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1. 发明公开

EP2911189A1 Sheet to form a protective film for chips and process for producing semiconductor chips 审中-公开
标题翻译：膜形成用于芯片的保护膜，及其制造方法半导体芯片
公开(公告)号：EP2911189A1
公开(公告)日：2015-08-26
申请号：EP15159887.7
申请日：2002-03-21
申请人： Lintec Corporation
发明人： Senoo, Hideo , Sugino, Takashi , Yamazaki, Osamu
IPC分类号： H01L21/683 , H01L23/29 , H01L23/31 , H01L23/00 , H01L21/78
CPC分类号： H01L23/3164 , H01L21/6836 , H01L21/78 , H01L23/293 , H01L23/562 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/83855 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/3025 , Y10T428/14 , H01L2924/0635 , H01L2924/00 , H01L2924/3512
摘要： The present invention provides a sheet (10) to form a protective film for chips, which can be readily formed into a highly uniform protective film on a back surface of chip, and which, even if minute scratches are formed on the back surface of chip as a result of mechanical grinding, can eliminate adverse effects resulting from the scratches.
The sheet (10) to form a protective film for chips of the present invention comprises a release sheet (1) and a protective film forming layer (2) formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting or energy ray-curable component and a binder polymer component and is colored.
摘要翻译：本发明提供的片材（10）以形成用于芯片的保护膜，可以容易地形成均匀性高的保护膜上芯片的背面上，并且其中，即使微小划痕芯片的背表面上形成作为机械研磨的结果是，可以消除不良影响的碰伤所得。片材（10），以形成用于本发明的芯片的保护膜包括剥离片（1）和保护膜形成层（2）形成在所述剥离片的可拆卸的表面，worin所述保护膜形成层含有热固性或能量射线固化性成分和一种粘合剂聚合物组分和着色。

2. 发明公开

EP1852906A3 Sheet to form a protective film for chips and process for producing semiconductor chips 有权
标题翻译： Folie zur Herstellung eines SchutzfilmsfürChips und HerstellungsverfahrenfürHalbleiterchips
公开(公告)号：EP1852906A3
公开(公告)日：2009-04-01
申请号：EP07016260.7
申请日：2002-03-21
申请人： Lintec Corporation
发明人： Senoo, Hideo , Sugino, Takashi , Yamazaki, Osamu
IPC分类号： H01L21/68
CPC分类号： H01L23/3164 , H01L21/6836 , H01L21/78 , H01L23/293 , H01L23/562 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/83855 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/3025 , Y10T428/14 , H01L2924/0635 , H01L2924/00 , H01L2924/3512
摘要： The present invention provides a sheet (10) to form a protective film for chips, which can be readily formed into a highly uniform protective film on a back surface of chip, and which, even if minute scratches are formed on the back surface of chip as a result of mechanical grinding, can eliminate adverse effects resulting from the scratches.
The sheet (10) to form a protective film for chips of the present invention comprises a release sheet (1) and a protective film forming layer (2) formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting or energy ray-curable component and a binder polymer component.
摘要翻译：本发明提供一种片材（10），用于形成用于芯片的保护膜，其可以容易地在芯片的背面形成为高度均匀的保护膜，并且即使在芯片的背面上形成微小的划痕作为机械磨削的结果，可以消除由划痕引起的不利影响。形成本发明的片状保护膜的片材（10）包括形成在剥离片的可分离表面上的剥离片（1）和保护膜形成层（2），其中所述保护膜形成层包括热固性或能量射线固化组分和粘合剂聚合物组分。

