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1. 发明公开

EP0742681A3 Circuit card having a large module strain relief and heat sink support 失效
标题翻译： Leiterplatte mit Spannungsentlastungfüreinen grossen Modul undWärmesenketräger
公开(公告)号：EP0742681A3
公开(公告)日：1998-03-04
申请号：EP96480042.9
申请日：1996-04-04
申请人： International Business Machines Corporation
发明人： Isaacs, Phillip , Swain, Miles
IPC分类号： H05K1/18 , H05K1/02 , H05K7/20
CPC分类号： H05K7/1452 , H05K1/0271 , H05K1/0284 , H05K3/0058 , H05K3/301 , H05K2201/09045 , H05K2201/10689 , H05K2201/2009
摘要： A circuit card having module strain relief and heat sink support is provided. The circuit card comprises a printed circuit board having a front and a back, a module mounted to the front of the printed circuit board, and a stiffening structure mounted to the back of the printed circuit card directly opposite from the module to provide rigidity to the printed circuit board. The module has a plurality of electrical leads making electrical connection with the printed circuit board and anchoring the module to the printed circuit board. The stiffening structure is coextensive with the plurality of electrical leads along the printed circuit board, and is of sufficient thickness and strength to resist flexure of an area of the printed circuit board in contact with the stiffening structure in response to shock and vibration applied to the module.
摘要翻译：具有模块应变消除的电路卡包括具有正面和背面的印刷电路板以及在所有侧面上封闭的单个模块。它具有与印刷电路板电连接并将模块直接锚定到印刷电路板前部的一系列电连接。加强结构为印刷电路板提供刚性，该印刷电路板安装到印刷电路卡背面的与安装在电路卡前面的模块正对面的部分接触。加强结构与电连接共同延伸，具有足够的厚度和强度，以抵抗印刷电路板与加强结构接触的部分的弯曲，以响应于施加到模块的冲击和振动。散热器与模块接触。间隔装置在第一端处附接到散热器并且在与第一端相对的第二端附接到加强结构，以用于向散热器提供支撑。

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