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1. 发明授权

EP2736086B1 Light emitting device package 有权
公开(公告)号：EP2736086B1
公开(公告)日：2019-05-29
申请号：EP13176342.7
申请日：2013-07-12
申请人： LG Electronics Inc.
发明人： Park Daehyun , Hong, Gunyong , Yoo, Younggil , Kang, Dongwon
IPC分类号： H01L33/50

2. 发明公开

EP2743999A2 Light emitting device package including phosphor film, method of manufacturing the same, and lighting apparatus using the same 审中-公开
标题翻译： Lichtemittierendes Vorrichtungspaket mit lumineszentem Film，Herstellungsverfahrendafür和und Beleuchtungsvorrichtung damit
公开(公告)号：EP2743999A2
公开(公告)日：2014-06-18
申请号：EP13176341.9
申请日：2013-07-12
申请人： LG Electronics, Inc.
发明人： Park, Daehyun , Hong, Gunyong , Kim, Jeseok , Kang, Dongwon
IPC分类号： H01L33/50
CPC分类号： H05B33/145 , H01L33/501 , H01L33/507 , H01L33/508 , H05B33/10
摘要： A light emitting device package, and more particularly, a light emitting device package including a phosphor film, a method of manufacturing the same, and a lighting apparatus using the same are disclosed. The method of manufacturing a light emitting device package including a phosphor film, includes attaching a phosphor film green sheet on a first surface of a support substrate, attaching a glass film green sheet on the phosphor film green sheet, patterning the glass film green sheet by mold pressing, and sintering the phosphor film green sheet and the patterned glass film green sheet.
摘要翻译：更具体地，公开了一种发光器件封装，更具体地，涉及包括磷光体膜的发光器件封装，其制造方法和使用该发光器件封装的照明装置。制造包括荧光体膜的发光器件封装的方法包括将荧光膜生片附着在支撑衬底的第一表面上，将玻璃膜生片附着在荧光膜生片上，将玻璃膜生片图案化模压，烧结荧光膜生片和图案化玻璃膜生片。

3. 发明公开

EP2743999A3 Light emitting device package including phosphor film, method of manufacturing the same, and lighting apparatus using the same 审中-公开
标题翻译：该发光器件封装的发光膜，其制造方法，以及照明装置从而
公开(公告)号：EP2743999A3
公开(公告)日：2016-11-09
申请号：EP13176341.9
申请日：2013-07-12
申请人： LG Electronics, Inc.
发明人： Park, Daehyun , Hong, Gunyong , Kim, Jeseok , Kang, Dongwon
IPC分类号： H01L33/50
CPC分类号： H05B33/145 , H01L33/501 , H01L33/507 , H01L33/508 , H05B33/10
摘要： A light emitting device package, and more particularly, a light emitting device package including a phosphor film, a method of manufacturing the same, and a lighting apparatus using the same are disclosed. The method of manufacturing a light emitting device package including a phosphor film, includes attaching a phosphor film green sheet on a first surface of a support substrate, attaching a glass film green sheet on the phosphor film green sheet, patterning the glass film green sheet by mold pressing, and sintering the phosphor film green sheet and the patterned glass film green sheet.

4. 发明公开

EP2736086A3 Light emitting device package 审中-公开
标题翻译：一种发光器件封装
公开(公告)号：EP2736086A3
公开(公告)日：2016-11-09
申请号：EP13176342.7
申请日：2013-07-12
申请人： LG Electronics, Inc.
发明人： Park Daehyun , Hong, Gunyong , Yoo, Younggil , Kang, Dongwon
IPC分类号： H01L33/50
CPC分类号： H01L33/504 , H01L33/507 , H01L33/508
摘要： A semiconductor device, and more particularly a light emitting device package usable with a lighting apparatus is disclosed. The light emitting device package comprises a package body, a light emitting device located on the package body, the light emitting device emitting light having a first wavelength band, a transparent substrate located over the light emitting device with a distance therebetween, a wavelength conversion layer located on the transparent substrate, wherein the wavelength conversion layer absorbs and converts at least a part of the light having the first wavelength band into light having a second wavelength band, and a color calibration layer located on the wavelength conversion layer, the color calibration layer calibrating color of the wavelength conversion layer.

