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    • 3. 发明公开
    • LIGHT EMITTING DEVICE USING LED
    • LICHTEMITTIERENDE EINRICHTUNG MIT LED
    • EP1439584A1
    • 2004-07-21
    • EP02762899.9
    • 2002-08-28
    • Matsushita Electric Works, Ltd.
    • HASHIMOTO, TakumaSUGIMOTO, MasaruKIMURA, HideyoshiSHIOHAMA, Eiji
    • H01L33/00
    • H01L33/642H01L25/0753H01L25/167H01L2224/45144H01L2224/48227H01L2924/181H01L2224/48091H01L2924/00014H01L2924/00012
    • A light emitting device that can provide enhanced heat radiation as well as allowing light from a light emitting diode (LED) chip to be efficiently extracted out of the device. This light emitting device includes a metal plate (11) that is made of aluminum. The metal plate (11) has a projection (11a) projecting forward. The projection (11a) has a front side provided with a housing recess (11b). An LED chip (1) is mounted on the bottom of the housing recess (11b) so that it is thermally coupled to the metal plate (11), thus allowing heat to be radiated efficiently. A printed circuit board (12), having a grass epoxy substrate to be joined to the front surface of the metal plate (11), is provided with an insertion hole (13) into which the projection (11a) is inserted. The LED chip (1) and a bonding wire (W) are encapsulated in a transparent resin seal portion (50). The side wall of the housing recess (11b) that is part of the metal plate (11) functions as a reflector for reflecting forward light emitted from the LED chip (1). Thus, light from the LED chip (1) can be extracted efficiently.
    • 可以提供增强的热辐射以及允许来自发光二极管(LED)芯片的光被有效地提取出设备的发光器件。 该发光装置包括由铝制成的金属板(11)。 金属板(11)具有向前突出的突起(11a)。 突起(11a)具有设置有壳体凹部(11b)的前侧。 LED芯片(1)安装在壳体凹部(11b)的底部,使其与金属板(11)热耦合,从而有效地辐射热量。 具有与金属板(11)的前表面接合的草环氧树脂基板的印刷电路板(12)设置有插入突起(11a)的插入孔(13)。 LED芯片(1)和接合线(W)被封装在透明树脂密封部分(50)中。 作为金属板(11)的一部分的壳体凹部(11b)的侧壁用作反射从LED芯片(1)发射的向前的光的反射器。 因此,可以有效地提取来自LED芯片(1)的光。