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    • 2. 发明公开
    • Chip component supply equipment
    • Verzorgungsvorrichtung von Bauelementfürintegrierte Schaltung。
    • EP0601603A1
    • 1994-06-15
    • EP93119983.0
    • 1993-12-10
    • MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    • Soga, TomitatuTanaka, KunioNegishi, ShigetoshiNakamura, HidekazuFujiwara, HiroyukiKato, KenjiFujita, TakayukiNakanishi, Tahashi
    • H05K13/02
    • H05K13/022
    • The chip component supply equipment of the invention comprises:
         a container box 2 for storing chip components 1 in pieces,
         means for conveying chip components 1 from the container box 2 onto a conveyor belt 7,
         a conveyor belt 7 moving intermittently for conveying the transferred chip components 1 toward a take-out port where a vacuum suction nozzle 15 of an electronic component placement machine takes out chip components, and
         a stopper 12 positioned at the take-out port for stopping the chip components 1 conveyed by the conveyor belt 7 at the take-out port,
         wherein the stopper 12 moves and departs from the take-out port when the conveyor belt 7 finishes intermittent motion and stops, and returns and is positioned at the take-out port before the next chip component 1 conveyed by next intermittent motion of the conveyor belt 7 reaches the take-out port.
      The vacuum suction nozzle of the electronic component placement machine takes out the chip component at the take-out port when the conveyor belt is stopped and the stopper is apart from the take-out port.
      Since the conveyor belt 7 is stopped, the chip component at the take-out port is not pushed by the succeeding chip component or is not moved by the vibration of the conveyor belt 7. This facilitates the work of the vacuum suction nozzle to take out the chip component. Furthermore, since the stopper is apart from the take-out part, there is no risk of interference of the vacuum suction nozzle and the chip component to be taken out with the stopper, and irregular chip components will not cause jamming in the take-out port. The benefits also contribute to the ease of work of the vacuum suction nozzle to take out the chip components.
    • 本发明的芯片部件供给装置包括:用于将芯片部件1容纳在一起的容器盒2,将片状部件1从容器盒2输送到传送带7上的传送带7,间歇地移动以传送转印芯片 部件1朝向电子部件配置机构的真空吸嘴15取出芯片部件的取出口,以及位于取出口的止动件12,用于使由输送带7输送的芯片部件1停止在 取出口,其中当传送带7完成间歇运动并停止时,止动件12移动和离开取出口,并且在下一次间歇传送下一个芯片部件1之前返回并定位在取出口处 输送带7的运动到达取出口。 当输送带停止时,电子元件贴装机的真空吸嘴在取出口取出芯片部件,止动件与出料口分开。 由于输送带7停止,所以取出口的芯片部件不会被后续的芯片部件推动,也不会被传送带7的振动所影响。这样可以使真空吸嘴的工作取出 芯片组件。 此外,由于止动件与取出部分分离,所以不存在真空吸嘴和芯片部件与止动器取出的干涉的危险,不规则的芯片部件不会在取出中产生卡住 港口。 这些优点还有助于真空吸嘴的易于工作以取出芯片部件。