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    • 1. 发明公开
    • Chip resistor
    • 芯片Widerstand
    • EP0795878A2
    • 1997-09-17
    • EP97104176.9
    • 1997-03-12
    • Kamaya Electric Co., Ltd.
    • Tohyama, Hideshi
    • H01C1/14H01C17/22
    • H01C17/22H01C1/14H05K3/3442H05K2201/09045H05K2201/09954H05K2201/10568H05K2201/10636Y02P70/611Y02P70/613
    • A chip resistor (10, 20, 30, 40, 50) is disclosed including an insulated substrate (11, 21, 31, 41, 51) having two opposed faces and two opposed ends, a resistor portion (12, 22, 32, 42, 52) formed on one of the two faces of the insulated substrate, a pair of electrode portions (13, 23, 33, 43, 53) each formed on one of the two opposed ends and both of the two faces of the insulated substrate, and coupled to opposite ends of the resistor portion, the chip resistor being adapted for mounting on a printed circuit board including a pair of lands and a protective coating therebetween with a raised portion, wherein each of the pair of electrode portions projects on both of the two faces of the insulated substrate so that the difference in height between the electrode portion and the other portions is larger than the difference in height between the land and the raised portion of the protective coating on both of the two faces.
    • 公开了一种片状电阻器(10,20,30,40,50),其包括具有两个相对面和两个相对端的绝缘衬底(11,21,31,41,51),电阻器部分(12,22,32, 42,252),形成在绝缘基板的两个面之一上的一对电极部分(13,23,33,43,53),每对电极部分分别形成在两个相对端中的一个上, 衬底,并且耦合到电阻器部分的相对端,芯片电阻器适于安装在包括一对焊盘的印刷电路板和其间具有凸起部分的保护涂层,其中该对电极部分中的每一个在两者上突出 使得电极部分和其它部分之间的高度差大于两个面上的保护涂层的焊盘和凸起部分之间的高度差。