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1. 发明公开

EP4171186A1 POWER SUPPLY ENCLOSURE, POWER SUPPLY CONVERSION APPARATUS, AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：EP4171186A1
公开(公告)日：2023-04-26
申请号：EP22201870.7
申请日：2022-10-17
申请人： Huawei Digital Power Technologies Co., Ltd.
发明人： DU, Lin , FAN, Guohua , ZHANG, Bo
IPC分类号： H05K7/20
摘要： This application provides a power supply enclosure, a power supply conversion apparatus, and an electronic device. The power supply enclosure includes a housing and a fixing plate. The housing has an accommodation cavity, and a first flow channel is disposed in the housing. The fixing plate is located in the accommodation cavity, at least a part of a surface of the fixing plate that faces the housing is fixedly connected to at least a part of an inner surface of the housing, and the fixing plate is configured to fix a power supply conversion functional assembly, so as to perform heat dissipation on a heat generating component in the power supply conversion functional assembly by using a cooling fluid in the first flow channel. A manner of face-to-face connection between the surface of the fixing plate and the surface of the housing in the power supply enclosure has a large connection area, and higher connection stability. This can improve stability of fixed connection between the power supply conversion functional assembly and the housing.

2. 发明公开

EP4404702A1 VEHICLE-MOUNTED POWER SUPPLY APPARATUS AND VEHICLE 审中-实审
公开(公告)号：EP4404702A1
公开(公告)日：2024-07-24
申请号：EP23220704.3
申请日：2023-12-29
申请人： Huawei Digital Power Technologies Co., Ltd.
发明人： LIU, Yuting , DU, Lin , LIU, Shaolong
IPC分类号： H05K7/14 , H05K7/20
CPC分类号： H05K7/20927 , H05K7/14322
摘要： This application provides a vehicle-mounted power supply apparatus and a vehicle. The vehicle-mounted power supply apparatus includes a power conversion circuit, an upper-layer PCB board, a lower-layer PCB board, a bottom cover, and a radiator. The upper-layer PCB board and the lower-layer PCB board are configured to bear a plurality of power switching transistors of the power conversion circuit, so that the power conversion circuit is distributed more flexibly. The lower-layer PCB board and a plurality of transformers are fastened to a bottom plate of the bottom cover, and cooled by heat dissipation through a lower-layer cooling channel in the bottom cover. The upper-layer PCB board and the radiator are sequentially stacked above the lower-layer PCB board and the plurality of transformers, and cooled by heat dissipation through an upper-layer cooling channel in the radiator. The upper-layer cooling channel and the lower-layer cooling channel in the bottom cover communicate with each other through a side wall of the bottom cover. This improves a heat dissipation effect and temperature uniformity of the vehicle-mounted power supply apparatus.

3. 发明公开

EP4404700A1 VEHICLE-MOUNTED POWER SUPPLY APPARATUS AND VEHICLE 审中-实审
公开(公告)号：EP4404700A1
公开(公告)日：2024-07-24
申请号：EP23218515.7
申请日：2023-12-20
申请人： Huawei Digital Power Technologies Co., Ltd.
发明人： DU, Lin , LI, Ping , FENG, Ningbo , LIANG, Tao , LIU, Yuting
IPC分类号： H05K7/14
CPC分类号： H05K7/20927 , H05K7/14322 , H05K9/0024
摘要： This application provides a vehicle-mounted power supply apparatus and a vehicle. The vehicle-mounted power supply apparatus includes a power conversion circuit, and an upper-layer PCB, a lower-layer PCB, and a heat sink that are stacked in and fastened to a bottom housing. The heat sink, the upper-layer PCB, and the lower-layer PCB are stacked, so that internal space occupied in the vehicle-mounted power supply apparatus can be reduced. In addition, these components are fastened to the bottom housing, so that structural strength of the vehicle-mounted power supply apparatus is strong. The power conversion circuit receives external power supply through a power port, outputs a first direct current through a first direct current port, and outputs a second direct current through a second direct current port. The lower-layer PCB is electrically connected to the first direct current port, and the upper-layer PCB is electrically connected to the second direct current port and the power port. The upper-layer PCB and the lower-layer PCB that are stacked are electrically connected to different ports separately Compared with a solution in which the different ports are electrically connected to one PCB, electrical port arrangement is more flexible, so that safety of electrical isolation of the vehicle-mounted power supply apparatus is higher

4. 发明公开

EP4429428A1 PACKAGING STRUCTURE 审中-实审
公开(公告)号：EP4429428A1
公开(公告)日：2024-09-11
申请号：EP23794917.7
申请日：2023-03-28
申请人： Huawei Digital Power Technologies Co., Ltd.
发明人： CUI, Zhaoxue , LIU, Ren , DU, Lin , LIANG, Tao , LI, Ping
IPC分类号： H05K7/20 , H02M1/00
CPC分类号： H05K7/20 , H02M1/00
摘要： A packaging structure is provided, and may include a housing and a power component. The power component is disposed inside the housing. The housing may include a top cover and a bottom housing. The top cover and the bottom housing are connected to form the housing. The top cover may have a first heat transfer medium channel inside. The bottom housing may have a second heat transfer medium channel inside. The first heat transfer medium channel and the second heat transfer medium channel are separately configured to communicate with an external heat dissipation circulation system. The power component may include a first circuit board and a second circuit board. The first circuit board and the second circuit board may be disposed opposite to each other. The first circuit board may be disposed on the top cover, and the second circuit board may be disposed on the bottom housing. At least one first heating device may be disposed on the first circuit board. The first heating device may press against an inner wall of the top cover. At least one second heating device may be disposed on the second circuit board, and the second heating device may press against an inner wall of the bottom housing. When the foregoing structure is used, high power density and high heat dissipation efficiency can be achieved.

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