3. 发明公开

EP1107299A3 Process for producing semiconductor devices 有权
标题翻译：一种制备Hableitervorrichtungen过程
公开(公告)号：EP1107299A3
公开(公告)日：2004-06-16
申请号：EP00310466.8
申请日：2000-11-24
申请人： LINTEC Corporation
发明人： Sugino, Takashi , Senoo, Hideo
IPC分类号： H01L21/301
CPC分类号： H01L21/6836 , H01L21/3043 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/743 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10158 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/00 , H01L2924/3512
摘要： A process for producing a semiconductor device, comprising the steps of providing a wafer of given thickness having a surface furnished with semiconductor circuits and a back; forming grooves of a cut depth smaller than the thickness of the wafer, said grooves extending from the wafer circuit surface; sticking a surface protective sheet onto the wafer circuit surface; grinding the back of the wafer so that the thickness of the wafer is reduced to thereby finally result in division of the wafer into individual chips with spaces therebetween; sticking a dicing/die bond sheet onto the ground back of the wafer, said dicing/die bond sheet comprising a base and, superimposed thereon, an adhesive layer, said adhering performed so that the adhesive layer is brought into contact with the ground back of the wafer; peeling the surface protective sheet from the wafer circuit surface to thereby cause the adhesive layer of the dicing/die bond sheet to be exposed through each space between neighboring individual chips; cutting the exposed adhesive layer of the dicing/die bond sheet; detaching the individual chips having the cut adhesive layer adhering thereto from the base of the dicing/die bond sheet; and bonding the individual chips through the adhesive layer to a given substrate. This process is advantageous in that an appropriate amount of adhesive layer can easily be formed on the back of extremely thin chips to thereby enable avoiding chip breakage, chip cracking or package cracking, so that a productivity enhancement can be realized.

4. 发明授权

EP0775715B1 Adhesive composition and adhesive sheet 失效
标题翻译：粘合剂组合物和粘合层
公开(公告)号：EP0775715B1
公开(公告)日：2001-02-14
申请号：EP96308445.4
申请日：1996-11-21
申请人： LINTEC Corporation
发明人： Senoo, Hideo , Sugino, Takashi , Murai, Shinji, Creare Toshiba Motoyawata 310 , Nakano, Yoshihiko , Hayase, Shuji
IPC分类号： C08G59/68 , C09J163/00
CPC分类号： C08G59/68 , C09J163/00

5. 发明公开

EP0979852A3 A dicing tape and a method of dicing a semiconductor wafer 有权
标题翻译：切割胶带和Verfahren zum Zerteilen einer Halbleiterscheibe
公开(公告)号：EP0979852A3
公开(公告)日：2000-04-19
申请号：EP99115442.8
申请日：1999-08-05
申请人： LINTEC Corporation
发明人： Senoo, Hideo , Kondo, Takeshi
IPC分类号： C09J7/02 , B28D5/00 , H01L21/68
CPC分类号： H01L21/6836 , B28D5/0082 , C09J7/29 , C09J2201/122 , C09J2201/162 , C09J2201/606 , C09J2203/326 , C09J2423/006 , C09J2433/00 , H01L2221/68327 , Y10T156/1026 , Y10T156/1052 , Y10T156/1064 , Y10T156/1082 , Y10T428/28 , Y10T428/2848
摘要： A dicing tape comprising a substrate sheet and a pressure-sensitive adhesive layer formed on one surface of the substrate sheet, wherein the substrate sheet comprises an upper layer in direct contact with the pressure-sensitive adhesive layer, an intermediate layer adjacent to the upper layer, and a lower layer adjacent to the intermediate layer, and an anti-extensibility (A) of the upper layer, an anti-extensibility (B) of the intermediate layer, and an anti-extensibility (C) of the lower layer satisfy the equation (I):B
摘要翻译：一种切片带，其包括基材片和形成在所述基片的一个表面上的压敏粘合剂层，其中所述基片包括与所述压敏粘合剂层直接接触的上层，与所述上层相邻的中间层和与中间层相邻的下层，上层的抗延伸性（A），中间层的抗延展性（B）和下层的抗延伸性（C）满足公式（I）：公开了作为弹性模量和层厚度的乘积的抗延展性。本切割带可以均匀且充分地放大切割线，而不受压敏粘合剂的弹性模量的影响，并且在切割线处很少破裂。

