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1. 发明公开

EP3742558A1 CONTACT 审中-实审
公开(公告)号：EP3742558A1
公开(公告)日：2020-11-25
申请号：EP19741959.1
申请日：2019-01-11
申请人： Kitagawa Industries Co., Ltd.
发明人： NAKAMURA, Tatsuya , ISHIGURO, Hiroyoshi
IPC分类号： H01R12/57 , H01R13/24
摘要： The present invention provides a contact with low impedance even in a high frequency band. The contact (1) includes a base part (3), a contact part (5), and a spring part (7). The spring part (7) is elastically deformed to bias the contact part (5) in the x-axis positive direction and the z-axis positive direction. The contact part (5) includes a sliding part (23A) oriented in the x-axis positive direction. The base part (3) includes a part to be slided (14) oriented in the x-axis negative direction. The contact part (5) is biased in the x-axis positive direction by the spring part (7), so that the sliding part (23A) is in pressure contact with the part to be slided (14). The contact part (5) is configured to be slidable in the z-axis direction relative to the base part (3) while maintaining a state in which the sliding part (23A) is in pressure contact with the part to be slided (14).

2. 发明公开

EP2352207A1 CONNECTING ELEMENT 有权转让
标题翻译： VERBINDUNGSELEMENT
公开(公告)号：EP2352207A1
公开(公告)日：2011-08-03
申请号：EP10830050.0
申请日：2010-11-16
申请人： Kitagawa Industries Co., Ltd.
发明人： KURITA, Tomohisa , YUMI, Hideo , NAKAMURA, Tatsuya , KONDA, Kenji , KITANO, Hiroki
IPC分类号： H01R12/51 , H01R12/52 , H01R12/55
CPC分类号： H01R12/57 , H01R13/2442 , H01R13/245 , H01R43/205 , H05K1/0215 , H05K9/0016 , H05K2201/10189 , H05K2201/10265 , H05K2201/1031 , H05K2203/0195 , Y02P70/611
摘要： A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.
摘要翻译：触点包括焊接部分，弹性接触部分和抽吸部分。焊接接合部的下表面是要焊接到导体图案的焊料接合面。弹性接触部分连接到焊料接合部分的一端并在焊接部分上弯曲。当与导电构件接触时，弹性接触部分被弹性变形地压在导电构件上。吸引部分独立于弹性接触部分连接到焊接接合部分。吸引部分为自动安装机的吸嘴的吸附面，其顶端与弹性接触部的导电部件侧的焊料接合部的下表面平行配置。

3. 发明授权

EP2352207B1 CONNECTING ELEMENT 有权转让
公开(公告)号：EP2352207B1
公开(公告)日：2019-01-02
申请号：EP10830050.0
申请日：2010-11-16
申请人： Kitagawa Industries Co., Ltd.
发明人： KURITA, Tomohisa , YUMI, Hideo , NAKAMURA, Tatsuya , KONDA, Kenji , KITANO, Hiroki
IPC分类号： H01R12/51 , H01R12/52 , H01R12/55

4. 发明公开

EP3018762A1 CONDUCTIVE MEMBER AND ELECTROMAGNETIC SHIELD STRUCTURE 有权
标题翻译： LEITFÄHIGESELEMENT ELEKTROMAGNETISCHE ABSCHIRMSTRUKTUR
公开(公告)号：EP3018762A1
公开(公告)日：2016-05-11
申请号：EP15193104.5
申请日：2015-11-05
申请人： Kitagawa Industries Co., Ltd.
发明人： NAKAMURA, Tatsuya
IPC分类号： H01R12/57 , H01R13/24 , H01R13/6594
摘要： A conductive member (101,1) of this disclosure includes a bent metal thin plate. The metal thin plate includes a base portion (3) having a first surface serving as a joint surface for soldering, a first spring portion (5) connected to part of the base portion (3), and a second spring portion (20) provided above a second surface of the base portion (3) opposite to the first surface. The first spring portion (5) inclines in a direction away from a tangent plane of the first surface such that an angle between the first spring portion (5) and the first surface is an obtuse angle, and generates repulsion force against force toward the tangent plane. The second spring portion (20) generates repulsion force parallel to a direction from the base portion (3) toward the first spring portion (5).
摘要翻译：本公开的导电构件（101,1）包括弯曲的金属薄板。金属薄板包括具有第一表面作为用于焊接的接合表面的基部（3），连接到基部（3）的一部分的第一弹簧部分（5）和设置在基部在基部（3）的与第一表面相对的第二表面之上。第一弹簧部分（5）沿远离第一表面的切线的方向倾斜，使得第一弹簧部分（5）和第一表面之间的角度是钝角，并且产生朝向切线的力的推斥力平面。第二弹簧部（20）产生与从基部（3）朝向第一弹簧部（5）的方向平行的排斥力。

