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    • 8. 发明公开
    • EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, COMPOSITION AND HARDENED MATERIAL COMPRISING SAME, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP
    • 具有烷氧基硅烷基团,组合物和硬化的材料,它们的用途以及一种用于制造环氧化合物的方法,具有烷氧基硅烷的环氧化合物
    • EP2835373A1
    • 2015-02-11
    • EP13772355.7
    • 2013-04-02
    • Korea Institute of Industrial Technology
    • CHUN, Hyun-AeePARK, Su-JinTAK, Sang-YongKIM, Yun-JuPARK, Sook-YeonPARK, Sung-Hwan
    • C07F7/18C07D407/12C08G59/22
    • C08G59/306C07D303/26C07D303/28C07F7/1804C08G59/22C08G59/3281C08G59/38C08K7/14
    • The present invention relates to: an alkoxysilyl-based epoxy compound which does not require a separate silane coupling agent and exhibits outstanding heat resistance, and more specifically a low coefficient of thermal expansion (CTE) and a high glass transition temperature in a synergistic effect in a composite material; a composition and a cured article comprising same; a use for same; and a production method for an epoxy compound having an alkoxysilyl group. Accordingly, the present invention provides: an epoxy compound having an epoxy group and an alkoxysilyl group; and a composition comprising the epoxy compound together with a curing agent, a filler and/or a reaction catalyst or the like, and various uses for same including in a cured article and electronic components. According to the present invention, the novel epoxy composition comprising the epoxy compound having the alkoxysilyl group exhibits improved heat resistance, which is to say an effect whereby the CTE of the epoxy composite is reduced and whereby the glass transition temperature is elevated or a glass transition temperature is not exhibited (referred to hereinbelow as "Tg less"), because of chemical bond formation due to a chemical reaction of the alkoxysilyl group and the filler (fibres and/or particles) and a chemical reaction between alkoxysilyl groups, in the composite material and/or the cured article. Moreover, the cured article comprising the epoxy compound having the alkoxysilyl group according to the present invention exhibits outstanding flame retardancy due to the inclusion of the alkoxysilyl group.
    • 本发明涉及:一种不需要单独的硅烷偶联剂和具有杰出的耐热性和热膨胀的更具体的低系数(CTE),并在有协同作用高玻璃化转变温度基于烷氧基甲硅烷的环氧化合物 的复合材料; 的组合物和固化的制品,其包括相同; 对于相同的一个用途; 和具有烷氧基硅烷基在环氧化合物的制造方法。 因此,本发明提供:环氧化合物的具有环氧基和烷氧基甲硅烷在基; 并用固化剂,填料和/或反应的催化剂或固化物和电子部件为相同的包括等,以及各种用途一起包含该环氧化合物的组合物。 。根据本发明,该新型环氧树脂组合物,其包含具有烷氧基甲硅烷基的环氧化合物显示出改进的耐热性,所有这一切是在效果上说,由此环氧复合材料的CTE降低,因此玻璃化转变温度升高或玻璃化转变 温度不能发挥(由以下称为“Tg的少”)因为化学键形成的,由于烷氧基硅烷基的化学反应和填料(纤维和/或颗粒)和在复合烷氧基硅烷基之间的化学反应 材料和/或固化的制品。 更上方,固化制品,包括具有烷氧基甲硅烷基雅鼎在本发明的环氧化合物具有杰出的阻燃性归因于包含烷氧基甲硅烷基。
    • 9. 发明公开
    • ISOCYANURATE EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING SAME, COMPOSITION INCLUDING SAME, CURED PRODUCT OF THE COMPOSITION, AND USE OF THE COMPOSITION
    • 具有异氰脲酸酯的环氧化合物的烷氧基甲硅烷基,用于生产,组合物,其固化物从组合物和使用该组合物的
    • EP2774929A1
    • 2014-09-10
    • EP12844747.1
    • 2012-11-01
    • Korea Institute Of Industrial Technology
    • CHUN, Hyun-AeeTAK, Sang-YongPARK, Su-JinKIM, Yun-JuPARK, Sung-HwanPARK, Sook-Yeon
    • C07F7/08C07D405/14C07D251/32
    • C08G59/306B32B15/092C07D251/32C07D405/14C07F7/0812C07F7/10C07F7/1836C08K3/36C08K7/14C08L63/00Y10T428/31529
    • The present invention relates to an alkoxysilyl-based isocyanurate epoxy compound, a method of preparing same, a composition including same, a cured product of the composition and a use of the composition. A complex including the compound illustrates good heat resistance, particularly, a low coefficient of thermal expansion (CTE), and a high glass transition temperature or Tg. A cured product of the composition illustrates flame retardancy and does not use a separate silane coupling agent. According to the present invention, an isocyanurate epoxy compound including an alkoxysilyl group and an epoxy group at a core; a method of preparing the epoxy compound prepared by epoxidation and alkoxysilylation of a starting material; an epoxy composition including the epoxy compound; and a cured product of the epoxy composition and a use of the epoxy composition, are provided. In the complex of the composition including the novel alkoxysilyl-based isocyanurate epoxy compound according to the present invention, chemical bonding efficiency may be improved when making a chemical bond between the alkoxysilyl group in the epoxy compound and a filler and when forming an epoxy complex through a chemical bond between alkoxysilyl groups in the epoxy compound having the alkoxysilyl group. Therefore, good heat resistance, that is, a low CTE and a high glass transition temperature or Tg may be shown. In addition, the cured product of the composition including the epoxy compound according to the present invention may show good flame retardancy.
    • 本发明在烷氧基甲硅烷基异氰脲酸酯的环氧化合物涉及,制备相同的方法,组合物包括相同的,该组合物的固化产物和使用该组合物的。 一个复杂的包括化合物说明了良好的耐热性,特别是热膨胀系数低(CTE),和高的玻璃化转变温度或Tg的。该组合物的固化物说明了阻燃性,并且不使用单独的硅烷偶联剂。 。根据本发明,在异氰脲酸酯的环氧化合物包括在烷氧基硅烷基,并且在芯环氧基; 制备由环氧化和起始材料的制备alkoxysilylation环氧化合物的方法; 到环氧组合物包括环氧化合物; 和环氧组合物和使用的环氧组合物的固化物中,提供了。 在该组合物包括新的基于烷氧基甲硅烷异氰脲酸酯的环氧化合物雅丁到本发明的复合物,化学粘合效率可以提高在使烷氧基甲硅烷基团之间的环氧化合物和化学键的填料,并通过上形成环氧树脂复合时 在具有烷氧基甲硅烷基的环氧化合物烷氧基硅烷基之间的化学键。 因此,良好的耐热性,也就是,低CTE和高玻璃化转变温度Tg的或可以被示出。 此外,该组合物包括环氧化合物gemäß到本发明的固化物可表现出良好的阻燃性。