6. 发明公开

EP1261031A3 Tape for forming resin tie bar on a lead frame 审中-公开
标题翻译： Trägerbandfüreine Verwendung alsHarzträgerstegeines Leiterrahmens
公开(公告)号：EP1261031A3
公开(公告)日：2004-06-02
申请号：EP02253429.1
申请日：2002-05-16
申请人： Lintec Corporation
发明人： Yamazaki, Osamu , Senoo, Hideo , Ebe, Kazuyoshi
IPC分类号： H01L23/488 , H01L21/56
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T428/28 , Y10T428/2813 , Y10T428/2826 , Y10T428/287 , Y10T428/2891 , Y10T428/31721 , Y10T428/31786 , H01L2924/00
摘要： When a resin tie bar 1A comprising a base material 11 composed of a heat-resistant resin whose melting point is higher than the temperature during resin molding, and an insulative adhesive layer 12 formed on the base material 11 and composed of an insulative adhesive agent, is applied to the surface of the leads 22 of a lead frame, and molding resin is then performed, the resin tie bar 1A is pressed by a heated mold 3, which softens the insulative adhesive agent of the resin tie bar 1A and pushes it into the gaps 23 between the leads 22 of the lead frame. Thus the resin tie bar 1A can be easily formed into a shape that is favorable for the leads 22 of the lead frame.
摘要翻译：当包含熔点高于树脂成型时的耐热树脂的基材11和由基材11形成并由绝缘粘合剂构成的绝缘粘合剂层12的树脂连接杆1A时，施加到引线框架的引线22的表面，然后进行模塑树脂，树脂连接杆1A被加热的模具3挤压，该加热模具3软化树脂连接杆1A的绝缘粘合剂并将其推入引线框架的引线22之间的间隙23。因此，树脂连接杆1A可以容易地形成为有利于引线框架的引线22的形状。

7. 发明授权

EP0979852B1 A dicing tape and a method of dicing a semiconductor wafer 有权
标题翻译：切割胶带和切割半导体晶片的方法
公开(公告)号：EP0979852B1
公开(公告)日：2004-01-28
申请号：EP99115442.8
申请日：1999-08-05
申请人： LINTEC Corporation
发明人： Senoo, Hideo , Kondo, Takeshi
IPC分类号： C09J7/02 , B28D5/00 , H01L21/68
CPC分类号： H01L21/6836 , B28D5/0082 , C09J7/29 , C09J2201/122 , C09J2201/162 , C09J2201/606 , C09J2203/326 , C09J2423/006 , C09J2433/00 , H01L2221/68327 , Y10T156/1026 , Y10T156/1052 , Y10T156/1064 , Y10T156/1082 , Y10T428/28 , Y10T428/2848
摘要： A dicing tape comprising a substrate sheet and a pressure-sensitive adhesive layer formed on one surface of the substrate sheet, wherein the substrate sheet comprises an upper layer in direct contact with the pressure-sensitive adhesive layer, an intermediate layer adjacent to the upper layer, and a lower layer adjacent to the intermediate layer, and an anti-extensibility (A) of the upper layer, an anti-extensibility (B) of the intermediate layer, and an anti-extensibility (C) of the lower layer satisfy the equation (I): the anti-extensibility being a product of a modulus of elasticity and a layer thickness, is disclosed. The present dicing tape can uniformly and sufficiently enlarge dicing lines without affect by a modulus of elasticity of a pressure-sensitive adhesive, and is rarely broken at the dicing lines.

8. 发明公开

EP1261031A2 Tape for forming resin tie bar on a lead frame 审中-公开
标题翻译：载带用作引线框架的树脂支撑肋
公开(公告)号：EP1261031A2
公开(公告)日：2002-11-27
申请号：EP02253429.1
申请日：2002-05-16
申请人： Lintec Corporation
发明人： Yamazaki, Osamu , Senoo, Hideo , Ebe, Kazuyoshi
IPC分类号： H01L23/495
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T428/28 , Y10T428/2813 , Y10T428/2826 , Y10T428/287 , Y10T428/2891 , Y10T428/31721 , Y10T428/31786 , H01L2924/00
摘要： When a resin tie bar 1A comprising a base material 11 composed of a heat-resistant resin whose melting point is higher than the temperature during resin molding, and an insulative adhesive layer 12 formed on the base material 11 and composed of an insulative adhesive agent, is applied to the surface of the leads 22 of a lead frame, and molding resin is then performed, the resin tie bar 1A is pressed by a heated mold 3, which softens the insulative adhesive agent of the resin tie bar 1A and pushes it into the gaps 23 between the leads 22 of the lead frame. Thus the resin tie bar 1A can be easily formed into a shape that is favorable for the leads 22 of the lead frame.

