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1. 发明公开

EP2725611A3 Low inductance flex bond with low thermal resistance 审中-公开
标题翻译：低电感柔性结合，低热阻
公开(公告)号：EP2725611A3
公开(公告)日：2018-01-24
申请号：EP13186185.8
申请日：2013-09-26
申请人： LSI Corporation
发明人： Laturell, Donald R. , Abdelli, Said E. , Kiss, Peter , MacDonald, James F. , Wilson, Ross S.
IPC分类号： H01L23/498 , H01L23/538
CPC分类号： H05K1/0216 , H01L23/4985 , H01L23/5387 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2924/30107 , H01L2924/3011 , H05K1/028 , H05K3/306 , H05K3/4691 , H05K2201/042 , Y10T29/4913 , H01L2924/00
摘要： An electronic circuit with low inductance connections is disclosed. The electronic circuit includes a ground plane and a flex circuit. The flex circuit having a first surface generally facing the ground plane and a second surface opposite to the first surface. The flex circuit also having a flexible bridge defined thereof. The electronic circuit further includes a first electronic device communicatively coupled to the second surface of the flex circuit, a second electronic device communicatively coupled to the second surface of the flex circuit, and at least one conductive trace defined on the second surface of the flex circuit and extending along the flexible bridge. One end of the at least one conductive trace is configured for receiving an outbound current from the first electronic device and another end of the at least one conductive trace is communicatively coupled to the second electronic device through a vertical interconnect access.
摘要翻译：公开了一种具有低电感连接的电子电路。电子电路包括接地平面和柔性电路。该柔性电路具有大致面对地平面的第一表面和与第一表面相对的第二表面。柔性电路也具有由其限定的柔性桥。电子电路还包括通信地耦合到柔性电路的第二表面的第一电子设备，通信地耦合到柔性电路的第二表面的第二电子设备以及限定在柔性电路的第二表面上的至少一个导电迹线并沿着柔性桥延伸。所述至少一个导电迹线的一端被配置用于从所述第一电子设备接收出站电流，并且所述至少一个导电迹线的另一端通过垂直互连接入通信地耦合到所述第二电子设备。

2. 发明公开

EP2750288A1 Hybrid digital/analog power amplifier 审中-公开
标题翻译： Hybride Digital / Analog-Leistungsverstärker
公开(公告)号：EP2750288A1
公开(公告)日：2014-07-02
申请号：EP13199769.4
申请日：2013-12-30
申请人： LSI Corporation
发明人： Wilson, Ross S. , Abdelli, Said E. , Kiss, Peter , Azadet, Kameran , Laturell, Donald R. , Macdonald, James F.
IPC分类号： H03F3/189 , H03F3/217
CPC分类号： H03F3/38 , H03F3/189 , H03F3/217
摘要： The invention may be embodied in radio frequency power amplifier (RF-PA) predriver circuits employing a hybrid analog/digital RF architecture including a resynchronizing digital-to-analog convertor to drive an efficient high-power output stage suitable for driving standard high power amplifier (HPA) output devices. The hybrid analog/digital RF architecture retains the advantages of high digital content integration found in conventional Class-S architecture, while relaxing the performance requirements on the output transistors and on the bitstream generator. The resulting predriver circuit combines the VLSI integration benefits of digital designs with the extensibility to arbitrary output power levels characteristic of analog designs. The hybrid analog/digital driving circuit is well suited for use with analog and Class-S HPAs used in wireless communication systems, such as the Doherty type HPA.
摘要翻译：本发明可以体现在使用包括再同步数模转换器的混合模拟/数字RF架构的射频功率放大器（RF-PA）预驱动电路中，以驱动适于驱动标准高功率放大器的高效大功率输出级（HPA）输出设备。混合模拟/数字RF架构保留了在传统S类架构中发现的高数字内容集成的优点，同时放松了对输出晶体管和比特流发生器的性能要求。所得到的预驱动电路将数字设计的VLSI集成优势与模拟设计特有的任意输出功率电平的可扩展性相结合。混合模拟/数字驱动电路非常适用于无线通信系统中使用的模拟和Class-S HPA，例如Doherty型HPA。

3. 发明公开

EP2725611A2 Low inductance flex bond with low thermal resistance 审中-公开
标题翻译： Flexible Bindung mit niedrigerInduktivitätund niedrigem thermischem Widerstand
公开(公告)号：EP2725611A2
公开(公告)日：2014-04-30
申请号：EP13186185.8
申请日：2013-09-26
申请人： LSI Corporation
发明人： Laturell, Donald R. , Abdelli, Said E. , Kiss, Peter , MacDonald, James F. , Wilson, Ross S.
IPC分类号： H01L23/498
CPC分类号： H05K1/0216 , H01L23/4985 , H01L23/5387 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2924/30107 , H01L2924/3011 , H05K1/028 , H05K3/306 , H05K3/4691 , H05K2201/042 , Y10T29/4913 , H01L2924/00
摘要： An electronic circuit with low inductance connections is disclosed. The electronic circuit includes a ground plane and a flex circuit. The flex circuit having a first surface generally facing the ground plane and a second surface opposite to the first surface. The flex circuit also having a flexible bridge defined thereof. The electronic circuit further includes a first electronic device communicatively coupled to the second surface of the flex circuit, a second electronic device communicatively coupled to the second surface of the flex circuit, and at least one conductive trace defined on the second surface of the flex circuit and extending along the flexible bridge. One end of the at least one conductive trace is configured for receiving an outbound current from the first electronic device and another end of the at least one conductive trace is communicatively coupled to the second electronic device through a vertical interconnect access.
摘要翻译：公开了一种具有低电感连接的电子电路。电子电路包括接地平面和柔性电路。柔性电路具有大致面向接地平面的第一表面和与第一表面相对的第二表面。柔性电路还具有由其限定的柔性桥。电子电路还包括通信地耦合到柔性电路的第二表面的第一电子设备，通信地耦合到柔性电路的第二表面的第二电子设备，以及限定在柔性电路的第二表面上的至少一个导电迹线并沿着柔性桥延伸。所述至少一个导电迹线的一端被配置为从第一电子器件接收出站电流，并且至少一个导电迹线的另一端通过垂直互连接入通信地耦合到第二电子器件。

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