5. 发明公开

EP2949727A1 YELLOW LIGHT EMITTING PHOSPHOR AND LIGHT EMITTING DEVICE PACKAGE USING THE SAME 有权
标题翻译： GELBES LICHT EMITTIERENDER LEUCHTSTOFF UND LICHTEMITTIERENDE VORRICHTUNG DAMIT
公开(公告)号：EP2949727A1
公开(公告)日：2015-12-02
申请号：EP15001081.7
申请日：2015-04-15
申请人： LG Electronics Inc.
发明人： Yoo, Younggil , Kang, Dongwon , Hong, Gunyoung , Kim, Minsung
IPC分类号： C09K11/77 , H01L33/50
CPC分类号： C09K11/7774 , C09K11/646 , C09K11/7734 , H01L33/504 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49107 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Disclosed are phosphors and, more particularly, yellow light emitting phosphors and light emitting device packages using the same. The yellow light emitting phosphor includes a first phosphor including at least one of Lu 3 Al 5 O 12 :Ce, SrSi 2 O 2 N 2 , and β-type SiAlON and a second phosphor mixed with the first phosphor to form a mixture, the second phosphor including α-type SiAlON(Li-α-SiAlON) containing Li as a metal component, wherein the second phosphor emits light having a central wavelength in a range of 550 nm to 590 nm by being excited by near ultraviolet (UV) or blue light, The mixture of the first phosphor and the second phosphor is excited by the near UV or blue light to emit yellow light.
摘要翻译：公开了荧光体，更具体地，公开了使用其的黄色发光荧光体和发光器件封装。黄色发光荧光体包括：包含Lu 3 Al 5 O 12：Ce，SrSi 2 O 2 N 2和2型SiAlON中的至少一种的第一荧光体和与第一荧光体混合形成混合物的第二荧光体，第二荧光体，其包含含有Li作为金属成分的±型SiAlON（Li-±-SiAlON），其中，所述第二荧光体通过被近紫外（UV）激发而发射中心波长在550nm〜590nm范围内的光蓝光，第一荧光体和第二荧光体的混合物被近紫外或蓝光激发，发出黄光。

6. 发明公开

EP2736086A2 Light emitting device package 审中-公开
标题翻译： Lichtemittierende Vorrichtungsverpackung
公开(公告)号：EP2736086A2
公开(公告)日：2014-05-28
申请号：EP13176342.7
申请日：2013-07-12
申请人： LG Electronics, Inc.
发明人： Park Daehyun , Hong, Gunyong , Yoo, Younggil , Kang, Dongwon
IPC分类号： H01L33/50
CPC分类号： H01L33/504 , H01L33/507 , H01L33/508
摘要： A semiconductor device, and more particularly a light emitting device package usable with a lighting apparatus is disclosed. The light emitting device package comprises a package body, a light emitting device located on the package body, the light emitting device emitting light having a first wavelength band, a transparent substrate located over the light emitting device with a distance therebetween, a wavelength conversion layer located on the transparent substrate, wherein the wavelength conversion layer absorbs and converts at least a part of the light having the first wavelength band into light having a second wavelength band, and a color calibration layer located on the wavelength conversion layer, the color calibration layer calibrating color of the wavelength conversion layer.
摘要翻译：公开了一种半导体器件，更具体地，涉及可用于照明设备的发光器件封装。发光器件封装包括封装体，位于封装主体上的发光器件，发射具有第一波长带的光的发光器件，位于发光器件上方的距离在其间的距离的透明衬底，波长转换层位于所述透明基板上，其中所述波长转换层吸收并将具有所述第一波长带的光的至少一部分转换成具有第二波长带的光，以及位于所述波长转换层上的颜色校准层，所述颜色校准层校准波长转换层的颜色。

7. 发明授权

EP2743999B1 Light emitting device package including phosphor film, and method of manufacturing the same. 有权
公开(公告)号：EP2743999B1
公开(公告)日：2019-09-04
申请号：EP13176341.9
申请日：2013-07-12
申请人： LG Electronics, Inc.
发明人： Park, Daehyun , Hong, Gunyong , Kim, Jeseok , Kang, Dongwon
IPC分类号： H01L33/50

8. 发明授权

EP2949727B1 YELLOW LIGHT EMITTING PHOSPHOR AND LIGHT EMITTING DEVICE PACKAGE USING THE SAME 有权
标题翻译：黄色发光磷光体和使用该发光装置的包装
公开(公告)号：EP2949727B1
公开(公告)日：2017-09-06
申请号：EP15001081.7
申请日：2015-04-15
申请人： LG Electronics Inc.
发明人： Yoo, Younggil , Kang, Dongwon , Hong, Gunyoung , Kim, Minsung
IPC分类号： C09K11/77 , H01L33/50 , C09K11/64
CPC分类号： C09K11/7774 , C09K11/646 , C09K11/7734 , H01L33/504 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49107 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00

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