9. 发明公开

EP1107299A2 Process for producing semiconductor devices 有权
标题翻译： Verfahren zur Herstellung von Hableitervorrichtungen
公开(公告)号：EP1107299A2
公开(公告)日：2001-06-13
申请号：EP00310466.8
申请日：2000-11-24
申请人： LINTEC Corporation
发明人： Sugino, Takashi , Senoo, Hideo
IPC分类号： H01L21/301
CPC分类号： H01L21/6836 , H01L21/3043 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/743 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10158 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/00 , H01L2924/3512
摘要： A process for producing a semiconductor device, comprising the steps of providing a wafer of given thickness having a surface furnished with semiconductor circuits and a back; forming grooves of a cut depth smaller than the thickness of the wafer, said grooves extending from the wafer circuit surface; sticking a surface protective sheet onto the wafer circuit surface; grinding the back of the wafer so that the thickness of the wafer is reduced to thereby finally result in division of the wafer into individual chips with spaces therebetween; sticking a dicing/die bond sheet onto the ground back of the wafer, said dicing/die bond sheet comprising a base and, superimposed thereon, an adhesive layer, said adhering performed so that the adhesive layer is brought into contact with the ground back of the wafer; peeling the surface protective sheet from the wafer circuit surface to thereby cause the adhesive layer of the dicing/die bond sheet to be exposed through each space between neighboring individual chips; cutting the exposed adhesive layer of the dicing/die bond sheet; detaching the individual chips having the cut adhesive layer adhering thereto from the base of the dicing/die bond sheet; and bonding the individual chips through the adhesive layer to a given substrate. This process is advantageous in that an appropriate amount of adhesive layer can easily be formed on the back of extremely thin chips to thereby enable avoiding chip breakage, chip cracking or package cracking, so that a productivity enhancement can be realized.
摘要翻译：一种制造半导体器件的方法，包括以下步骤：提供具有带有半导体电路和背面的表面的给定厚度的晶片; 形成切割深度小于晶片厚度的凹槽，所述凹槽从晶片电路表面延伸; 将表面保护片粘在晶片电路表面上; 研磨晶片的背面，使得晶片的厚度减小，从而最终导致晶片分离成具有间隙的各个芯片; 将切割/管芯接合片粘贴到晶片的背面，所述切割/管芯接合片包括基底并且叠加在其上的粘合剂层，所述粘附进行，使得粘合剂层与接地背面接触晶圆; 从晶片电路表面剥离表面保护片，从而使切割/管芯接合片的粘合剂层通过相邻的各个芯片之间的每个空间露出; 切割切割/模具接合片的暴露的粘合剂层; 从切割/模具接合片的基底分离附着有切割粘合剂层的各个芯片; 并将各个芯片通过粘合剂层粘合到给定的基底上。该方法的优点在于，可以容易地在极薄的芯片的背面形成适当量的粘合剂层，从而能够避免切屑断裂，切屑破裂或包装开裂，从而可以实现生产率提高。

10. 发明授权

EP0622833B1 Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same 失效
标题翻译：对于晶片和与制造半导体器件的方法粘合剂载体，所述载体
公开(公告)号：EP0622833B1
公开(公告)日：1999-03-31
申请号：EP94106663.1
申请日：1994-04-28
申请人： TEXAS INSTRUMENTS INCORPORATED , LINTEC Corporation
发明人： Amagai, Masazumi , Ebe, Kazuyoshi , Senoo, Hideo
IPC分类号： H01L21/302 , H01L21/68
CPC分类号： H01L23/4951 , C08F220/12 , C09J7/22 , C09J7/38 , C09J133/064 , H01L21/6835 , H01L21/6836 , H01L23/293 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2221/68322 , H01L2221/68327 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01057 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/10329 , H01L2924/12044 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： Disclosed is an adhesive sheet for wafer comprising a substrate film (2) and a radiation curable adhesive layer (3) formed thereon, said adhesive sheet being used in a process for preparing a semiconductor device comprising the steps of adhering a back surface of a wafer (A), a front surface of which has been formed a circuit, onto the radiation curable adhesive layer, dicing the wafer into chips (A1,A2,...), rinsing, drying, irradiating the adhesive layer with radiation (B) to cure said adhesive layer, expanding the adhesive sheet if necessary to make the chips apart from each other, then picking up the chips, mounting the picked chips on a lead frame, bonding, and molding to give such a structure that the back surfaces of the chips are partially or wholly in contact with a package molding resin, wherein the radiation curable adhesive layer comprises 100 parts by weight of an acrylic adhesive composed of a copolymer of an acrylic ester and an OH group-containing polymerizable monomer and 50 - 200 parts by weight of a radiation polymerizable compound having two or more unsaturated bonds, and the radiation curable adhesive layer has an elastic modulus of not less than 1 x 10 dyn/cm after curing by irradiation with radiation.

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