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1. 发明公开

EP0525217A1 Carrier for electronic components 失效
标题翻译： Trägerfürelektronische Komponenten。
公开(公告)号：EP0525217A1
公开(公告)日：1993-02-03
申请号：EP91111737.2
申请日：1991-07-15
申请人： International Business Machines Corporation
发明人： Auber, Roland , Deegen, Axel, Dipl.-Ing. , Frick, Helmut, Dipl.-Ing. , Gruber, Harald W. , Horbach, Heinz-G., Dipl.-Ing. , Stadler, Ewald E., Dipl.-Ing.
IPC分类号： H05K7/06
CPC分类号： H05K7/06 , H05K1/0287 , H05K1/0289 , H05K2203/175
摘要： 5 n7 A carrier on which electronic components (14) and electrical circuits (18, 20) are mounted and connected. The carrier comprises a wire mesh or web (8) which is used as a basic material for a number of applications. For organically or inorganically wires, electrically conductive material or super conducting fibers may be used. The wires may be fabricated as a web or an X/Y layer. The chip can be directly mounted on a mesh of insulated conductive wires. This eliminates one complete packaging level (module) and replaces the complex printed circuit card/board by a simple wire mesh. Personalized X/Y wiring for signals and voltage is accomplished by interconnecting the wire crossings (22) as required and by deleting stubs. Depending upon the diameter of the wires used, more than one wire may be required for providing sufficient power to the chip. The mesh may be assembled on a stiffener with tabs to interconnect with other components or be used directly as a cable. Chip-to-wire interconnection are obtained by removing the insulation and by soldering the chip to the wire. The web may also be fixed to a board or by an appropriate frame. Further disclosed is a method for manufacturing the new carrier and a system comprising the carrier.
In addition to affording high-quality components, alternative manufacturing techniques allow using the advantages of CIM (Computer Integrated Manufacturing), CFM (Continuous Flow Manufacturing), TAT (Tape Auto Testing), lot size = 1, and ECs (engineering changes)/repairs. CFM and TAT concepts are realized by reducing the manufacturing steps to about one third the number presently needed. In addition, most steps are not as complicated and expensive as the classical ones used to produce printed circuit boards.
摘要翻译：电子部件（14）和电路（18,20）安装并连接的载体。载体包括用作许多应用的基本材料的丝网或网（8）。对于有机或无机导线，可以使用导电材料或超导纤维。导线可以制成网状物或X / Y层。芯片可以直接安装在绝缘导线网上。这消除了一个完整的封装水平（模块），并通过简单的金属丝网代替复杂的印刷电路板/板。用于信号和电压的个性化X / Y布线是通过根据需要互连电线交叉（22）和通过删除短截线实现的。根据所使用的电线的直径，可能需要多于一根电线来为芯片提供足够的电力。网可以组装在具有突出部的加强件上以与其他部件互连或者直接用作电缆。通过去除绝缘体并通过将芯片焊接到导线上获得芯片到线路互连。网也可以固定到板或适当的框架上。还公开了一种用于制造新载体的方法和包括该载体的系统。除了提供高质量的组件外，替代制造技术还可以使用CIM（计算机集成制造），CFM（连续流程制造），TAT（磁带自动测试），批量大小= 1和EC（工程变更）/ 维修。 CFM和TAT概念通过将制造步骤减少到现在所需数量的三分之一来实现。此外，大多数步骤不像用于生产印刷电路板的经典步骤那么复杂和昂贵。

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