专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP1295682A1 ABRASIVE MATERIAL 有权
标题翻译： SCHLEIFMATERIAL
公开(公告)号：EP1295682A1
公开(公告)日：2003-03-26
申请号：EP01934382.1
申请日：2001-05-29
申请人： JSR Corporation
发明人： HASEGAWA, Kou JSR Corporation , SATOU, Hozumi JSR Corporation , ISHIKAWA, Osamu JSR Corporation , HOSAKA, Yukio JSR Corporation
IPC分类号： B24D3/20 , B24D3/00
CPC分类号： B24B37/245 , B24B37/24 , B24D3/28 , B24D11/001 , B24D18/0009 , C09K3/1454
摘要： An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the abrasive are contained. A polishing part constituting the polishing body in the invention is produced obtained by loading predetermined amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, α-methylstyrenedimer, and t-dodecylmercaptan in an autoclave, making the mixture react for 16 hours at 75°C to obtain an emulsion wherein a copolymer is dispersed, adjusting this emulsion to pH8.5, incorporating cerium oxide powder with an average primary particle diameter of 0.3µm and stirring to obtain an aqueous dispersion, drying this aqueous dispersion by spreading it thinly across a film, and mold pressing the dried product obtained. The above-mentioned polishing part may have a crosslinked structure. The polishing body in the invention can be used favorably in a polishing pad and the like, for polishing the surface of a semiconductor wafer or the like.
摘要翻译：本发明的目的是提供一种抛光体，其中研磨体中的磨料非常分散，在抛光过程中提供稳定的抛光性能，并且即使在大的情况下也能有效地减少划痕的发生含有磨料的数量。通过在高压釜中加载预定量的丁二烯，苯乙烯，甲基丙烯酸甲酯，衣康酸，丙烯酸，α-甲基苯乙炔二酸酯和叔十二烷基硫醇，制得本发明中构成抛光体的抛光部分，使混合物反应16小时在75℃下得到其中分散共聚物的乳液，将该乳液调节至pH8.5，并加入平均初级粒径为0.3μm的二氧化铈粉末并搅拌，得到水分散体，通过涂布干燥该水性分散体薄膜穿过薄膜，模压所得到的干燥产品。上述抛光部分可以具有交联结构。本发明的研磨体可以在抛光垫等中有利地使用，用于研磨半导体晶片等的表面。

IPRDB

热门服务

关于我们

友情链接

联系方式