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1. 发明公开

EP2589862A1 Illumination structure and assembly method of light base and cover 审中-公开
标题翻译： Beleuchtungsstruktur und Anordnungsverfahren der Lampenfassung und -abdeckung
公开(公告)号：EP2589862A1
公开(公告)日：2013-05-08
申请号：EP12190365.2
申请日：2012-10-29
申请人： Lextar Electronics Corp.
发明人： Lin, Yu-Min , Liao, Cheng-Chun , Chen, Ya-Wen , Cheng, Chia-Shen , Chen, Chang-Han , Hsu, Chin-Chang
IPC分类号： F21V17/16 , F21V3/02 , F21V7/22 , F21K99/00 , F21Y101/02
CPC分类号： F21V17/164 , F21K9/23 , F21V3/02 , F21V7/22 , F21Y2115/10 , Y10T29/49876
摘要： An illumination structure including an illumination module, a light base and a cover is provided. The light base includes a cylindrical shell and an electrical connector, wherein the cylindrical shell is used for receiving and supporting the illumination module. A first end of the cylindrical shell has a first edge including a plurality of protrusions. A second end of the cylindrical shell is connected to the electrical connector. The cover has a second edge including a plurality of recessions. Each recession is complementary in shape to a corresponding protrusion, so that the protrusions are received in corresponding recessions respectively.
摘要翻译：提供了包括照明模块，灯座和盖的照明结构。灯座包括圆柱形壳体和电连接器，其中圆柱形壳体用于接收和支撑照明模块。圆筒形壳体的第一端部具有包括多个突出部的第一边缘。圆筒壳的第二端连接到电连接器。盖具有包括多个凹陷的第二边缘。每个凹陷的形状与相应的突起互补，使得突起分别被接收在相应的凹陷中。

2. 发明授权

EP2843297B1 Light bar structure 有权
标题翻译：灯条结构
公开(公告)号：EP2843297B1
公开(公告)日：2017-12-20
申请号：EP14167564.5
申请日：2014-05-08
申请人： Lextar Electronics Corp.
发明人： Hsu, Chin-Chang , Yu, Chang-Lin
IPC分类号： F21S4/00 , F21V23/02 , F21V23/00 , F21Y115/10 , F21Y103/10
CPC分类号： F21K9/20 , F21S4/28 , F21V23/005 , F21V23/02 , F21V23/026 , F21Y2101/00 , F21Y2103/10 , F21Y2115/10
摘要： A light bar structure (10) is provided, including a longitudinal circuit board (100), a plurality of light-emitting elements (200), and a power-input terminal (300). The circuit board (100) includes a first segment (S1), a second segment (S2), and a third segment (S3) arranged along a longitudinal axis (A) of the circuit board, wherein the second segment (S2) is between the first segment (S1) and the third segment (S3). The light-emitting elements (200) are disposed on the circuit board (100). The power-input terminal (300) is disposed on the second segment (S2) and electrically connected to the light-emitting elements (200) in parallel.

3. 发明公开

EP2498308A2 Light-emitting diode with metal structure and heat sink 审中-公开
标题翻译： Leuchtdiode mit Metallstruktur undWärmesenke
公开(公告)号：EP2498308A2
公开(公告)日：2012-09-12
申请号：EP12158457.7
申请日：2012-03-07
申请人： Lextar Electronics Corp.
发明人： Hsu, Chin-Chang , Hsu, Feng-Jung , Wang, Chun-Wei , Liang, Jian-Chun
IPC分类号： H01L33/64 , H01L33/60
CPC分类号： H01L33/642 , H01L33/60
摘要： A light-emitting diode has a metal structure (100), a light-emitting chip, and a bowl structure (502). The metal structure has a platform (200) and a heat sink (300). The platform has a top face (206), a first side (201), and a second side (202) opposite to the first side. A first reflector (401) and a second reflector (402) respectively extend from the first side and the second side. The heat sink extends below the top face and has a drop from the bottom surfaces (406) of the first reflector and the second reflector. The light-emitting chip is disposed on the top face. The bowl structure covers the outer surface of the metal structure and shields the bottom surfaces of the first reflector and the second reflector. A thermal dissipation surface (302) of the heat sink is exposed from the bowl structure. An inner surface of bowl wall has a plurality of reflection structures to promote the light extraction efficiency.
摘要翻译：发光二极管具有金属结构（100），发光芯片和碗结构（502）。金属结构具有平台（200）和散热器（300）。平台具有顶面（206），第一侧（201）和与第一侧相对的第二侧（202）。第一反射器（401）和第二反射器（402）分别从第一侧和第二侧延伸。散热器在顶面下方延伸，并且具有从第一反射器和第二反射器的底表面（406）的下落。发光芯片设置在顶面上。碗结构覆盖金属结构的外表面并且屏蔽第一反射器和第二反射器的底表面。散热器的散热面（302）从碗状结构露出。碗壁的内表面具有多个反射结构以提高光提取效率。

4. 发明公开

EP2498308A3 Light-emitting diode with metal structure and heat sink 审中-公开
标题翻译：与金属结构和散热器发光二极管
公开(公告)号：EP2498308A3
公开(公告)日：2015-05-27
申请号：EP12158457.7
申请日：2012-03-07
申请人： Lextar Electronics Corp.
发明人： Hsu, Chin-Chang , Hsu, Feng-Jung , Wang, Chun-Wei , Liang, Jian-Chun
IPC分类号： H01L33/64 , H01L33/60
CPC分类号： H01L33/642 , H01L33/60
摘要： A light-emitting diode has a metal structure (100), a light-emitting chip, and a bowl structure (502). The metal structure has a platform (200) and a heat sink (300). The platform has a top face (206), a first side (201), and a second side (202) opposite to the first side. A first reflector (401) and a second reflector (402) respectively extend from the first side and the second side. The heat sink extends below the top face and has a drop from the bottom surfaces (406) of the first reflector and the second reflector. The light-emitting chip is disposed on the top face. The bowl structure covers the outer surface of the metal structure and shields the bottom surfaces of the first reflector and the second reflector. A thermal dissipation surface (302) of the heat sink is exposed from the bowl structure. An inner surface of bowl wall has a plurality of reflection structures to promote the light extraction efficiency.