5. 发明公开

EP2919243A1 CAPACITOR HOLDER 审中-公开
标题翻译： KONDENSATORHALTER
公开(公告)号：EP2919243A1
公开(公告)日：2015-09-16
申请号：EP13852402.0
申请日：2013-11-11
申请人： Kitagawa Industries Co., Ltd.
发明人： NAKAMURA, Tatsuya
IPC分类号： H01G2/04 , H01G2/02
CPC分类号： H01G2/106 , H01G2/04 , H01G2/06 , H01G4/38 , H01G9/26 , H01G11/10 , H05K1/184 , H05K2201/10015 , H05K2201/10628
摘要： A capacitor holder includes: a cylindrical portion made of a resin having a cylindrical shape and externally fitted to a capacitor; a pair of protrusions formed integrally with the cylindrical portion, the protrusions protruding in an outward direction of the cylindrical portion from positions opposed to each other with respect to an axis of the cylindrical portion; and a pair of metal pins protruding along the axis from axial end surfaces of the paired protrusions, the metal pins configured to solder the cylindrical portion and the protrusions to a printed circuit board. In the capacitor holder, a distance between the axis and outer circumferences of the protrusions is less than 0.76 times of an inner diameter of the cylindrical portion.
摘要翻译：电容器支架包括：圆柱形部分，其由具有圆柱形状的树脂制成并外部安装到电容器; 与所述圆筒部一体地形成的一对突起，所述突起从所述圆筒部的轴线相对的位置向所述圆筒部的向外方向突出; 以及一对金属销，其沿着轴线从所述成对突起的轴向端面突出，所述金属销被配置为将所述圆柱形部分和所述突起焊接到印刷电路板。在电容器支架中，突起之间的距离和外周之间的距离小于圆柱形部分的内径的0.76倍。

6. 发明授权

EP2919565B1 CAPACITOR HOLDER AND CAPACITOR HOLDING STRUCTURE 有权
公开(公告)号：EP2919565B1
公开(公告)日：2020-02-12
申请号：EP13852709.8
申请日：2013-10-29
申请人： Kitagawa Industries Co., Ltd.
发明人： NAKAMURA, Tatsuya
IPC分类号： H05K3/30 , H01G2/06 , H05K3/34

7. 发明公开

EP3396178A1 CLIP AND FIXING MECHANISM 有权
公开(公告)号：EP3396178A1
公开(公告)日：2018-10-31
申请号：EP16878937.8
申请日：2016-12-22
申请人： Kitagawa Industries Co., Ltd.
发明人： NAKAMURA, Tatsuya
IPC分类号： F16B2/24 , F16B5/06 , H05K1/18 , H05K7/12 , H05K9/00
CPC分类号： F16B2/24 , F16B5/06 , H05K1/18 , H05K7/12 , H05K9/00
摘要： A clip provided with a base portion, at least one holding portion, and a guiding portion. The holding portion includes a pair of spring pieces including a first spring piece and a second spring piece connected to the base portion and facing each other, and sandwiches an insert inserted between these spring pieces. The guiding portion includes a contact surface that guides the insert toward a position between the first spring piece and the second spring piece when the insert moves in an insertion direction and the guide portion comes into contact with the insert. The contact surface is at least partially, in relation to the insertion direction, in a position farther away from the base portion than the second portion of at least one of the first spring piece and the second spring piece. The contact surface is at least partially, in relation to a facing direction, in a position farther away from the corresponding spring piece than the second portion of the one spring piece.

8. 发明公开

EP3879636A1 CONTACT 审中-公开
公开(公告)号：EP3879636A1
公开(公告)日：2021-09-15
申请号：EP19881588.8
申请日：2019-05-20
申请人： Kitagawa Industries Co., Ltd.
发明人： YADA, Tetsuya , NAKAMURA, Tatsuya
IPC分类号： H01R13/24 , H01R12/57
摘要： [Object] To provide a contact that can hold down effects caused by solder, even if an elastic contacting portion is extending from a location contacting a first member.
[Solving means] The contact includes a base portion, an elastic contacting portion and a gap forming portion. The base portion is configured solderable on a component mounting surface of the first member. The elastic contacting portion is configured elastically deformable and relatively swingable with respect to the base portion, and when contacting a contacted surface of the second member, is configured to elastically deform to be in pressurized contact with the contacted surface. In the gap forming portion, a concave portion is provided between a first end portion and a second end portion, and is configured to have a gap between the concave portion and the component mounting surface when the base portion is soldered on the component mounting surface in a state in which the concave portion and the component mounting surface are oriented in directions facing each other.

9. 发明授权

EP2919327B1 CONTACT AND METHOD FOR MOUNTING SUCH CONTACT 有权
公开(公告)号：EP2919327B1
公开(公告)日：2020-07-08
申请号：EP13852428.5
申请日：2013-11-01
申请人： Kitagawa Industries Co., Ltd.
发明人： NAKAMURA, Tatsuya
IPC分类号： H01R13/24 , H01R12/57 , H01R12/71 , H01R13/40 , H01R101/00 , H01R43/20 , H01R43/02

10. 发明公开

EP3425744A1 CONTACT 有权
公开(公告)号：EP3425744A1
公开(公告)日：2019-01-09
申请号：EP17760136.6
申请日：2017-03-02
申请人： Kitagawa Industries Co., Ltd.
发明人： NAKAMURA, Tatsuya , UENO, Kazushige
IPC分类号： H01R13/24 , H01R12/57
摘要： The contact includes a base portion, a contact portion, and a spring portion integrally molded with a thin metal plate. The spring portion includes a first bending portion, a flat plate portion, and a second bending portion. The first bending portion is bent such that a first surface of the thin plate is on an outer peripheral side, and the second bending portion is bent such that a second surface of the thin plate is on an outer peripheral side. The thin plate has a thickness t of from 0.10 to 0.15 mm, a curvature radius R1 of the first bending portion is from 0.6 to 1.0 mm, and a ratio L/R1 of a length L between the first bending portion and the second bending portion of the flat plate portion to the curvature radius R1 is configured to satisfy 0

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