 50 % by weight of an aromatic polyamideimide are improved in heat resistance and mechanical strength and have the inherent properties of polyimide;
where X indicates a direct bond or is -S- or
and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncondensed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage.
摘要翻译：由99.9〜50重量％的具有下式的重复单元的聚酰亚胺和0.1〜50重量％的芳香族聚酰胺酰亚胺构成的树脂组合物的耐热性和机械强度提高，具有聚酰亚胺的固有性质; 其中X表示直接键或是-S-或，R是选自具有至少2个碳原子的脂族基团，环脂族基团，单环芳族基团和缩合多环芳族基团的四价基团，以及非缩合的多环芳族基团，包括直接或通过交联键互连的芳族基团。

10. 发明授权

EP0350203B1 Process for preparing polyimide having excellent high temperature stability 失效
标题翻译：一种用于在具有优异的温度稳定性的聚酰亚胺的制造过程
公开(公告)号：EP0350203B1
公开(公告)日：1996-05-29
申请号：EP89306579.7
申请日：1989-06-28
申请人： MITSUI TOATSU CHEMICALS, Inc.
发明人： Ohta, Masahiro , Iiyama, Katsuaki , Kawashima, Saburo , Tamai, Shoji , Oikawa, Hideaki , Yamaguchi, Akihiro
IPC分类号： C08G73/10
CPC分类号： C08G73/14 , C08G73/1003 , C08G73/1014 , C08G73/1042 , C08G73/1078

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