5. 发明公开

EP2843297A1 Light bar structure 有权
标题翻译： Lichtbalkenstruktur
公开(公告)号：EP2843297A1
公开(公告)日：2015-03-04
申请号：EP14167564.5
申请日：2014-05-08
申请人： Lextar Electronics Corp.
发明人： Hsu, Chin-Chang , Yu, Chang-Lin
IPC分类号： F21S4/00 , F21V23/02 , F21V23/00 , F21Y101/02
CPC分类号： F21K9/20 , F21S4/28 , F21V23/005 , F21V23/02 , F21V23/026 , F21Y2101/00 , F21Y2103/10 , F21Y2115/10
摘要： A light bar structure (10) is provided, including a longitudinal circuit board (100), a plurality of light-emitting elements (200), and a power-input terminal (300). The circuit board (100) includes a first segment (S1), a second segment (S2), and a third segment (S3) arranged along a longitudinal axis (A) of the circuit board, wherein the second segment (S2) is between the first segment (S1) and the third segment (S3). The light-emitting elements (200) are disposed on the circuit board (100). The power-input terminal (300) is disposed on the second segment (S2) and electrically connected to the light-emitting elements (200) in parallel.
摘要翻译：提供了一种灯条结构（10），包括纵向电路板（100），多个发光元件（200）和电力输入端子（300）。电路板（100）包括沿着电路板的纵向轴线（A）布置的第一段（S1），第二段（S2）和第三段（S3），其中第二段（S2）在第一段（S1）和第三段（S3）。发光元件（200）设置在电路板（100）上。电源输入端子（300）设置在第二段（S2）上并且并联电连接到发光元件（200）。

6. 发明公开

EP2408031A3 Light emitting diode package and frame shaping method of the same 审中-公开
标题翻译：壳体为发光二极管及其制造方法导电框
公开(公告)号：EP2408031A3
公开(公告)日：2013-12-04
申请号：EP11174170.8
申请日：2011-07-15
申请人： Lextar Electronics Corp.
发明人： Chen, Chang-Han , Hsu, Chin-Chang
IPC分类号： H01L33/62 , H01L21/48 , H01L33/48 , H01L33/64 , H01L25/075 , H01L23/495
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/486 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2933/0066 , H01L2933/0075 , H01L2924/00014
摘要： A single material tape is shaped into first, second and third frames isolated from and disposed opposite each other, and a press forming process is performed to thin bottoms of first and second wire-bonding sectors extending from the first and second frames. The thickness of each of the first and second wire-bonding sectors is smaller than that of the third frame, so that the thicker third frame can be exposed out of a glue body to achieve the better dissipation effect, and at least one side surface between the two frames isolated from and disposed opposite each other is formed with a slot portion. When the frame is applied to the light emitting diode and fixed to the glue body, the slot portion can increase the bonding property between the frame and the glue body, and the structural strength therebetween can be increased.

7. 发明公开

EP2408031A2 Light emitting diode package and frame shaping method of the same 审中-公开
标题翻译： GehäusefürLeuchtdiode und Herstellungsverfahren seine leitenden Rahmen
公开(公告)号：EP2408031A2
公开(公告)日：2012-01-18
申请号：EP11174170.8
申请日：2011-07-15
申请人： Lextar Electronics Corp.
发明人： Chen, Chang-Han , Hsu, Chin-Chang
IPC分类号： H01L33/62 , H01L33/48 , H01L33/64
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/486 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2933/0066 , H01L2933/0075 , H01L2924/00014
摘要： A single material tape is shaped into first, second and third frames isolated from and disposed opposite each other, and a press forming process is performed to thin bottoms of first and second wire-bonding sectors extending from the first and second frames. The thickness of each of the first and second wire-bonding sectors is smaller than that of the third frame, so that the thicker third frame can be exposed out of a glue body to achieve the better dissipation effect, and at least one side surface between the two frames isolated from and disposed opposite each other is formed with a slot portion. When the frame is applied to the light emitting diode and fixed to the glue body, the slot portion can increase the bonding property between the frame and the glue body, and the structural strength therebetween can be increased.
摘要翻译：单个材料带被成形为从彼此隔离并相对设置的第一，第二和第三框架，并且执行压制成形处理以从第一和第二框架延伸的第一和第二引线接合扇区的薄底部。第一和第二引线接合扇区中的每一个的厚度小于第三框架的厚度，使得较厚的第三框架可以从胶体露出以实现更好的散热效果，并且至少一个侧面隔离并彼此相对设置的两个框架形成有槽部分。当将框架施加到发光二极管并固定到胶体上时，槽部分可以增加框架和胶体之间的粘合性能，并且可以增加其间的结构强度。

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